公开(公告)号：US20060237714A1

公开(公告)日：2006-10-26

申请号：US11364517

申请日：2006-02-27

申请人： Soo Park ,  Dong Jung ,  Dae Shin ,  Byung Chin ,  Tae Kwon ,  Myoung Kim ,  Jong Hong

发明人： Soo Park ,  Dong Jung ,  Dae Shin ,  Byung Chin ,  Tae Kwon ,  Myoung Kim ,  Jong Hong

IPC分类号： H01L51/00 ,  C07F15/00 ,  H01J1/62

CPC分类号： H01L51/0071 ,  C07F15/0033 ,  C09K11/06 ,  C09K2211/1011 ,  C09K2211/1014 ,  C09K2211/1029 ,  C09K2211/1044 ,  C09K2211/185 ,  H01L51/0067 ,  H01L51/0085 ,  H01L51/5036 ,  H05B33/14 ,  Y10S428/917

摘要： The present embodiments relate to organic metal compounds in which compounds for host and compounds for dopant are connected, organic electroluminescence display devices using the compounds and a method for preparation of the devices. More precisely, the present embodiments relate to organic metal compounds in which compounds for host and compounds for dopant were connected to make energy transmission between host and dopant possible in a molecular level, organic electroluminescence display devices using the same and a preparation method thereof. And, the organic metal compound of the present embodiments has the structure having the connection of the compounds for host and the compounds for dopant, so that its solubility can be remarkably increased owing to the increased molecular weight. Thus, a wet process such as spin coating can be applied for the preparation of the device.

摘要翻译： 本实施例涉及其中连接用于掺杂剂的主体和化合物的化合物的有机金属化合物，使用该化合物的有机电致发光显示装置和该装置的制备方法。 更确切地说，本实施例涉及有机金属化合物，其中用于掺杂剂的主体和化合物的化合物被连接以在分子水平上使主体和掺杂剂之间的能量传输成为可能，有机电致发光显示装置及其制备方法。 并且，本实施方案的有机金属化合物具有与主体化合物和掺杂剂化合物连接的结构，由于分子量的增加，其溶解度可显着增加。 因此，可以应用诸如旋涂的湿法来制备该装置。

公开(公告)号：US20060237715A1

公开(公告)日：2006-10-26

申请号：US11364521

申请日：2006-02-27

申请人： Soo Park ,  Dae Shin ,  Dong Jung ,  Tae Kwon ,  Myoung Kim ,  Jong Hong

发明人： Soo Park ,  Dae Shin ,  Dong Jung ,  Tae Kwon ,  Myoung Kim ,  Jong Hong

IPC分类号： C07F15/00 ,  H01L29/08 ,  H01L51/00 ,  H01J1/62

CPC分类号： H05B33/14 ,  C07F15/0033 ,  C09K2211/1007 ,  C09K2211/1014 ,  C09K2211/1029 ,  C09K2211/185 ,  H01L51/0059 ,  H01L51/0081 ,  H01L51/0085 ,  H01L51/5016 ,  Y10S428/917

摘要： The present embodiments relate to organic metal compounds in which compounds for host and compounds for dopant are connected, organic electroluminescence display devices using the compounds and a method for preparation of the devices. More precisely, the present embodiments relate to organic metal compounds in which the compounds for host and the compounds for dopant are connected to make energy transmission between host and dopant possible in a molecular level, organic electroluminescence display devices using the same and a preparation method thereof. The organic metal compound of the present embodiments can be effectively used as a coloring material of photoluminescence device since it has low molecular level emitting property. Moreover, the photoluminescence device prepared by using the organic metal compound of the present embodiments has enhanced emitting efficiency, brightness, color purity and lifetime.

