BACK-SURFACE FIELD STRUCTURES FOR MULTI-JUNCTION III-V PHOTOVOLTAIC DEVICES
    8.
    发明申请
    BACK-SURFACE FIELD STRUCTURES FOR MULTI-JUNCTION III-V PHOTOVOLTAIC DEVICES 审中-公开
    多功能III-V光伏器件的后表面场结构

    公开(公告)号:US20130092218A1

    公开(公告)日:2013-04-18

    申请号:US13274938

    申请日:2011-10-17

    IPC分类号: H01L31/0264 H01L31/18

    摘要: A multi-junction III-V photovoltaic device is provided that includes at least one top cell comprised of at least one III-V compound semiconductor material; and a bottom cell in contact with a surface of the at least one top cell. The bottom cell includes a germanium-containing layer in contact with the at least one top cell, at least one intrinsic hydrogenated silicon-containing layer in contact with a surface of the germanium-containing layer, and at least one doped hydrogenated silicon-containing layer in contact with a surface of the at least one intrinsic hydrogenated silicon-containing layer. The intrinsic and doped silicon-containing layers can be amorphous, nano/micro-crystalline, poly-crystalline or single-crystalline.

    摘要翻译: 提供了多结III-V光伏器件,其包括至少一个由至少一个III-V化合物半导体材料构成的顶部电池; 以及与所述至少一个顶部单元的表面接触的底部单元。 底部电池包括与至少一个顶部电池接触的含锗层,与含锗层的表面接触的至少一个本征氢化含硅层和至少一个掺杂氢化含硅层 与所述至少一个本征氢化含硅层的表面接触。 本征和掺杂的含硅层可以是无定形,纳米/微晶,多晶或单晶。