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公开(公告)号：US20120228199A1
公开(公告)日：2012-09-13
申请号：US13481028
申请日：2012-05-25
CPC分类号： G06K9/00 , B07C5/00 , B07C5/10 , B07C5/34 , B07C5/3422 , B07C5/3425 , G01J3/0218 , G01J3/10 , G01N21/253 , G01N21/6428 , G01N21/6452 , G01N21/6456 , G01N21/85 , G01N2021/0339 , G01N2021/8592 , G01N2201/0627 , G01N2201/129
摘要： Systems and methods are provided for evaluating and sorting seeds based on characteristics of the seeds. One system includes an imaging and analysis subsystem that collects image data from the seeds and analyzes the collected image data for characteristics of the seeds. This subsystem can include an imaging theater having minors that reflect image data from the seeds to an imaging device for collection. The system can also include an off-loading and sorting subsystem configured to sort the seeds based on their characteristics. And, one method includes illuminating the seeds and collecting image data from the seeds for determining their characteristics. The image data can be collected from at least three portions of the seeds at each of a plurality of sequentially changing spectral wavelengths. In addition (or alternatively), the image data can be collected from top and bottom portions of the seeds using a single imaging device.
摘要翻译： 提供的系统和方法用于根据种子的特征来评估和分选种子。 一个系统包括成像和分析子系统，其从种子收集图像数据，并分析所收集的图像数据以获得种子的特征。 该子系统可以包括具有将来自种子的图像数据反映到用于收集的成像装置的未成年人的成像影院。 该系统还可以包括卸载和排序子系统，其被配置为基于其特征对种子进行分类。 并且，一种方法包括照亮种子并从种子收集图像数据以确定其特性。 可以从多个顺序变化的光谱波长中的每一个的种子的至少三个部分收集图像数据。 另外（或替代地），可以使用单个成像装置从种子的顶部和底部收集图像数据。
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公开(公告)号：US08401271B2
公开(公告)日：2013-03-19
申请号：US13481028
申请日：2012-05-25
IPC分类号： G06K9/00
CPC分类号： G06K9/00 , B07C5/00 , B07C5/10 , B07C5/34 , B07C5/3422 , B07C5/3425 , G01J3/0218 , G01J3/10 , G01N21/253 , G01N21/6428 , G01N21/6452 , G01N21/6456 , G01N21/85 , G01N2021/0339 , G01N2021/8592 , G01N2201/0627 , G01N2201/129
摘要： Systems and methods are provided for evaluating and sorting seeds based on characteristics of the seeds. One system includes an imaging and analysis subsystem that collects image data from the seeds and analyzes the collected image data for characteristics of the seeds. This subsystem can include an imaging theater having mirrors that reflect image data from the seeds to an imaging device for collection. The system can also include an off-loading and sorting subsystem configured to sort the seeds based on their characteristics. And, one method includes illuminating the seeds and collecting image data from the seeds for determining their characteristics. The image data can be collected from at least three portions of the seeds at each of a plurality of sequentially changing spectral wavelengths. In addition (or alternatively), the image data can be collected from top and bottom portions of the seeds using a single imaging device.
摘要翻译： 提供的系统和方法用于根据种子的特征来评估和分选种子。 一个系统包括成像和分析子系统，其从种子收集图像数据，并分析所收集的图像数据以获得种子的特征。 该子系统可以包括具有将来自种子的图像数据反射到用于收集的成像装置的反射镜的成像影院。 该系统还可以包括卸载和排序子系统，其被配置为基于其特征对种子进行分类。 并且，一种方法包括照亮种子并从种子收集图像数据以确定其特性。 可以从多个顺序变化的光谱波长中的每一个的种子的至少三个部分收集图像数据。 另外（或替代地），可以使用单个成像装置从种子的顶部和底部收集图像数据。
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公开(公告)号：US08189901B2
公开(公告)日：2012-05-29
申请号：US12129444
申请日：2008-05-29
IPC分类号： G06K9/00
CPC分类号： G06K9/00 , B07C5/00 , B07C5/10 , B07C5/34 , B07C5/3422 , B07C5/3425 , G01J3/0218 , G01J3/10 , G01N21/253 , G01N21/6428 , G01N21/6452 , G01N21/6456 , G01N21/85 , G01N2021/0339 , G01N2021/8592 , G01N2201/0627 , G01N2201/129
摘要： The present disclosure provides systems and methods for sorting seeds based on identified phenotypes of the seeds. In various embodiments, the system includes an optics and controller station structured and operable to collect image data of a top portion, a bottom portion and a plurality of side portions of each respective seed in a set of seeds, and to analyze the collected image data to determine whether each seed exhibits a desired phenotype. The system further includes a seed loading, transporting and sorting station structured and operable to singulate each seed of the set of seeds from a plurality of seeds in a bulk seed hopper, transport the set of seeds to the optics and controller station, and selectively sort each seed to a respective one of a plurality of seed repositories based on whether each respective seed exhibits the desired phenotype.
