摘要:
Multiple trench depths within an integrated circuit device are formed by first forming trenches in a substrate to a first depth, but of varying widths. Formation of a dielectric layer can cause some of the trenches to fill or close off while leaving other, wider trenches open. Removal of a portion of the dielectric material can then be tailored to expose a bottom of the open trenches while leaving remaining trenches filled. Removal of exposed portions of the underlying substrate can then be used to selectively deepen the open trenches, which can subsequently be filled. Such methods can be used to form trenches of varying depths without the need for subsequent masking.
摘要:
Multiple trench depths within an integrated circuit device are formed by first forming trenches in a substrate to a first depth, but of varying widths. Formation of a dielectric layer can cause some of the trenches to fill or close off while leaving other, wider trenches open. Removal of a portion of the dielectric material can then be tailored to expose a bottom of the open trenches while leaving remaining trenches filled. Removal of exposed portions of the underlying substrate can then be used to selectively deepen the open trenches, which can subsequently be filled. Such methods can be used to form trenches of varying depths without the need for subsequent masking.
摘要:
Multiple trench depths within an integrated circuit device are formed by first forming trenches in a substrate to a first depth, but of varying widths. Formation of a dielectric layer can cause some of the trenches to fill or close off while leaving other, wider trenches open. Removal of a portion of the dielectric material can then be tailored to expose a bottom of the open trenches while leaving remaining trenches filled. Removal of exposed portions of the underlying substrate can then be used to selectively deepen the open trenches, which can subsequently be filled. Such methods can be used to form trenches of varying depths without the need for subsequent masking.
摘要:
A semiconductor device is provided that includes a fin having a first gate and a second gate formed on a first sidewall of the fin in a first trench, wherein the first gate is formed above the second gate. The device includes a third gate and a fourth gate formed on a second sidewall of the fin in a second trench, wherein the third gate is formed above the fourth gate. Methods of manufacturing and operating the device are also included. A method of operation may include biasing the first gate and the fourth gate to create a current path across the fin.
摘要:
A memory array is provided that includes a transistor having two active gates sharing a source, a drain, and a channel of the transistor. One of the active gates may be coupled to a volatile memory portion of a memory cell, such as a DRAM cell, and the other active gate may be coupled to a non-volatile memory portion, for example, a charge storage node such as a SONOS cell. Methods of operating the memory array are provided that include transferring data from the volatile memory portions to the non-volatile memory portions, transferring data from the non-volatile memory portions to the volatile memory portions, and erasing the non-volatile memory portions of a row of memory cells.
摘要:
Embodiments are described for a voltage compensated sense amplifier. One such sense amplifier includes a pair of digit line nodes respectively coupled to a pair of transistors. A first pair of switches are adapted to cross-couple the gates of the transistors to the respective digit line node and a second pair of switches are adapted to couple the gates of the transistors to a voltage supply. The first and second pair of switches are coupled to respective gates of the transistors independent of the pair of transistors being respectively coupled to the digit line nodes.
摘要:
A memory device includes isolation trenches that are formed generally parallel to and along associated strips of active area. A conductive bit line is recessed within each isolation trench such that the uppermost surface of the bit line is recessed below the uppermost surface of the base substrate. A bit line contact strap electrically couples the bit line to the active area both along a vertical dimension of the bit line strap and along a horizontal dimension across the uppermost surface of the base substrate.
摘要:
A system and method for sensing a data state stored by a memory cell that includes coupling a first digit line and a second digit line to a precharge voltage and further coupling a memory cell to the first digit line. At least one digit line other than the first and second digit lines is driven to a reference voltage level and the at least one digit line is coupled to the second digit line to establish a reference voltage in the second digit line. A voltage differential is sensed between the first digit line and the second digit line, and a data state based on the voltage differential is latched in response.
摘要:
A system and method for coupling read data signals and write data signals through I/O lines of a memory array. Precharge circuits precharge alternating signal lines to high and low precharge voltages. An accelerate high circuit coupled to each of the I/O lines that has been precharged low detects an increase in the voltage of the I/O line above the precharge low voltage. The accelerate high circuit then drives the I/O line toward a high voltage, such as VCC. Similarly, an accelerate low circuit coupled to each of the I/O lines that has been precharged high detects a decrease in the voltage of the I/O line below the precharge high voltage. The accelerate low circuit then drives the I/O line to a low voltage, such as ground.
摘要:
The required refresh rate of a DRAM is reduced by biasing active digit lines to a slight positive voltage to reduce the sub threshold current leakage of access transistors in memory cells that are not being accessed. The slight positive voltage is provided by a voltage regulator circuit using one or more bipolar transistors fabricated in a well that electrically isolates the bipolar transistors from the remainder of the substrate. The voltage provided by the voltage regulator is preferably coupled to the access transistors by powering each of the n-sense amplifiers in the DRAM with the voltage from the voltage regulator.