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    Method of providing a low cost semiconductor transmitter photonic integrated circuit (TxPIC) chip
    2.
    发明授权
    Method of providing a low cost semiconductor transmitter photonic integrated circuit (TxPIC) chip 有权
    提供低成本半导体发射器光子集成电路（TxPIC）芯片的方法

    公开(公告)号：US07010185B2

    公开(公告)日：2006-03-07

    申请号：US10887632

    申请日：2004-07-09

    申请人： Stephen G. Grubb ,  Matthew L. Mitchell ,  Robert B. Taylor ,  Ting-Kuang Chiang ,  Vincent G. Dominic

    发明人： Stephen G. Grubb ,  Matthew L. Mitchell ,  Robert B. Taylor ,  Ting-Kuang Chiang ,  Vincent G. Dominic

    IPC分类号： G02B6/12

    CPC分类号： G02B6/12019 ,  G02B6/12004 ,  H01S3/06754 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/12 ,  H01S5/4012 ,  H01S5/4031 ,  H04B10/25

    摘要： A method of deploying a passive optical combiner that is a broad bandwidth spectral wavelength combiner for combining the outputs from multiples transmitter photonic integrated circuit (TxPIC) chips and, thereafter, the amplification of the combined channel signals with a booster optical amplifier couple between the passive optical combiner and the fiber transmission link. The booster optical amplifier may be a rear earth fiber amplifier, such as an erbium doped fiber amplifier (EDFA), or one or more semiconductor optical amplifiers (SOAs) on one or more semiconductor chips. Such a combination of optical components simplifies the design of individual TxPICs and other such optical communication PICs, which has to take into consideration the nonlinear effects of difficult, high loss single mode fiber (SMF) links or other fiber-type links by allowing a higher power per channel to be achieved compared to the case where channel amplification is attempted directly on the TxPIC chip through the deployment of on-chip optical amplifiers, such as semiconductor optical amplifiers (SOAs), integrated in locations following the electro-optic (EO) modulators, if not integrated also at other locations on the same chip.

    摘要翻译： 一种部署无源光合并器的方法，该无源光合并器是宽带光谱波长组合器，用于组合来自多个发射器光子集成电路（TxPIC）芯片的输出，此后，通过增强型光放大器耦合在被动 光合并器和光纤传输链路。 增强型光放大器可以是诸如掺铒光纤放大器（EDFA）的后置接地光纤放大器或一个或多个半导体芯片上的一个或多个半导体光放大器（SOA）。 这样的光学部件的组合简化了单独的TxPIC和其它这样的光通信PIC的设计，其必须通过允许较高的光纤通道PIC来考虑困难的高损耗单模光纤（SMF）链路或其他光纤类型链路的非线性效应 与通过部署诸如半导体光放大器（SOAs）的片上光放大器（Tx）集成在电光（EO））之后的位置，直接在TxPIC芯片上尝试通道放大的情况相比， 调制器，如果没有集成在同一芯片的其他位置。

    Optical communication module utilizing plural semiconductor transmitter photonic integrated circuit (TxPIC) chips
    4.
    发明授权
    Optical communication module utilizing plural semiconductor transmitter photonic integrated circuit (TxPIC) chips 有权
    利用多个半导体发射器光子集成电路（TxPIC）芯片的光通信模块

    公开(公告)号：US07130499B2

    公开(公告)日：2006-10-31

    申请号：US11079955

    申请日：2005-03-15

    申请人： Stephen G. Grubb ,  Matthew L. Mitchell ,  Robert B. Taylor ,  Ting-Kuang Chiang ,  Vincent G. Dominic

    发明人： Stephen G. Grubb ,  Matthew L. Mitchell ,  Robert B. Taylor ,  Ting-Kuang Chiang ,  Vincent G. Dominic

    IPC分类号： G02B6/12

    CPC分类号： G02B6/12019 ,  G02B6/12004 ,  H01S3/06754 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/12 ,  H01S5/4012 ,  H01S5/4031 ,  H04B10/25

    摘要： An optical communication module comprises a plurality of monolithic semiconductor transmitter photonic integrated circuit (TxPIC) chips each having a plurality of optical signal channels approximating wavelengths on a standardized grid. Each of the channels comprises a laser source optically coupled to an electro-optic modulator. The outputs of the electro-optic modulators are coupled to inputs of an optical combiner integrated on each of the chips for combining the inputs to form a combined signal output from the chip. A second optical combiner combines the combined signal outputs from the TxPICs to form a combined optical signal group output. A booster optical amplifier is optically coupled to the second optical combiner to receive and amplify the combined optical signal group output from the second optical combiner.