摘要翻译： 本公开提供了基于鉴定的种子表型来分选种子的系统和方法。 在各种实施例中，系统包括被构造和可操作以收集一组种子中每个相应种子的顶部，底部和多个侧部的图像数据的光学元件和控制器站，并且分析所收集的图像数据 以确定每个种子是否表现出期望的表型。 该系统还包括种子装载，运输和分拣站，其结构化并可操作以从散装种子料斗中的多个种子中分离出种子组中的每个种子，将该种子传送到光学和控制台，并选择性地分选 基于每个各自的种子是否显示期望的表型，每个种子到多个种子库中的相应一个种子库。
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公开(公告)号：US20080310674A1
公开(公告)日：2008-12-18
申请号：US12129444
申请日：2008-05-29
IPC分类号： G06K9/00
CPC分类号： G06K9/00 , B07C5/00 , B07C5/10 , B07C5/34 , B07C5/3422 , B07C5/3425 , G01J3/0218 , G01J3/10 , G01N21/253 , G01N21/6428 , G01N21/6452 , G01N21/6456 , G01N21/85 , G01N2021/0339 , G01N2021/8592 , G01N2201/0627 , G01N2201/129
摘要： The present disclosure provides systems and methods for sorting seeds based on identified phenotypes of the seeds. In various embodiments, the system includes an optics and controller station structured and operable to collect image data of a top portion, a bottom portion and a plurality of side portions of each respective seed in a set of seeds, and to analyze the collected image data to determine whether each seed exhibits a desired phenotype. The system further includes a seed loading, transporting and sorting station structured and operable to singulate each seed of the set of seeds from a plurality of seeds in a bulk seed hopper, transport the set of seeds to the optics and controller station, and selectively sort each seed to a respective one of a plurality of seed repositories based on whether each respective seed exhibits the desired phenotype.
摘要翻译： 本公开提供了基于鉴定的种子表型来分选种子的系统和方法。 在各种实施例中，系统包括被构造和可操作以收集一组种子中每个相应种子的顶部，底部和多个侧部的图像数据的光学元件和控制器站，并且分析所收集的图像数据 以确定每个种子是否表现出期望的表型。 该系统还包括种子装载，运输和分拣站，其结构化并可操作以从散装种子料斗中的多个种子中分离出种子组中的每个种子，将该种子传送到光学和控制台，并选择性地分选 基于每个各自的种子是否显示期望的表型，每个种子到多个种子库中的相应一个种子库。
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公开(公告)号：US20060290372A1
公开(公告)日：2006-12-28
申请号：US11491216
申请日：2006-07-21
申请人： Jason Blanchet , James Crain , Charles Griffin , David Stone , Robert White
发明人： Jason Blanchet , James Crain , Charles Griffin , David Stone , Robert White
IPC分类号： G01R31/26
CPC分类号： G01R31/2856 , G01R31/2853 , G01R31/2855 , G01R31/2875 , G01R31/2879
摘要： A test chip module for testing the integrity of the flip chip solder ball interconnections between chip and substrate. The interconnections are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current is passed through the interconnection to be tested by a current supply circuit using one signal I/O interconnection and the voltage drop across the interconnection to be tested from the current passed therethrough is measured by a voltage measuring circuit connected through another signal I/O interconnection. Stress initiating cracking and degradation at the interconnection creates a measurable change in voltage drop across the interconnection.
