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    Method for controlled removal of a semiconductor device layer from a base substrate
    3.
    发明授权
    Method for controlled removal of a semiconductor device layer from a base substrate 有权
    从基底基板控制去除半导体器件层的方法

    公开(公告)号：US09059073B2

    公开(公告)日：2015-06-16

    申请号：US13603944

    申请日：2012-09-05

    申请人： Stephen W. Bedell ,  Cheng-Wei Cheng ,  Devendra K. Sadana ,  Kuen-Ting Shiu ,  Norma E. Sosa Cortes

    发明人： Stephen W. Bedell ,  Cheng-Wei Cheng ,  Devendra K. Sadana ,  Kuen-Ting Shiu ,  Norma E. Sosa Cortes

    IPC分类号： H01L21/20 ,  H01L21/18 ,  H01L21/78 ,  H01L21/02 ,  H01L31/18

    CPC分类号： H01L21/187 ,  H01L21/02002 ,  H01L21/7813 ,  H01L31/1892 ,  Y02E10/50

    摘要： A method of removing a semiconductor device layer from a base substrate is provided that includes providing a crack propagation layer on an upper surface of a base substrate. A semiconductor device layer including at least one semiconductor device is formed on the crack propagation layer. Next, end portions of the crack propagation layer are etched to initiate a crack in the crack propagation layer. The etched crack propagation layer is then cleaved to provide a cleaved crack propagation layer portion to a surface of the semiconductor device layer and another cleaved crack propagation layer portion to the upper surface of the base substrate. The cleaved crack propagation layer portion is removed from the surface of the semiconductor device layer and the another cleaved crack propagation layer portion is removed from the upper surface of the base substrate.

    摘要翻译： 提供从基底基板去除半导体器件层的方法，其包括在基底基板的上表面上提供裂纹扩展层。 在裂纹扩展层上形成包括至少一个半导体器件的半导体器件层。 接下来，蚀刻裂纹扩展层的端部以在裂纹扩展层中引发裂纹。 蚀刻的裂纹扩展层然后被切割，以向半导体器件层的表面和另一个裂开的裂纹扩展层部分提供切割的裂纹扩展层部分到基底衬底的上表面。 从半导体器件层的表面去除切割的裂纹扩展层部分，并从基底基板的上表面除去另一个裂开的裂纹扩展层部分。

    METHOD FOR CONTROLLED REMOVAL OF A SEMICONDUCTOR DEVICE LAYER FROM A BASE SUBSTRATE
    4.
    发明申请
    METHOD FOR CONTROLLED REMOVAL OF A SEMICONDUCTOR DEVICE LAYER FROM A BASE SUBSTRATE 有权
    用于从基底衬底控制去除半导体器件层的方法

    公开(公告)号：US20130005119A1

    公开(公告)日：2013-01-03

    申请号：US13603944

    申请日：2012-09-05

    申请人： Stephen W. Bedell ,  Cheng-Wei Cheng ,  Devendra K. Sadana ,  Kuen-Ting Shiu ,  Norma E. Sosa Cortes

    发明人： Stephen W. Bedell ,  Cheng-Wei Cheng ,  Devendra K. Sadana ,  Kuen-Ting Shiu ,  Norma E. Sosa Cortes

    IPC分类号： H01L21/20

    CPC分类号： H01L21/187 ,  H01L21/02002 ,  H01L21/7813 ,  H01L31/1892 ,  Y02E10/50

    摘要： A method of removing a semiconductor device layer from a base substrate is provided that includes providing a crack propagation layer on an upper surface of a base substrate. A semiconductor device layer including at least one semiconductor device is formed on the crack propagation layer. Next, end portions of the crack propagation layer are etched to initiate a crack in the crack propagation layer. The etched crack propagation layer is then cleaved to provide a cleaved crack propagation layer portion to a surface of the semiconductor device layer and another cleaved crack propagation layer portion to the upper surface of the base substrate. The cleaved crack propagation layer portion is removed from the surface of the semiconductor device layer and the another cleaved crack propagation layer portion is removed from the upper surface of the base substrate.

    摘要翻译： 提供从基底基板去除半导体器件层的方法，其包括在基底基板的上表面上提供裂纹扩展层。 在裂纹扩展层上形成包括至少一个半导体器件的半导体器件层。 接下来，蚀刻裂纹扩展层的端部以在裂纹扩展层中引发裂纹。 蚀刻的裂纹扩展层然后被切割，以向半导体器件层的表面和另一个裂开的裂纹扩展层部分提供切割的裂纹扩展层部分到基底衬底的上表面。 从半导体器件层的表面去除切割的裂纹扩展层部分，并从基底基板的上表面除去另一个裂开的裂纹扩展层部分。

    METHOD FOR CONTROLLED REMOVAL OF A SEMICONDUCTOR DEVICE LAYER FROM A BASE SUBSTRATE
    5.
    发明申请
    METHOD FOR CONTROLLED REMOVAL OF A SEMICONDUCTOR DEVICE LAYER FROM A BASE SUBSTRATE 有权
    用于从基底衬底控制去除半导体器件层的方法

    公开(公告)号：US20120322244A1

    公开(公告)日：2012-12-20

    申请号：US13161260

    申请日：2011-06-15

    申请人： Stephen W. Bedell ,  Cheng-Wei Cheng ,  Devendra K. Sadana ,  Kuen-Ting Shiu ,  Norma E. Sosa Cortes

    发明人： Stephen W. Bedell ,  Cheng-Wei Cheng ,  Devendra K. Sadana ,  Kuen-Ting Shiu ,  Norma E. Sosa Cortes

    IPC分类号： H01L21/20

    CPC分类号： H01L21/187 ,  H01L21/02002 ,  H01L21/7813 ,  H01L31/1892 ,  Y02E10/50

    摘要： A method of removing a semiconductor device layer from a base substrate is provided that includes providing a crack propagation layer on an upper surface of a base substrate. A semiconductor device layer including at least one semiconductor device is formed on the crack propagation layer. Next, end portions of the crack propagation layer are etched to initiate a crack in the crack propagation layer. The etched crack propagation layer is then cleaved to provide a cleaved crack propagation layer portion to a surface of the semiconductor device layer and another cleaved crack propagation layer portion to the upper surface of the base substrate. The cleaved crack propagation layer portion is removed from the surface of the semiconductor device layer and the another cleaved crack propagation layer portion is removed from the upper surface of the base substrate.

