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    Power semiconductor device and fabrication method thereof
    2.
    发明授权
    Power semiconductor device and fabrication method thereof 失效
    功率半导体器件及其制造方法

    公开(公告)号：US08772833B2

    公开(公告)日：2014-07-08

    申请号：US13592560

    申请日：2012-08-23

    申请人： Woo Jin Chang ,  Jong Won Lim ,  Ho Kyun Ahn ,  Sang Choon Ko ,  Sung Bum Bae ,  Chull Won Ju ,  Young Rak Park ,  Jae Kyoung Mun ,  Eun Soo Nam

    发明人： Woo Jin Chang ,  Jong Won Lim ,  Ho Kyun Ahn ,  Sang Choon Ko ,  Sung Bum Bae ,  Chull Won Ju ,  Young Rak Park ,  Jae Kyoung Mun ,  Eun Soo Nam

    IPC分类号： H01L29/15

    CPC分类号： H01L29/66901 ,  H01L29/2003 ,  H01L29/401 ,  H01L29/402 ,  H01L29/42316 ,  H01L29/66462 ,  H01L29/7786

    摘要： Disclosed are a power semiconductor device and a method of fabricating the same which can increase a breakdown voltage of the device through a field plate formed between a gate electrode and a drain electrode and achieve an easier manufacturing process at the same time. The power semiconductor device according to an exemplary embodiment of the present disclosure includes a source electrode and a drain electrode formed on a substrate; a dielectric layer formed between the source electrode and the drain electrode to have a lower height than heights of the two electrodes and including an etched part exposing the substrate; a gate electrode formed on the etched part; a field plate formed on the dielectric layer between the gate electrode and the drain electrode; and a metal configured to connect the field plate and the source electrode.

    摘要翻译： 公开了功率半导体器件及其制造方法，其可以通过形成在栅电极和漏电极之间的场板来增加器件的击穿电压，并且同时实现更容易的制造工艺。 根据本公开的示例性实施例的功率半导体器件包括形成在衬底上的源电极和漏电极; 形成在所述源电极和所述漏电极之间的电介质层具有比所述两个电极的高度低的高度，并且包括暴露所述衬底的蚀刻部分; 形成在蚀刻部分上的栅电极; 形成在栅电极和漏电极之间的电介质层上的场板; 以及配置成连接场板和源电极的金属。

    FIELD EFFECT TRANSISTOR AND FABRICATION METHOD THEREOF
    3.
    发明申请
    FIELD EFFECT TRANSISTOR AND FABRICATION METHOD THEREOF 审中-公开
    场效应晶体管及其制造方法

    公开(公告)号：US20130069127A1

    公开(公告)日：2013-03-21

    申请号：US13556377

    申请日：2012-07-24

    申请人： Ho Kyun AHN ,  Jong-Won Lim ,  Sung Bum Bae ,  Sang Choon Ko ,  Young Rak Park ,  Woo Jin Chang ,  Jae Kyoung Mun ,  Eun Soo Nam ,  Jeong Jin Kim ,  Chull Won Ju

    发明人： Ho Kyun AHN ,  Jong-Won Lim ,  Sung Bum Bae ,  Sang Choon Ko ,  Young Rak Park ,  Woo Jin Chang ,  Jae Kyoung Mun ,  Eun Soo Nam ,  Jeong Jin Kim ,  Chull Won Ju

    IPC分类号： H01L29/78 ,  H01L21/20

    CPC分类号： H01L29/7786 ,  H01L29/2003 ,  H01L29/402 ,  H01L29/42316 ,  H01L29/66462 ,  H01L29/66863 ,  H01L29/8128

    摘要： A method for fabricating a field effect transistor according to an exemplary embodiment of the present disclosure includes: forming an active layer, a cap layer, an ohmic metal layer and an insulating layer on a substrate; forming multilayered photoresists on the insulating layer; patterning the multilayered photoresists to form a photoresist pattern including a first opening for gate electrode and a second opening for field electrode; etching the insulating layer by using the photoresist pattern as an etching mask so that the insulating layer in the first opening is etched more deeply and the cap layer is exposed through the first opening; etching the cap layer exposed by etching the insulating layer through the first opening to form a gate recess region; and depositing a metal on the gate recess region and the etched insulating layer to form a gate-field electrode layer.