摘要翻译： 用于测试芯片和衬底之间的倒装芯片焊球互连的完整性的测试芯片模块。 互连通过在芯片冶金层中形成的各个加热器的阵列进行热应力，以提供均匀且普遍存在的热源。 电流通过互连使用一个信号I / O互连由电流供应电路进行测试，并且通过其中通过的电流将要测试的互连线上的电压降由通过另一个信号I / O连接的电压测量电路测量 互连。 在互连处的应力引发开裂和退化在互连上产生可测量的电压降变化。
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6.发明申请Integrated Circuit Chip Having A Ringed Wiring Layer Interposed Between A Contact Layer And A Wiring Grid 失效具有接触层和布线网格之间的环形接线层的集成电路芯片公开(公告)号：US20050050505A1
公开(公告)日：2005-03-03
申请号：US10604995
申请日：2003-08-29
申请人： Thomas Bednar , Timothy Budell , Patrick Buffet , Alain Caron , James Crain , Douglas Kemerer , Donald Kent , Esmaeil Rahmati
发明人： Thomas Bednar , Timothy Budell , Patrick Buffet , Alain Caron , James Crain , Douglas Kemerer , Donald Kent , Esmaeil Rahmati
IPC分类号： H01L23/528 , G06F17/50 , H01L23/52
CPC分类号： H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit chip (104) having a contact layer (136) that includes a plurality of Vdd, Vddx, ground and I/O contacts (116, 120, 124, 128) arranged in a generally radial pattern having diagonal and major axis symmetry and generally defining four quadrants. An X-Y power grid (140) is located beneath the contact layer and includes metal layers (LM′) each having a plurality of wires (68) extending in one direction. The direction of the wires alternates from one metal layer to the next adjacent metal layer. A wiring layer (IM) is interposed between the contact layer and power grid layers to provide a well-behaved electrical transition between the generally radial Vdd, Vddx and ground contacts and the rectangular X-Y power grid. The interposed wiring layer includes concentric square rings of Vdd, Vddx and ground wires (144, 148, 152) located alternatingly with one another. The Vddx wires are discontinuous between adjacent quadrants so that the magnitude of Vddx may be different in each quadrant of the chip if desired.
摘要翻译： 一种具有接触层（136）的集成电路芯片（104），该接触层包括多个Vdd，Vddx，接地和I / O触点（116,120,124,128），其以大致径向图案布置，具有对角线和长轴对称 并通常定义四个象限。 X-Y电网（140）位于接触层下方，并且包括金属层（LM'），每个金属层具有沿一个方向延伸的多根电线（68）。 线的方向从一个金属层交替到下一个相邻的金属层。 在接触层和电网层之间插入布线层（IM），以在大致径向的Vdd，Vddx和接地触头与矩形X-Y电网之间提供良好的电气转变。 插入的布线层包括彼此交替布置的Vdd，Vddx和接地线（144,148,152）的同心方形环。 Vddx线在相邻象限之间是不连续的，使得如果需要，Vddx的幅度可以在芯片的每个象限中不同。
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公开(公告)号：US20080088335A1
公开(公告)日：2008-04-17
申请号：US11954589
申请日：2007-12-12
申请人： Jason Blanchet , James Crain , Charles Griffin , David Stone , Robert White
发明人： Jason Blanchet , James Crain , Charles Griffin , David Stone , Robert White
IPC分类号： G01R31/26
CPC分类号： G01R31/2856 , G01R31/2853 , G01R31/2855 , G01R31/2875 , G01R31/2879
摘要： A test chip module for testing the integrity of the nip chip solder ball interconnections between chip and substrate. The interconnection, are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current is passed through the interconnection to be tested by a current supply circuit using one signal I/O interconnection and the voltage drop across the interconnection to be tested from the current passed therethrough is measured by a voltage measuring circuit connected through another signal I/O interconnection. Stress initiating cracking and degradation at the interconnection creates a measurable change in voltage drop across the interconnection.
摘要翻译： 一种测试芯片模块，用于测试芯片和基板之间的夹芯焊料球互连的完整性。 互连通过形成在芯片冶金层中的各个加热器的阵列而受到热应力，以提供均匀且普遍存在的热源。 电流通过互连使用一个信号I / O互连由电流供应电路进行测试，并且通过其中通过的电流将要测试的互连线上的电压降由通过另一个信号I / O连接的电压测量电路测量 互连。 在互连处的应力引发开裂和退化在互连上产生可测量的电压降变化。
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