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公开(公告)号:US07910051B2
公开(公告)日:2011-03-22
申请号:US11935099
申请日:2007-11-05
申请人: Stefan Zimmermann , Steve A. Miller , Prabhat Kumar , Mark Gaydos
发明人: Stefan Zimmermann , Steve A. Miller , Prabhat Kumar , Mark Gaydos
CPC分类号: H01J35/108 , B22F7/08 , C23C14/3414 , C23C24/04 , H01J35/08 , H01J2235/081 , H01J2235/083 , H01J2235/085 , Y10T29/4902
摘要: In various embodiments, large-area sputtering targets are formed by providing a plurality of sputtering targets each comprising a backing plate and a refractory metal layer disposed thereon, and spray depositing a refractory metal powder on an interface between the sputtering targets, the refractory metal powder consisting essentially of the same metal as each refractory metal layer, thereby joining the refractory metal layers of the sputtering targets.
摘要翻译: 在各种实施例中,通过提供多个溅射靶来形成大面积溅射靶,每个溅射靶包括背板和设置在其上的难熔金属层,并且在溅射靶之间的界面上喷射沉积难熔金属粉末,难熔金属粉末 基本上由与每个难熔金属层相同的金属组成,由此连接溅射靶的难熔金属层。