CHAMFERED SILICON CARBIDE SUBSTRATE AND METHOD OF CHAMFERING

    公开(公告)号:US20230078982A1

    公开(公告)日:2023-03-16

    申请号:US17976191

    申请日:2022-10-28

    Applicant: SiCrystal GmbH

    Abstract: The present invention relates to a chamfered silicon carbide substrate which is essentially monocrystalline, and to a corresponding method of chamfering a silicon carbide substrate. A silicon carbide substrate according to the invention comprises a main surface (102), wherein an orientation of said main surface (102) is such that a normal vector ({right arrow over (O)}) of the main surface (102) includes a tilt angle with a normal vector ({right arrow over (N)}) of a basal lattice plane (106) of the substrate, and a chamfered peripheral region (110), wherein a surface of the chamfered peripheral region includes a bevel angle with said main surface, wherein said bevel angle is chosen so that, in more than 75% of the peripheral region, normal vectors ({right arrow over (F)}_i) of the chamfered peripheral region (110) differ from the normal vector of the basal lattice plane by less than a difference between the normal vector of the main surface and the normal vector of the basal lattice plane of the substrate.

    Chamfered silicon carbide substrate and method of chamfering

    公开(公告)号:US11515140B2

    公开(公告)日:2022-11-29

    申请号:US16409706

    申请日:2019-05-10

    Applicant: SiCrystal GmbH

    Abstract: The present invention relates to a chamfered silicon carbide substrate which is essentially monocrystalline, and to a corresponding method of chamfering a silicon carbide substrate. A silicon carbide substrate according to the invention comprises a main surface (102), wherein an orientation of said main surface (102) is such that a normal vector ({right arrow over (O)}) of the main surface (102) includes a tilt angle with a normal vector ({right arrow over (N)}) of a basal lattice plane (106) of the substrate, and a chamfered peripheral region (110), wherein a surface of the chamfered peripheral region includes a bevel angle with said main surface, wherein said bevel angle is chosen so that, in more than 75% of the peripheral region, normal vectors ({right arrow over (F)}_i) of the chamfered peripheral region (110) differ from the normal vector of the basal lattice plane by less than a difference between the normal vector of the main surface and the normal vector of the basal lattice plane of the substrate.

    SiC crystals with an optimal orientation of lattice planes for fissure reduction and method of producing same

    公开(公告)号:US12195878B2

    公开(公告)日:2025-01-14

    申请号:US17380690

    申请日:2021-07-20

    Applicant: SiCrystal GmbH

    Abstract: The present invention provides monocrystalline 4H—SiC semi-finished products having a specific orientation of its crystal structure which is set such as to reduce or even eliminate the occurrence of cracks or fissures during mechanical processing, and method of producing same. The monocrystalline 4H—SiC semi-finished product, which has a longitudinal axis and an at least partially curved lateral surface parallel to said longitudinal axis, is characterized in that the crystal structure of the 4H—SiC semi-finished product is oriented with respect to the longitudinal axis such that at each position on the lateral surface of the semi-finished product there is a line segment which is intersected by at least a predetermined minimum number of parallel cleavage planes of the {1010} form per unit length, wherein the line segment is defined by a plane tangent to the lateral surface at said position.

    Silicon carbide substrate and method of growing SiC single crystal boules

    公开(公告)号:US11236438B2

    公开(公告)日:2022-02-01

    申请号:US16492044

    申请日:2018-03-07

    Applicant: SICRYSTAL GMBH

    Abstract: The present invention relates to a silicon carbide (SiC) substrate with improved mechanical and electrical characteristics. Furthermore, the invention relates to a method for producing a bulk SiC crystal in a physical vapor transport growth system. The silicon carbide substrate comprises an inner region (102) which constitutes at least 30% of a total surface area of said substrate (100), a ring shaped peripheral region (104) radially surrounding the inner region (102), wherein a mean concentration of a dopant in the inner region (102) differs by at maximum 5·1018 cm−3, preferably 1·1018 cm−3, from the mean concentration of this dopant in the peripheral region (104).

    Silicon carbide substrate and method of growing SiC single crystal boules

    公开(公告)号:US11781245B2

    公开(公告)日:2023-10-10

    申请号:US17544868

    申请日:2021-12-07

    Applicant: SICRYSTAL GMBH

    CPC classification number: C30B29/36 C30B23/00

    Abstract: The present invention relates to a silicon carbide (SiC) substrate with improved mechanical and electrical characteristics. Furthermore, the invention relates to a method for producing a bulk SiC crystal in a physical vapor transport growth system. The silicon carbide substrate comprises an inner region (102) which constitutes at least 30% of a total surface area of said substrate (100), a ring shaped peripheral region (104) radially surrounding the inner region (102), wherein a mean concentration of a dopant in the inner region (102) differs by at maximum 5·1018 cm−3, preferably 1·1018 cm−3, from the mean concentration of this dopant in the peripheral region (104).

    SIC CRYSTALS WITH AN OPTIMAL ORIENTATION OF LATTICE PLANES FOR FISSURE REDUCTION AND METHOD OF PRODUCING SAME

    公开(公告)号:US20220025546A1

    公开(公告)日:2022-01-27

    申请号:US17380690

    申请日:2021-07-20

    Applicant: SiCrystal GmbH

    Abstract: The present invention provides monocrystalline 4H—SiC semi-finished products having a specific orientation of its crystal structure which is set such as to reduce or even eliminate the occurrence of cracks or fissures during mechanical processing, and method of producing same. The monocrystalline 4H—SiC semi-finished product, which has a longitudinal axis and an at least partially curved lateral surface parallel to said longitudinal axis, is characterized in that the crystal structure of the 4H—SiC semi-finished product is oriented with respect to the longitudinal axis such that at each position on the lateral surface of the semi-finished product there is a line segment which is intersected by at least a predetermined minimum number of parallel cleavage planes of the {1010} form per unit length, wherein the line segment is defined by a plane tangent to the lateral surface at said position.

    SIC CRYSTALLINE SUBSTRATES WITH AN OPTIMAL ORIENTATION OF LATTICE PLANES FOR FISSURE REDUCTION AND METHOD OF PRODUCING SAME

    公开(公告)号:US20220025545A1

    公开(公告)日:2022-01-27

    申请号:US17380607

    申请日:2021-07-20

    Applicant: SiCrystal GmbH

    Abstract: The present invention provides monocrystalline 4H—SiC substrates having a specific orientation of its crystal structure which is set such as to reduce or even eliminate the occurrence of cracks or fissures during mechanical processing, and method of producing same. The monocrystalline 4H—SiC substrate, which has a longitudinal axis and an at least partially curved lateral surface parallel to said longitudinal axis, is characterized in that the crystal structure of the 4H—SiC substrate is oriented with respect to the longitudinal axis such that at each position on the lateral surface of the semi-finished product there is a line segment which is intersected by at least a predetermined minimum number of parallel cleavage planes of the {1010} form per unit length, wherein the line segment is defined by a plane tangent to the lateral surface at said position.

Patent Agency Ranking