Method of fabricating nitride-based compound layer, GaN Substrate and vertical structure nitride-based semiconductor light emitting device
    3.
    发明申请
    Method of fabricating nitride-based compound layer, GaN Substrate and vertical structure nitride-based semiconductor light emitting device 有权
    氮化物类化合物层的制造方法,GaN衬底和垂直结构氮化物系半导体发光元件

    公开(公告)号:US20060286777A1

    公开(公告)日:2006-12-21

    申请号:US11471697

    申请日:2006-06-21

    IPC分类号: H01L21/20

    摘要: In a method for fabricating a nitride-based compound layer, first, a GaN substrate is prepared. A mask layer with a predetermined pattern is formed on the GaN substrate to expose a partial area of the GaN substrate. Then a buffer layer is formed on the partially exposed GaN substrate. The buffer layer is made of a material having a 10% or less lattice mismatch with GaN. Thereafter, the nitride-based compound is grown laterally from a top surface of the buffer layer toward a top surface of the mask layer and the nitride-based compound layer is vertically grown to a predetermined thickness. Also, the mask layer and the buffer layer are removed via wet-etching to separate the nitride-based compound layer from the GaN substrate.

    摘要翻译: 在制造氮化物类化合物层的方法中,首先制备GaN衬底。 在GaN衬底上形成具有预定图案的掩模层,以暴露GaN衬底的部分区域。 然后在部分曝光的GaN衬底上形成缓冲层。 缓冲层由具有10%以下与GaN的晶格失配的材料制成。 此后,氮化物类化合物从缓冲层的顶表面朝向掩模层的顶表面横向生长,并且氮化物基化合物层垂直生长至预定厚度。 此外,通过湿蚀刻除去掩模层和缓冲层,以将氮化物基化合物层与GaN衬底分离。

    Wavelength-convertible light emitting diode package
    4.
    发明申请
    Wavelength-convertible light emitting diode package 审中-公开
    波长可转换发光二极管封装

    公开(公告)号:US20070012940A1

    公开(公告)日:2007-01-18

    申请号:US11484758

    申请日:2006-07-12

    IPC分类号: H01L33/00

    摘要: The invention relates to a wavelength-convertible LED package including a package substrate having a lead frame, and an LED mounted on the package substrate and electrically connected to the lead frame. The wavelength-convertible LED package also includes a low refractive index region surrounding the LED, having a first refractive index, and a high refractive index layer formed on the low refractive index region, having a rough pattern on an upper surface thereof and a second refractive index higher than the first refractive index. The wavelength-convertible LED package further includes a resin part containing phosphor for converting the wavelength of light emitted from the LED, having a third refractive index lower than the second refractive index.

    摘要翻译: 本发明涉及一种波长可转换的LED封装,其包括具有引线框架的封装基板和安装在封装基板上并电连接到引线框架上的LED。 波长可变的LED封装还包括围绕LED的低折射率区域,具有第一折射率和形成在低折射率区域上的高折射率层,在其上表面上具有粗糙图案,并且具有第二折射率区域 指数高于第一折射率。 波长可变换LED封装还包括含有荧光体的树脂部分,用于转换从LED发射的光的波长,其具有低于第二折射率的第三折射率。

    WHITE LIGHT EMITTING DEVICE
    7.
    发明申请
    WHITE LIGHT EMITTING DEVICE 失效
    白光发光装置

    公开(公告)号:US20120223660A1

    公开(公告)日:2012-09-06

    申请号:US13474240

    申请日:2012-05-17

    IPC分类号: H05B33/14

    摘要: A white light emitting device includes a structure for emitting white light having at least four wavelengths by using two or less LEDs, where the LEDs include a blue/green LED emitting blue and green wavelengths of light. The device also includes means for emitting red wavelength of light.

    摘要翻译: 白色发光器件包括通过使用两个或更少的LED发射具有至少四个波长的白光的结构,其中LED包括发射蓝色和绿色波长的光的蓝/绿LED。 该装置还包括用于发射红色波长的光的装置。

    Method for manufacturing a facet extraction LED
    8.
    发明授权
    Method for manufacturing a facet extraction LED 有权
    制造小面提取LED的方法

    公开(公告)号:US07998767B2

    公开(公告)日:2011-08-16

    申请号:US12704570

    申请日:2010-02-12

    IPC分类号: H01L21/00

    CPC分类号: H01L33/20

    摘要: A facet extraction LED improved in light extraction efficiency and a manufacturing method thereof. A substrate is provided. A light emitting part includes an n-type semiconductor layer, an active layer and a p-type semiconductor layer sequentially stacked on the substrate. A p-electrode and an n-electrode are connected to the p-type semiconductor layer and the n-type semiconductor layer, respectively. The p- and n-electrodes are formed on the same side of the LED. The light emitting part is structured as a ring.

    摘要翻译: 提取光提取效率的小面提取LED及其制造方法。 提供基板。 发光部包括依次层叠在基板上的n型半导体层,有源层和p型半导体层。 p电极和n电极分别连接到p型半导体层和n型半导体层。 p电极和n电极形成在LED的同一侧。 发光部分被构造为环。

    Method for fabricating group III nitride compound semiconductors and group III nitride compound semiconductor devices
    10.
    发明授权
    Method for fabricating group III nitride compound semiconductors and group III nitride compound semiconductor devices 失效
    制备III族氮化物化合物半导体和III族氮化物化合物半导体器件的方法

    公开(公告)号:US07491984B2

    公开(公告)日:2009-02-17

    申请号:US10978438

    申请日:2004-11-02

    IPC分类号: H01L21/00

    摘要: The present invention provides a Group III nitride compound semiconductor with suppressed generation of threading dislocations.A GaN layer 31 is subjected to etching, so as to form an island-like structure having a shape of, for example, dot, stripe, or grid, thereby providing a trench/mesa structure, and a mask 4 is formed at the bottom of the trench such that the upper surface of the mask 4 is positioned below the top surface of the GaN layer 31. A GaN layer 32 is lateral-epitaxially grown with the top surface 31a of the mesa and sidewalls 31b of the trench serving as nuclei, to thereby bury the trench, and then epitaxial growth is effected in the vertical direction. In the upper region of the GaN layer 32 formed above the mask 4 through lateral epitaxial growth, propagation of threading dislocations contained in the GaN layer 31 can be prevented.

    摘要翻译: 本发明提供了具有抑制的穿透位错产生的III族氮化物化合物半导体。 对GaN层31进行蚀刻,以形成具有例如点状,条状或格栅形状的岛状结构,由此提供沟槽/台面结构,并且在底部形成掩模4 使得掩模4的上表面位于GaN层31的顶表面之下。GaN层32被侧壁外延生长,台面的顶表面31a和用作核的沟槽的侧壁31b ,从而埋入沟槽,然后在垂直方向进行外延生长。 在通过横向外延生长形成在掩模4上方的GaN层32的上部区域中,可以防止包含在GaN层31中的穿透位错的传播。