公开(公告)号：US08853312B2

公开(公告)日：2014-10-07

申请号：US13717009

申请日：2012-12-17

Applicant: Sumitomo Bakelite Co., Ltd.

Inventor： Hikaru Okubo ,  Nobuki Tanaka ,  Itaru Watanabe

IPC: C08K3/08 ,  C08L79/08 ,  H01L23/00 ,  C09J179/08 ,  C09J201/02 ,  C08G73/12 ,  C08F220/58 ,  C08K5/14 ,  C08K5/00 ,  C08K3/26 ,  C08F234/02

CPC classification number: C08F220/58 ,  C08F234/02 ,  C08G73/12 ,  C08K3/08 ,  C08K3/26 ,  C08K5/0025 ,  C08K5/14 ,  C08L79/085 ,  C09J179/08 ,  C09J201/025 ,  H01L23/145 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015

Abstract: A quick curing resin composition, which can be used in conventionally used ovens, and a semiconductor device, which is excellent in reliability such as solder crack resistance or the like when the resin composition, is used as a die attach material for semiconductor. The resin composition has a sufficient low stress property, good adhesion and excellent bleeding property. The resin composition includes a filler (A), compound (B) having the structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.

Abstract translation: 可用于常规使用的烘箱中的快速固化树脂组合物和当树脂组合物用作半导体的芯片附着材料时，其耐焊料裂纹等的可靠性优异的半导体器件。 该树脂组合物具有足够的低应力性，良好的粘附性和优异的渗出性。 树脂组合物包括具有由式（1）表示的结构的化合物（B）和由式（2）表示的官能团和热自由基引发剂（C）的填料（A），化合物（B），并且基本上不含有照片 聚合引发剂。