    摘要翻译： 根据本公开的示例性实施例的制造场效应晶体管的方法包括：在衬底上形成有源层，覆盖层，欧姆金属层和绝缘层; 在所述绝缘层上形成多层光致抗蚀剂; 图案化多层光致抗蚀剂以形成包括用于栅电极的第一开口和场电极的第二开口的光致抗蚀剂图案; 通过使用光致抗蚀剂图案作为蚀刻掩模来蚀刻绝缘层，使得第一开口中的绝缘层被更深地蚀刻并且盖层通过第一开口暴露; 通过蚀刻绝缘层通过第一开口蚀刻暴露的盖层，以形成栅极凹陷区域; 以及在所述栅极凹部区域和所述蚀刻绝缘层上沉积金属以形成栅极电极层。

    Method of manufacturing field effect transistor
    4.
    发明授权
    Method of manufacturing field effect transistor 有权
    制造场效应晶体管的方法

    公开(公告)号：US07183149B2

    公开(公告)日：2007-02-27

    申请号：US11180726

    申请日：2005-07-14

    申请人： Ho Kyun Ahn ,  Jong Won Lim ,  Hong Gu Ji ,  Woo Jin Chang ,  Jae Kyoung Mun ,  Hae Cheon Kim

    发明人： Ho Kyun Ahn ,  Jong Won Lim ,  Hong Gu Ji ,  Woo Jin Chang ,  Jae Kyoung Mun ,  Hae Cheon Kim

    IPC分类号： H01L21/338

    CPC分类号： H01L29/66856 ,  H01L29/66462

    摘要： Provided is a method of manufacturing a field effect transistor (FET). The method includes steps of: forming an ohmic metal layer on a substrate in source and drain regions; sequentially forming an insulating layer and a multilayered resist layer on the entire surface of the resultant structure and simultaneously forming resist patterns having respectively different shapes in both a first region excluding the ohmic metal layer and a second region excluding the ohmic metal layer, wherein a lowermost resist pattern is exposed in the first region, and the insulating layer is exposed in the second region; exposing the substrate and the insulating layer by simultaneously etching the exposed insulating layer and the exposed lowermost resist pattern using the resist patterns as etch masks, respectively; performing a recess process on the exposed substrate and etching the exposed insulating layer to expose the substrate; and forming gate recess regions having different etching depths from each other over the substrate, depositing a predetermined gate metal, and removing the resist patterns. In this method, transistors having different threshold voltages can be manufactured without additional mask patterns using the least number of processes, with the results that the cost of production can be reduced and the stability and productivity of semiconductor devices can be improved.

    摘要翻译： 提供了制造场效应晶体管（FET）的方法。 该方法包括以下步骤：在源极和漏极区域的衬底上形成欧姆金属层; 在所得结构的整个表面上顺序地形成绝缘层和多层抗蚀剂层，并且同时形成除了欧姆金属层以外的第一区域和不包括欧姆金属层的第二区域中具有不同形状的抗蚀剂图案，其中最下面 抗蚀剂图案在第一区域中暴露，并且绝缘层在第二区域中暴露; 通过分别使用抗蚀剂图案作为蚀刻掩模，同时蚀刻暴露的绝缘层和暴露的最下面的抗蚀剂图案来暴露衬底和绝缘层; 对曝光的衬底进行凹陷处理并蚀刻暴露的绝缘层以露出衬底; 以及在衬底上形成具有彼此不同蚀刻深度的栅极凹陷区域，沉积预定的栅极金属和去除抗蚀剂图案。 在该方法中，可以使用最少数量的工艺来制造具有不同阈值电压的晶体管，而不需要额外的掩模图案，结果可以降低生产成本，并且可以提高半导体器件的稳定性和生产率。

    Semiconductor device with T-gate electrode
    5.
    发明授权
    Semiconductor device with T-gate electrode 失效
    具有T型栅电极的半导体器件

    公开(公告)号：US07973368B2

    公开(公告)日：2011-07-05

    申请号：US12122982

    申请日：2008-05-19

    申请人： Jong Won Lim ,  Ho Kyun Ahn ,  Hong Gu Ji ,  Woo Jin Chang ,  Jae Kyoung Mun ,  Hae Cheon Kim ,  Hyun Kyu Yu

    发明人： Jong Won Lim ,  Ho Kyun Ahn ,  Hong Gu Ji ,  Woo Jin Chang ,  Jae Kyoung Mun ,  Hae Cheon Kim ,  Hyun Kyu Yu

    IPC分类号： H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

    CPC分类号： H01L29/778 ,  H01L29/20 ,  H01L29/42316 ,  H01L29/66462

    摘要： Provided are a semiconductor device with a T-gate electrode capable of improving stability and a high frequency characteristic of the semiconductor device by reducing source resistance, parasitic capacitance, and gate resistance and a method of fabricating the same. In the semiconductor device, in order to form source and drain electrodes and the T-gate electrode on a substrate, first and second protective layers constructed with silicon oxide layers or silicon nitride layers are formed on sides of a supporting part under a head part of the T-gate electrode, and the second protective layer constructed with a silicon oxide layer or silicon nitride layer is formed on sides of the source and drain electrodes. Accordingly, it is possible to protect an activated region of the semiconductor device and reduce gate-drain parasitic capacitance and gate-source parasitic capacitance.

