摘要:
In at least one embodiment of the semiconductor laser light source, the latter includes a carrier and at least two semiconductor lasers. The semiconductor lasers are mounted on a carrier top. The semiconductor laser light source furthermore includes at least one optical component, which is arranged downstream of at least one of the semiconductor lasers in a direction of emission. The semiconductor lasers and the optical component are housed tightly in a common enclosure by way of a cover. The dimensions of the enclosure, viewed in three orthogonal spatial directions, amount in each case to at most 8 mm×8 mm×7 mm.
摘要:
In at least one embodiment of the semiconductor laser light source, the latter includes a carrier and at least two semiconductor lasers. The semiconductor lasers are mounted on a carrier top. The semiconductor laser light source furthermore includes at least one optical component, which is arranged downstream of at least one of the semiconductor lasers in a direction of emission. The semiconductor lasers and the optical component are housed tightly in a common enclosure by way of a cover. The dimensions of the enclosure, viewed in three orthogonal spatial directions, amount in each case to at most 8 mm×8 mm×7 mm.
摘要:
In at least one embodiment of the optoelectronic lighting module the lighting module has a cooling body, a printed circuit board, and a substrate. One or more optoelectronic semiconductor chips is/are arranged on a substrate upper face. The semiconductor chips are electrically connected to the substrate. At least one retaining device lies directly or indirectly on the substrate upper face and presses a substrate lower face against a cooling body upper face. The substrate is electrically connected to the printed circuit board. The retaining device is electrically insulated from the at least one semiconductor chip.
摘要:
An optoelectronic module comprising: at least one light-emitting diode chip arranged on a carrier, and a mounting attachment fastened to the carrier and at least partly covering the light-emitting diode chip, and having a structured top which allows positioning of an optical element.
摘要:
A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens.
摘要:
A semiconductor device comprising a semiconductor component, particularly a power laser diode bar, disposed on a cooling element, wherein the cooling element contains in its interior a cooling channel for conducting a coolant. The coolant channel comprises in at least one region microstructures for effective heat transfer to the coolant. The semiconductor component substantially completely overlaps the region of the cooling channel comprising the microstructures. Disposed between the semiconductor component and the cooling element is an intermediate support so arranged and configured that it compensates for mechanical stresses between the semiconductor component and the cooling element occurring as a result of differing thermal expansions of the semiconductor component and the cooling element. The material of the cooling element particularly preferably has a high modulus of elasticity such that the compensation takes place substantially within the elastic strain regime.
摘要:
An LED semiconductor body includes a number of at least two radiation-generating active layers. Each active layer has a forward voltage, wherein the number of active layers is adapted to an operating voltage in such a way that the voltage dropped across a series resistor connected in series with the active layers is at most of the same magnitude as a voltage dropped across the LED semiconductor body. The invention furthermore describes various uses of the LED semiconductor body.
摘要:
An optical element comprising includes a base body containing a base material, and a filling body containing a filling material, wherein the filling body adheres to the base body. A radiation-emitting component and a method for producing an optical element are futhermore described.
摘要:
Process for the production of a waveguide beam converter for shaping a laser beam collection. A plurality of waveguides are produced and arranged in such a way that at least one individual laser beam can be injected into each waveguide. The waveguides are firstly produced on a substrate using planar technology, and subsequently detached from the substrate over a part of their length, starting from their beam exit ends. The free ends are then arranged and fixed in accordance with an intended output beam arrangement of the output laser beam collection.
摘要:
An optoelectronic module comprising: at least one light-emitting diode chip arranged on a carrier, and a mounting attachment fastened to the carrier and at least partly covering the light-emitting diode chip, and having a structured top which allows positioning of an optical element.