    摘要翻译： 光通信模块包括多个单片半导体发射器光子集成电路（TxPIC）芯片，每个芯片具有接近标准化网格上的波长的多个光信号通道。 每个通道包括光耦合到电光调制器的激光源。 电光调制器的输出耦合到集成在每个芯片上的光合成器的输入，用于组合输入以形成从芯片输出的组合信号。 第二光合并器组合来自TxPIC的组合信号输出以形成组合的光信号组输出。 增强型光放大器光耦合到第二光合并器以接收和放大从第二光合并器输出的组合光信号组。

    Optical communication module with one or more photonic integrated circuit (PIC) chips and an external booster optical amplifier for photonic integrated circuits (PICs)
    7.
    发明授权
    Optical communication module with one or more photonic integrated circuit (PIC) chips and an external booster optical amplifier for photonic integrated circuits (PICs) 有权
    具有一个或多个光子集成电路（PIC）芯片的光通信模块和用于光子集成电路（PIC）的外部增强型光放大器

    公开(公告)号：US07062111B2

    公开(公告)日：2006-06-13

    申请号：US10285936

    申请日：2002-10-31

    申请人： Stephen G. Grubb ,  Matthew L. Mitchell ,  Robert B. Taylor ,  Ting-Kuang Chiang ,  Vincent G. Dominic

    发明人： Stephen G. Grubb ,  Matthew L. Mitchell ,  Robert B. Taylor ,  Ting-Kuang Chiang ,  Vincent G. Dominic

    IPC分类号： G02B6/12

    CPC分类号： G02B6/12019 ,  G02B6/12004 ,  H01S3/06754 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/12 ,  H01S5/4012 ,  H01S5/4031 ,  H04B10/25

    摘要： A C- and/or L-band booster optical amplifier is utilized at the output of a semiconductor transmitter photonic integrated circuit (TxPIC) chip or the optical combined outputs of multiple semiconductor transmitter photonic integrated circuit (TxPIC) chips employed in an optical communication module, the deployment of integrated semiconductor optical amplifiers (SOAs) on the TxPIC chips can be eliminated. This would reduce both the complexity in designing and fabricating these chips as well as reducing the power consumption of the TxPIC chips. The deployment of such a Tx booster optical amplifier would also take into consideration the nonlinear effects of difficult high loss single mode fiber (SMF) or other fiber type links by allowing a higher power per channel to be achieved compared to the case where channel amplification is attempted solely on the TxPIC chip.

    摘要翻译： 在半导体发射器光子集成电路（TxPIC）芯片的输出端或在光通信模块中采用的多个半导体发射器光子集成电路（TxPIC）芯片的光学组合输出中使用C-和/或L波段增强光学放大器 ，可以消除在TxPIC芯片上部署集成半导体光放大器（SOA）。 这将降低设计和制造这些芯片的复杂性以及降低TxPIC芯片的功耗。 这种Tx增强型光放大器的部署也将考虑到困难的高损耗单模光纤（SMF）或其他光纤类型链路的非线性效应，通过允许实现与每个信道相比更高的功率，与通道放大为 仅在TxPIC芯片上尝试。

    Optical communication system with multiple photonic integrated circuit (PIC) chips and an external booster optical amplifier for photonic integrated circuits (PICs)
    8.
    发明授权
    Optical communication system with multiple photonic integrated circuit (PIC) chips and an external booster optical amplifier for photonic integrated circuits (PICs) 有权
    具有多光子集成电路（PIC）芯片的光通信系统和用于光子集成电路（PIC）的外部增强型光放大器

    公开(公告)号：US07058248B2

    公开(公告)日：2006-06-06

    申请号：US10887630

    申请日：2004-07-09

    申请人： Stephen G. Grubb ,  Matthew L. Mitchell ,  Robert B. Taylor ,  Ting-Kuang Chiang ,  Vincent G. Dominic

    发明人： Stephen G. Grubb ,  Matthew L. Mitchell ,  Robert B. Taylor ,  Ting-Kuang Chiang ,  Vincent G. Dominic

    IPC分类号： G02B6/12

    CPC分类号： G02B6/12019 ,  G02B6/12004 ,  H01S3/06754 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/12 ,  H01S5/4012 ,  H01S5/4031 ,  H04B10/25

    摘要： A C- and/or L-band booster optical amplifier is utilized in an optical communication system at the output of one or more semiconductor transmitter photonic integrated circuit (TxPIC) chips or the optical combined outputs of multiple semiconductor transmitter photonic integrated circuit (TxPIC) chips employed in an optical communication module, the deployment of integrated semiconductor optical amplifiers (SOAs) on the TxPIC chips can be eliminated. This would reduce both the complexity in designing and fabricating these chips as well as reducing the power consumption of the TxPIC chips. The deployment of such a Tx booster optical amplifier would also take into consideration the nonlinear effects of difficult high loss single mode fiber (SMF) or other fiber type links by allowing a higher power per channel to be achieved compared to the case where channel amplification is attempted solely on the TxPIC chip.

    摘要翻译： 在一个或多个半导体发射器光子集成电路（TxPIC）芯片的输出端或多个半导体发射器光子集成电路（TxPIC）的光学组合输出端的光通信系统中使用C-和/或L波段增强型光放大器， 在光通信模块中使用的芯片，可以消除在TxPIC芯片上部署集成半导体光放大器（SOA）。 这将降低设计和制造这些芯片的复杂性以及降低TxPIC芯片的功耗。 这种Tx增强型光放大器的部署也将考虑到困难的高损耗单模光纤（SMF）或其他光纤类型链路的非线性效应，通过允许实现与每个信道相比更高的功率，与通道放大为 仅在TxPIC芯片上尝试。