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公开(公告)号:US07838954B2
公开(公告)日:2010-11-23
申请号:US12015447
申请日:2008-01-16
IPC分类号: H01L23/48
CPC分类号: B23K1/0016 , B23K1/19 , B23K35/262 , B23K35/3013 , B23K2101/36 , H01L24/11 , H01L2224/05001 , H01L2224/05027 , H01L2224/0508 , H01L2224/05124 , H01L2224/05147 , H01L2224/05572 , H01L2224/056 , H01L2224/11003 , H01L2224/1111 , H01L2924/01322 , Y10T428/24826 , Y10T428/24942 , H01L2924/00 , H01L2924/00014
摘要: A semiconductor solder bump structure having a solder bump with at least a first solder and a second solder attached to the first solder, producing one solder bump having at least two different solders with different melting temperatures. A method of fabricating the solder is included.
摘要翻译: 一种半导体焊料凸块结构,具有至少具有第一焊料的焊料凸块和附着到第一焊料的第二焊料,产生具有不同熔化温度的至少两种不同焊料的一个焊料凸块。 包括制造焊料的方法。