公开(公告)号：US07479397B2

公开(公告)日：2009-01-20

申请号：US11605387

申请日：2006-11-29

申请人： Shuan Ta Liu

发明人： Shuan Ta Liu

IPC分类号： H01L21/00

CPC分类号： H01L31/0203 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/1469 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： An optoelectronics processing module includes a transparent substrate and at least one optoelectronics component. One surface of the transparent substrate is formed with a plurality of first pads and a plurality of second pads. The optoelectronics component mounted on the transparent substrate has a plurality of connecting pads, which is irradiated with a laser beam and is then connected with the first pads.

摘要翻译： 光电子处理模块包括透明基板和至少一个光电子部件。 透明基板的一个表面形成有多个第一焊盘和多个第二焊盘。 安装在透明基板上的光电子部件具有多个连接焊盘，其被激光束照射，然后与第一焊盘连接。

公开(公告)号：US07329055B2

公开(公告)日：2008-02-12

申请号：US10950495

申请日：2004-09-28

申请人： Shuan Ta Liu

发明人： Shuan Ta Liu

IPC分类号： G02B6/36

CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L27/14634 ,  H01L27/1464 ,  H01L31/0232 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K1/182 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： An optoelectronics processing module includes a transparent substrate and at least one optoelectronics component. One surface of the transparent substrate is formed with a plurality of first pads and a plurality of second pads. The optoelectronics component mounted on the transparent substrate has a plurality of connecting pads, which is irradiated with a laser beam and is then connected with the first pads.

摘要翻译： 光电子处理模块包括透明基板和至少一个光电子部件。 透明基板的一个表面形成有多个第一焊盘和多个第二焊盘。 安装在透明基板上的光电子部件具有多个连接焊盘，其被激光束照射，然后与第一焊盘连接。

公开(公告)号：US07098076B2

公开(公告)日：2006-08-29

申请号：US10856796

申请日：2004-06-01

申请人： Shuan Ta Liu

发明人： Shuan Ta Liu

IPC分类号： H01L21/50

CPC分类号： H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/05599

摘要： A flip-chip attach method includes the steps of: attaching a chip on a transparent substrate such that each connecting pad of the chip is aligned with each electrical connection pad on the transparent substrate; and irradiating each connecting pad and each electrical connection pad from a side of the transparent substrate with a laser beam so as to weld the connecting pad to the electrical connection pad. Furthermore, the invention also provides a flip-chip attach structure including a transparent substrate and at least one chip. A surface of the transparent substrate is formed with a plurality of electrical connection pads, and the chip has a plurality of connecting pads. The connecting pads and the electrical connection pads are irradiated with a laser beam and are welded to each other. Thus, the chip is mounted to the transparent substrate.

摘要翻译： 倒装芯片连接方法包括以下步骤：将芯片附接在透明基板上，使得芯片的每个连接焊盘与透明基板上的每个电连接焊盘对准; 并且用激光束从透明基板的一侧照射每个连接焊盘和每个电连接焊盘，以将连接焊盘焊接到电连接焊盘。 此外，本发明还提供一种倒装芯片连接结构，其包括透明基板和至少一个芯片。 透明基板的表面形成有多个电连接焊盘，并且芯片具有多个连接焊盘。 连接焊盘和电连接焊盘用激光束照射并彼此焊接。 因此，芯片安装在透明基板上。