    摘要翻译： 提供一种具有T栅电极的半导体器件及其制造方法，该半导体器件能够通过降低源极电阻，寄生电容和栅极电阻来提高半导体器件的稳定性和高频特性。 在半导体器件中，为了在衬底上形成源电极和漏电极以及T栅电极，在氧化硅层或氮化硅层构成的第一和第二保护层形成在支撑部分的头部 在栅电极和漏电极的侧面上形成T形栅电极和由氧化硅层或氮化硅层构成的第二保护层。 因此，可以保护半导体器件的激活区域并减小栅极 - 漏极寄生电容和栅极 - 源极寄生电容。

    Transistor of semiconductor device and method of fabricating the same
    6.
    发明授权
    Transistor of semiconductor device and method of fabricating the same 有权
    半导体器件的晶体管及其制造方法

    公开(公告)号：US07871874B2

    公开(公告)日：2011-01-18

    申请号：US12396614

    申请日：2009-03-03

    申请人： Jae Kyoung Mun ,  Jong Won Lim ,  Woo Jin Chang ,  Hong Gu Ji ,  Ho Kyun Ahn ,  Hae Cheon Kim

    发明人： Jae Kyoung Mun ,  Jong Won Lim ,  Woo Jin Chang ,  Hong Gu Ji ,  Ho Kyun Ahn ,  Hae Cheon Kim

    IPC分类号： H01L21/338

    CPC分类号： H01L29/66462 ,  H01L29/7785

    摘要： Provided are a transistor of a semiconductor device and method of fabricating the same. The transistor includes: an epitaxy substrate disposed on a semi-insulating substrate and having a buffer layer, a first Si planar doping layer, a first conductive layer, a second Si planar doping layer, and a second conductive layer, which are sequentially stacked, the second Si planar doping layer having a doping concentration different from that of the first Si planar doping layer; a source electrode and a drain electrode diffusing into the first Si planar doping layer to a predetermined depth and disposed on both sides of the second conductive layer to form an ohmic contact; and a gate electrode disposed on the second conductive layer between the source and drain electrodes and being in contact with the second conductive layer. In this structure, both isolation and switching speed of the transistor can be increased. Also, the maximum voltage limit applied to the transistor is increased due to increases in gate turn-on voltage and threshold voltage and a reduction in parallel conduction element. As a result, the power handling capability of the transistor can be improved, thus improving a high-power low-distortion characteristic and an isolation characteristic.

    摘要翻译： 提供半导体器件的晶体管及其制造方法。 晶体管包括：设置在半绝缘衬底上并具有缓冲层的外延衬底，第一Si平面掺杂层，第一导电层，第二Si平面掺杂层和第二导电层， 所述第二Si平面掺杂层具有与所述第一Si平面掺杂层的掺杂浓度不同的掺杂浓度; 源极电极和漏电极，其扩散到所述第一Si平面掺杂层中至预定深度并且设置在所述第二导电层的两侧以形成欧姆接触; 以及设置在所述源极和漏极之间的所述第二导电层上并与所述第二导电层接触的栅电极。 在这种结构中，可以提高晶体管的隔离和开关速度。 此外，施加到晶体管的最大电压限制由于栅极导通电压和阈值电压的增加以及并联导通元件的减小而增加。 结果，可以提高晶体管的功率处理能力，从而提高高功率低失真特性和隔离特性。

    Transistor or semiconductor device comprising ohmic contact in an epitaxy substrate
    7.
    发明授权
    Transistor or semiconductor device comprising ohmic contact in an epitaxy substrate 有权
    在外延衬底中包括欧姆接触的晶体管或半导体器件

    公开(公告)号：US07518166B2

    公开(公告)日：2009-04-14

    申请号：US11179971

    申请日：2005-07-12

    申请人： Jae Kyoung Mun ,  Jong Won Lim ,  Woo Jin Chang ,  Hong Gu Ji ,  Ho Kyun Ahn ,  Hae Cheon Kim

    发明人： Jae Kyoung Mun ,  Jong Won Lim ,  Woo Jin Chang ,  Hong Gu Ji ,  Ho Kyun Ahn ,  Hae Cheon Kim