    摘要翻译： 提供从基底基板去除半导体器件层的方法，其包括在基底基板的上表面上提供裂纹扩展层。 在裂纹扩展层上形成包括至少一个半导体器件的半导体器件层。 接下来，蚀刻裂纹扩展层的端部以在裂纹扩展层中引发裂纹。 蚀刻的裂纹扩展层然后被切割，以向半导体器件层的表面和另一个裂开的裂纹扩展层部分提供切割的裂纹扩展层部分到基底衬底的上表面。 从半导体器件层的表面去除切割的裂纹扩展层部分，并从基底基板的上表面除去另一个裂开的裂纹扩展层部分。

    Self-aligned III-V MOSFET diffusion regions and silicide-like alloy contact
    9.
    发明授权
    Self-aligned III-V MOSFET diffusion regions and silicide-like alloy contact 有权
    自对准III-V MOSFET扩散区和硅化物样合金接触

    公开(公告)号：US08822317B2

    公开(公告)日：2014-09-02

    申请号：US13603739

    申请日：2012-09-05

    申请人： Cheng-Wei Cheng ,  Augustin J. Hong ,  Jeehwan Kim ,  Devendra K. Sadana ,  Kuen-Ting Shiu

    发明人： Cheng-Wei Cheng ,  Augustin J. Hong ,  Jeehwan Kim ,  Devendra K. Sadana ,  Kuen-Ting Shiu

    IPC分类号： H01L21/336

    CPC分类号： H01L21/2258 ,  H01L21/246 ,  H01L21/28575 ,  H01L29/41775 ,  H01L29/452 ,  H01L29/517 ,  H01L29/66522

    摘要： A metal oxide semiconductor field effect transistor and method for forming the same include exposing portions on a substrate adjacent to a gate stack, forming a dopant layer over the gate stack and in contact with the substrate in the portions exposed and annealing the dopant layer to drive dopants into the substrate to form self-aligned dopant regions in the substrate. The dopant layer is removed. A metal containing layer is deposited over the gate stack and in contact with the substrate in the exposed portions. The metal containing layer is annealed to drive metal into the substrate to form self-aligned contact regions in a metal alloy formed in the substrate within the dopant regions. The metal layer is then removed.

    摘要翻译： 金属氧化物半导体场效应晶体管及其形成方法包括在与栅极叠层相邻的衬底上的曝光部分，在栅极堆叠上形成掺杂剂层，并在暴露并退火掺杂剂层驱动的部分中与衬底接触 掺杂到衬底中以在衬底中形成自对准掺杂剂区域。 去除掺杂剂层。 在栅极叠层上沉积含金属层，并在暴露部分与衬底接触。 对含金属层进行退火以将金属驱动到衬底中，以在掺杂区域内的衬底中形成的金属合金中形成自对准接触区域。 然后去除金属层。

    SELF-ALIGNED III-V MOSFET DIFFUSION REGIONS AND SILICIDE-LIKE ALLOY CONTACT
    10.
    发明申请
    SELF-ALIGNED III-V MOSFET DIFFUSION REGIONS AND SILICIDE-LIKE ALLOY CONTACT 有权
    自对准III-V MOSFET扩散区和类硅合金接触

    公开(公告)号：US20130001659A1

    公开(公告)日：2013-01-03

    申请号：US13603739

    申请日：2012-09-05

    申请人： Cheng-Wei Cheng ,  Augustin J. Hong ,  Jeehwan Kim ,  Devendra K. Sadana ,  Kuen-Ting Shiu

    发明人： Cheng-Wei Cheng ,  Augustin J. Hong ,  Jeehwan Kim ,  Devendra K. Sadana ,  Kuen-Ting Shiu

    IPC分类号： H01L29/78

    CPC分类号： H01L21/2258 ,  H01L21/246 ,  H01L21/28575 ,  H01L29/41775 ,  H01L29/452 ,  H01L29/517 ,  H01L29/66522

    摘要： A metal oxide semiconductor field effect transistor and method for forming the same include exposing portions on a substrate adjacent to a gate stack, forming a dopant layer over the gate stack and in contact with the substrate in the portions exposed and annealing the dopant layer to drive dopants into the substrate to form self-aligned dopant regions in the substrate. The dopant layer is removed. A metal containing layer is deposited over the gate stack and in contact with the substrate in the exposed portions. The metal containing layer is annealed to drive metal into the substrate to form self-aligned contact regions in a metal alloy formed in the substrate within the dopant regions. The metal layer is then removed.

    摘要翻译： 金属氧化物半导体场效应晶体管及其形成方法包括在与栅极叠层相邻的衬底上的曝光部分，在栅极叠层上形成掺杂剂层，并在暴露并退火掺杂剂层驱动的部分中与衬底接触 掺杂到衬底中以在衬底中形成自对准掺杂剂区域。 去除掺杂剂层。 在栅极叠层上沉积含金属层，并在暴露部分与衬底接触。 对含金属层进行退火以将金属驱动到衬底中，以在掺杂区域内的衬底中形成的金属合金中形成自对准接触区域。 然后去除金属层。