摘要:
A photosensitive element for electrophotography has an electrically conductive substrate and a layer structure thereon comprising a charge generating substance and a charge transport substance. An improved charge transport substance is a derivative of triphenylamine in which at least 80% of the electrons in the highest occupied molecular orbital are located on the triphenylamine skeleton. Examples of such compounds have the following formula: ##STR1## wherein X is a an optionally substituted heterocyclic radical containing at least one ring nitrogen, Q is a single bond or --C.dbd.C--, and Z.sub.1, Z.sub.2 and Z.sub.3 are H, lower alkyl or alkoxy, aryl, NO.sub.2, CF.sub.3, --N(R').sub.2, --S--C.sub.6 H.sub.5 or --S(R').sub.2.
摘要:
An electrophotographic member which can give printed images of high quality and is markedly high in photoresponsiveness can be provided without using halogen solvents by using a composition for charge transport layer which contains a polycarbonate resin having a recurring structural unit represented by the following formula (I) and, if necessary, a specific styryl compound, a specific hydrazone compound and the like: ##STR1## wherein R.sub.1 and R.sub.2 =alkyl, etc.R.sub.3 through R.sub.18 =H, alkyl, etc.k/m=1/1-10/1.
摘要:
A novel enamine derivative is effective as a charge transport material and can provide an electrophotographic plate excellent in sensitivity, photoresponse and durability.
摘要:
In an electrophotographic plate, that having an undercoating layer with smooth surface when observed by using a scanning electron microscope and an electric conductivity of at least 2.times.10.sup.-14 .OMEGA..sup.-1 .multidot.cm.sup.-1 between an electroconductive substrate and a photosensitive layer is improved in electrophotographic properties which are hardly changed by changes of circumstances.
摘要:
An electrophotographic plate having a protective layer comprising a fluorine-containing copolymer having monomer units of a fluoroolefin, and an alkyl vinyl ether and/or cycloalkyl vinyl ether on an organic photoconductive layer formed on the electroconductive layer is excellent in electrophotographic properties and durability.
摘要:
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要:
Grid structured data arranged for a spherical structured grid constituted by combining two component structured grids are visualized by using computer graphics technology. Coordinate conversion means 31 converts grid point coordinates of first and second component structured grids (referred to as N and E systems, respectively), represented by specific regions in spherical coordinates, into local xyz coordinates used in computer graphics. Filter means 32 obtains first and second graphic objects for the N and E systems, respectively. Using E system rotation and N and E system synthesis means 33, the second graphic object for the E system is rotated by 90 degrees with respect to an x axis of a first local xyz coordinate system, and is then rotated by 180 degrees with respect to a z axis of the first local xyz coordinate system, thereby obtaining the rotated second graphic object for the E system, and then, both of the graphic objects are synthesized.
摘要:
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要:
The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.
摘要:
A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity and (F) an organic solvent and which, when applied and dried, gives a coating film having a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90 %RH of 500 g/m2·24 h or less; a protective film which is formed by applying the paste composition to a surface of a semiconductor part and drying it and has a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90%RH of 500 g/m2·24 h or less; and a semiconductor device having the protective film.
摘要翻译:作为必要成分(A)热塑性树脂,(B)环氧树脂,(C)偶联剂,(D)粉末状无机填料,(E)具有橡胶弹性的粉末和(F) 有机溶剂,当涂布并干燥时,得到空隙率为3体积%以上的涂膜,在40℃,90%RH下测定的水蒸气透过率为500g / m 2·24h, 减; 通过将糊剂组合物涂布在半导体部件的表面并干燥而形成的保护膜,其空隙率为3体积%以上,水分透过率为40℃,90%RH 500 g / m2.24 h以下; 以及具有保护膜的半导体器件。