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    Through board stacking of multiple LGA-connected components
    6.
    发明申请
    Through board stacking of multiple LGA-connected components 有权
    通过板堆叠多个LGA连接的组件

    公开(公告)号：US20080054430A1

    公开(公告)日：2008-03-06

    申请号：US11511815

    申请日：2006-08-29

    申请人： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

    发明人： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

    IPC分类号： H01L23/02

    CPC分类号： H05K3/325 ,  H05K2201/0314 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2018

    摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

    摘要翻译： 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。

    THROUGH BOARD STACKING OF MULTIPLE LGA-CONNECTED COMPONENTS
    7.
    发明申请
    THROUGH BOARD STACKING OF MULTIPLE LGA-CONNECTED COMPONENTS 有权
    通过多个LGA连接组件的板堆栈

    公开(公告)号：US20090315168A1

    公开(公告)日：2009-12-24

    申请号：US12543104

    申请日：2009-08-18

    申请人： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

    发明人： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

    IPC分类号： H01L23/52 ,  H01L21/50

    CPC分类号： H05K3/325 ,  H05K2201/0314 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2018

    摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

    摘要翻译： 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。

    Planar antenna in the ISM band with an omnidirectional pattern in the horizontal plane
    9.
    发明授权
    Planar antenna in the ISM band with an omnidirectional pattern in the horizontal plane 失效
    在水平面上具有全向图案的ISM频带中的平面天线

    公开(公告)号：US5583510A

    公开(公告)日：1996-12-10

    申请号：US340571

    申请日：1994-11-16

    申请人： Saila Ponnapalli ,  Alphonso P. Lanzetta ,  Brian P. Gaucher

    发明人： Saila Ponnapalli ,  Alphonso P. Lanzetta ,  Brian P. Gaucher

    IPC分类号： H01Q1/38 ,  H01Q9/04 ,  H01Q1/32

    CPC分类号： H01Q1/38 ,  H01Q9/0407

    摘要： A multilayer antenna includes a first layer which is a ground plane and which has a plurality of first clearance holes. A first dielectric layer is positioned over the first layer and a second layer is positioned over the first dielectric layer and has a plurality of quarter wave transformers. A second dielectric layer is positioned over the second layer and a third layer ground plane is positioned over the second dielectric layer and has a plurality of second clearance holes for a feed structure. A third dielectric layer is positioned over the third layer and a fourth layer is positioned over the third dielectric layer and has a cross shape. The first and third layers are coupled together via plated-through holes.

    摘要翻译： 多层天线包括作为接地平面的第一层，并且具有多个第一间隙孔。 第一介电层位于第一层之上，第二层位于第一介电层上方，并具有多个四分之一波长的变压器。 第二介电层位于第二层上方，第三层接地平面位于第二介电层上方，并具有用于进料结构的多个第二间隙孔。 第三电介质层位于第三层上方，第四层位于第三电介质层上方并具有十字形。 第一层和第三层通过镀通孔连接在一起。

    Radio information broadcasting and receiving system
    10.
    发明授权
    Radio information broadcasting and receiving system 失效
    无线电信息广播和接收系统

    公开(公告)号：US5581576A

    公开(公告)日：1996-12-03

    申请号：US371621

    申请日：1995-01-12

    申请人： Alphonso P. Lanzetta ,  Lawrence S. Mok

    发明人： Alphonso P. Lanzetta ,  Lawrence S. Mok

    IPC分类号： H04H20/34 ,  H04H20/86 ,  H04L5/06 ,  H04L27/00 ,  H04L27/28

    CPC分类号： H04H20/34 ,  H04H20/86 ,  H04L5/06

    摘要： A radio information broadcasting and receiving system consisting of three major parts: an FM transmitter station with subcarrier multiplexing capability, an FM receiver apparatus with subcarrier demodulation capability, and a computer connected in combination with the receiver apparatus. The FM transmitter station includes sources of main programming signals first digital data signals and second digital data signals. The first and second digital data signals are modulated by subcarrier 1 and subcarrier 2 frequencies respectively and are mixed with the main program signal and then transmitted. The transmitted signals are received by a receiver apparatus including an FM receiver circuit and an FM demodulator circuit for receiving the broadcast signal and demodulating it. The demodulated main program audio frequency signal is applied through a filter/deemphasis circuit and amplifier to speaker to provide an audio output. The first subcarrier frequency signal is demodulated by a first subcarrier frequency generator to provide a digital signal of the text portion of the transmitted signal which is then applied to a first input port of this digital computer. Likewise, the second subcarrier frequency is demodulated and the resultant index digital data signal is applied to a second input port of the computer.

    摘要翻译： 一种无线电信息广播和接收系统，包括三个主要部分：具有子载波复用能力的FM发射机站，具有子载波解调能力的FM接收机设备，以及与接收机设备组合连接的计算机。 FM发射台包括主编程信号源，第一数字数据信号和第二数字数据信号。 第一和第二数字数据信号分别由副载波1和子载波2频率调制，并与主节目信号混合后发送。 所发送的信号由包括FM接收机电路和用于接收广播信号并对其进行解调的FM解调器电路的接收机装置接收。 解调的主程序音频信号通过滤波器/去加重电路和放大器施加到扬声器以提供音频输出。 第一副载波频率信号由第一副载波频率发生器解调，以提供发送信号的文本部分的数字信号，该数字信号然后被施加到该数字计算机的第一输入端口。 类似地，解调第二副载波频率，并将所得到的索引数字数据信号施加到计算机的第二输入端口。