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公开(公告)号：US09455159B2
公开(公告)日：2016-09-27
申请号：US14866106
申请日：2015-09-25
发明人： Wei-Ping Wang , Pang-Chun Lin , Chin-Chih Hsiao , Kuan-I Cheng , Cheng-Wen Chiu
IPC分类号： H01L21/48 , H01L23/498 , H01L21/56 , H01L23/31 , H01L23/00
CPC分类号： H01L21/4857 , H01L21/4846 , H01L21/56 , H01L23/3121 , H01L23/49822 , H01L24/48 , H01L24/85 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for fabricating a packaging substrate includes: providing a carrier having a first metal layer and a second metal layer formed on the first metal layer; forming a first circuit layer on the second metal layer and forming a separating portion on an edge of the second metal layer such that the separating portion is spaced from the first circuit layer; forming a dielectric layer on the second metal layer and the first circuit layer such that the first circuit layer and the separating portion are embedded in the dielectric layer and portions of the dielectric layer are formed between the first circuit layer and the separating portion; forming a second circuit layer on the dielectric layer; and applying forces on the separating portion so as to remove the first metal layer and the carrier, thereby maintaining the integrity of the first circuit layer.
摘要翻译： 一种用于制造封装衬底的方法，包括：提供具有形成在第一金属层上的第一金属层和第二金属层的载体; 在所述第二金属层上形成第一电路层，并在所述第二金属层的边缘上形成分离部分，使得所述分离部分与所述第一电路层隔开; 在所述第二金属层和所述第一电路层上形成介电层，使得所述第一电路层和所述分离部分嵌入在所述电介质层中，并且所述电介质层的部分形成在所述第一电路层与所述分离部之间; 在所述电介质层上形成第二电路层; 并且在分离部分上施加力以便去除第一金属层和载体，从而保持第一电路层的完整性。
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公开(公告)号：US20160013074A1
公开(公告)日：2016-01-14
申请号：US14866106
申请日：2015-09-25
发明人： Wei-Ping Wang , Pang-Chun Lin , Chin-Chih Hsiao , Kuan-I Cheng , Cheng-Wen Chiu
CPC分类号： H01L21/4857 , H01L21/4846 , H01L21/56 , H01L23/3121 , H01L23/49822 , H01L24/48 , H01L24/85 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for fabricating a packaging substrate includes: providing a carrier having a first metal layer and a second metal layer formed on the first metal layer; forming a first circuit layer on the second metal layer and forming a separating portion on an edge of the second metal layer such that the separating portion is spaced from the first circuit layer; forming a dielectric layer on the second metal layer and the first circuit layer such that the first circuit layer and the separating portion are embedded in the dielectric layer and portions of the dielectric layer are formed between the first circuit layer and the separating portion; forming a second circuit layer on the dielectric layer; and applying forces on the separating portion so as to remove the first metal layer and the carrier, thereby maintaining the integrity of the first circuit layer.
摘要翻译： 一种用于制造封装衬底的方法，包括：提供具有形成在第一金属层上的第一金属层和第二金属层的载体; 在所述第二金属层上形成第一电路层，并在所述第二金属层的边缘上形成分离部分，使得所述分离部分与所述第一电路层隔开; 在所述第二金属层和所述第一电路层上形成介电层，使得所述第一电路层和所述分离部分嵌入在所述电介质层中，并且所述电介质层的部分形成在所述第一电路层与所述分离部之间; 在所述电介质层上形成第二电路层; 并且在分离部分上施加力以便去除第一金属层和载体，从而保持第一电路层的完整性。
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