    IPC分类号： H01L29/74

    CPC分类号： H01L29/66462 ,  H01L29/7785

    摘要： Provided are a transistor of a semiconductor device and method of fabricating the same. The transistor includes: an epitaxy substrate disposed on a semi-insulating substrate and having a buffer layer, a first Si planar doping layer, a first conductive layer, a second Si planar doping layer, and a second conductive layer, which are sequentially stacked, the second Si planar doping layer having a doping concentration different from that of the first Si planar doping layer; a source electrode and a drain electrode diffusing into the first Si planar doping layer to a predetermined depth and disposed on both sides of the second conductive layer to form an ohmic contact; and a gate electrode disposed on the second conductive layer between the source and drain electrodes and being in contact with the second conductive layer. In this structure, both isolation and switching speed of the transistor can be increased. Also, the maximum voltage limit applied to the transistor is increased due to increases in gate turn-on voltage and threshold voltage and a reduction in parallel conduction element. As a result, the power handling capability of the transistor can be improved, thus improving a high-power low-distortion characteristic and an isolation characteristic.

    摘要翻译： 提供半导体器件的晶体管及其制造方法。 晶体管包括：设置在半绝缘衬底上并具有缓冲层的外延衬底，第一Si平面掺杂层，第一导电层，第二Si平面掺杂层和第二导电层， 所述第二Si平面掺杂层具有与所述第一Si平面掺杂层的掺杂浓度不同的掺杂浓度; 源极电极和漏电极，其扩散到所述第一Si平面掺杂层中至预定深度并且设置在所述第二导电层的两侧以形成欧姆接触; 以及设置在所述源极和漏极之间的所述第二导电层上并与所述第二导电层接触的栅电极。 在这种结构中，可以提高晶体管的隔离和开关速度。 此外，施加到晶体管的最大电压限制由于栅极导通电压和阈值电压的增加以及并联导通元件的减小而增加。 结果，可以提高晶体管的功率处理能力，从而提高高功率低失真特性和隔离特性。

    Method of forming T- or gamma-shaped electrode
    10.
    发明申请
    Method of forming T- or gamma-shaped electrode 审中-公开
    形成T形或γ形电极的方法

    公开(公告)号：US20080124852A1

    公开(公告)日：2008-05-29

    申请号：US11605508

    申请日：2006-11-28

    申请人： Ho Kyun Ahn ,  Jong Won Lim ,  Jae Kyoung Mun ,  Woo Jin Chang ,  Hong Gu Ji ,  Hae Cheon Kim

    发明人： Ho Kyun Ahn ,  Jong Won Lim ,  Jae Kyoung Mun ,  Woo Jin Chang ,  Hong Gu Ji ,  Hae Cheon Kim

    IPC分类号： H01L21/338

    CPC分类号： H01L29/4232 ,  H01L21/28587 ,  H01L21/28593

    摘要： A method of forming a fine T- or gamma-shaped gate electrode is provided, which is performed by a lithography process using a multi-layered photoresist layer having various sensitivities, deposition of an insulating layer, and an etching process. The method includes: a first step of depositing a first insulating layer on a semiconductor substrate; a second step of coating at least two photoresist layers with different sensitivities from each other on the first insulating layer, and patterning the photoresist layers to have openings which are different in size; a third step of etching the first insulating layer using the photoresist layers as etch masks to form a step hole in which a part contacting the substrate is narrower than an upper part thereof, and removing the photoresist layers; a fourth step of forming a photoresist layer on the first insulating layer, and forming an opening in the photoresist layer to have a T- or gamma-shaped gate head pattern; a fifth step of performing a gate recess process with respect to the gate pattern; and a sixth step of depositing a gate metal on the gate pattern, and removing the photoresist layers.

    摘要翻译： 提供了一种通过使用具有各种灵敏度的多层光致抗蚀剂层，沉积绝缘层和蚀刻工艺的光刻工艺来形成精细的T形或γ形栅电极的方法。 该方法包括：在半导体衬底上沉积第一绝缘层的第一步骤; 在所述第一绝缘层上涂覆彼此具有不同灵敏度的至少两个光致抗蚀剂层的第二步骤，以及使所述光致抗蚀剂层图案化以具有尺寸不同的开口; 使用光致抗蚀剂层作为蚀刻掩模来蚀刻第一绝缘层以形成步骤孔的第三步骤，其中与衬底接触的部分比其上部更窄，并且去除光致抗蚀剂层; 在所述第一绝缘层上形成光致抗蚀剂层，以及在所述光致抗蚀剂层中形成具有T形或γ形门头图案的开口的第四步骤; 执行相对于栅极图案的栅极凹槽工艺的第五步骤; 以及在栅极图案上沉积栅极金属和去除光致抗蚀剂层的第六步骤。