摘要翻译： 本实施例涉及其中连接用于掺杂剂的主体和化合物的化合物的有机金属化合物，使用该化合物的有机电致发光显示装置和该装置的制备方法。 更准确地说，本实施方式涉及有机金属化合物，其中主体化合物和掺杂剂化合物被连接以在分子水平上使主体和掺杂剂之间的能量传递成为可能，有机电致发光显示装置及其制备方法 。 本实施方案的有机金属化合物由于具有低分子量发射性能，因此可以有效地用作光致发光器件的着色材料。 此外，通过使用本实施方案的有机金属化合物制备的光致发光器件具有增强的发光效率，亮度，色纯度和寿命。

公开(公告)号：US20080061407A1

公开(公告)日：2008-03-13

申请号：US11852079

申请日：2007-09-07

申请人： Jun Yang ,  You Joo ,  Dong Jung

发明人： Jun Yang ,  You Joo ,  Dong Jung

IPC分类号： H01L23/552 ,  H01L21/60

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L23/29 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The present invention further provides methods for manufacturing the semiconductor device package

摘要翻译： 半导体器件封装包括安装并电耦合到衬底的半导体器件，将半导体器件封装在衬底的上表面的一部分上的封装体; 以及形成在封装主体上并且基本上包围半导体器件的电磁干扰屏蔽层。 本发明还提供了制造半导体器件封装的方法

公开(公告)号：US20060170096A1

公开(公告)日：2006-08-03

申请号：US11047617

申请日：2005-02-02

申请人： Jun Yang ,  You Joo ,  Dong Jung

发明人： Jun Yang ,  You Joo ,  Dong Jung

IPC分类号： H01L23/34

CPC分类号： H01L23/3114 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A chip scale package includes a patterned circuit layer attached to the active surface of a semiconductor chip through an anisotropic conductive adhesive layer such that contact pads on a lower surface of the patterned circuit layer are electrically coupled to corresponding bonding pads on the semiconductor chip. The patterned circuit layer has a plurality of openings formed therein at locations corresponding to the contact pads such that each of the contact pads has a portion exposed from an upper surface of the patterned circuit layer through the corresponding opening. A plurality of metal bumps are respectively disposed in the openings and mounted to the exposed portions of the contact pads for making external electrical connection. The present invention further provides a method for manufacturing the chip scale package at the wafer-level.

摘要翻译： 芯片级封装包括通过各向异性导电粘合剂层附着到半导体芯片的有源表面的图案化电路层，使得图案化电路层的下表面上的接触焊盘电耦合到半导体芯片上的对应焊盘。 图案化电路层在对应于接触焊盘的位置处具有形成在其中的多个开口，使得每个接触焊盘具有通过相应的开口从图案化电路层的上表面暴露的部分。 多个金属凸块分别设置在开口中并安装到接触垫的暴露部分以进行外部电连接。 本发明还提供了一种在晶片级制造芯片级封装的方法。

公开(公告)号：US20060145361A1

公开(公告)日：2006-07-06

申请号：US11028670

申请日：2005-01-05

申请人： Jun Yang ,  You Joo ,  Dong Jung

发明人： Jun Yang ,  You Joo ,  Dong Jung

IPC分类号： H01L23/28

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L23/29 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The present invention further provides methods for manufacturing the semiconductor device package.

公开(公告)号：US20070014879A1

公开(公告)日：2007-01-18

申请号：US10568257

申请日：2004-09-06

申请人： Jung-Keun Kim ,  So-Won Kim ,  Hyung-Gun Kim ,  Seon-Yle Ko ,  Jong-Yeo Kim ,  Sunhwa Chang ,  Dong-Heon Baek ,  Byung-Eui Lee ,  Seong-Hee Ko ,  Youngaim Choi ,  Dong Jung ,  Haejong Woo

发明人： Jung-Keun Kim ,  So-Won Kim ,  Hyung-Gun Kim ,  Seon-Yle Ko ,  Jong-Yeo Kim ,  Sunhwa Chang ,  Dong-Heon Baek ,  Byung-Eui Lee ,  Seong-Hee Ko ,  Youngaim Choi ,  Dong Jung ,  Haejong Woo

IPC分类号： A61K36/254

CPC分类号： A61K36/258

摘要： The present invention relates to a composition comprising Notoginseng radix extract for preventing and treating arthritis as an effective ingredient. Notoginseng radix extract of the present invention inhibits release of tumor necrosis factor-alpha (TNF-α) and is the death of activated T-cells only, so that it can be effectively used for the production of a medicine for preventing and treating arthritis and health food as well.

摘要翻译： 本发明涉及含有预防和治疗关节炎作为有效成分的三七提取物的组合物。 本发明的三七提取物抑制肿瘤坏死因子-α（TNF-α）的释放，是活化的T细胞的死亡，因此可以有效地用于生产用于预防和治疗关节炎的药物 保健食品以及。