利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

268 条记录 (耗时 0.056 秒)

    Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith
    1.
    发明授权
    Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith 失效
    具有分散剂分布均匀的金属粉末的方法，其使用方法和用其制造的结构

    公开(公告)号：US5296189A

    公开(公告)日：1994-03-22

    申请号：US874901

    申请日：1992-04-28

    申请人： Sung K. Kang ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Subhash L. Shinde

    发明人： Sung K. Kang ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Subhash L. Shinde

    IPC分类号： B01F3/18 ,  B22F1/00 ,  B22F9/04 ,  C22C1/10 ,  H05K1/09 ,  B22F7/00

    CPC分类号： H05K1/092 ,  B22F9/04 ,  C22C1/1084 ,  B22F2009/043 ,  B22F2999/00

    摘要： Methods of fabricating powders of metal particles containing grain growth control additives are described. A powder, metal particles, e.g., copper particles, are mixed with a powder of additive particles, e.g., alumina particles. The mixture is milled in a high energy ball mill to provide metal particles having substantially uniformly distributed therein of additive particles. The ball milled powder contains elongated high aspect ratio particles. The high aspect ratio particles are reduced in size by jet impact milling. The jet impact milled powder can be used to form a conductor forming paste in the fabrication of a metallized ceramic substrate for semiconductor chip packaging application. The jet impact milled powder has particles of sufficiently small in size to fill vias between metallization layers in the green ceramic precursor to the ceramic substrate. During sintering of the combination of ceramic precursor and conductor forming paste, the grain growth control additive results in a substantially void free via filled with metal having a fine grain morphology.

    摘要翻译： 描述了制备含有晶粒生长控制添加剂的金属颗粒粉末的方法。 将粉末，金属颗粒（例如铜颗粒）与添加剂颗粒如氧化铝颗粒的粉末混合。 将混合物在高能球磨机中研磨，以提供基本均匀分布有添加剂颗粒的金属颗粒。 球磨粉末含有细长的高纵横比颗粒。 通过喷射冲击研磨，高纵横比颗粒的尺寸减小。 喷射冲击研磨粉末可用于在制造用于半导体芯片封装应用的金属化陶瓷衬底的过程中形成导体形成膏。 喷射冲击研磨的粉末具有足够小的颗粒，以在陶瓷衬底的生坯陶瓷前体中的金属化层之间填充通孔。 在烧结陶瓷前体和导体形成浆料的组合期间，晶粒生长控制添加剂导致填充有具有细晶粒形态的金属的基本上无空隙的通孔。

    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
    2.
    发明授权
    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
    多层包装中的粘合层和有机材料作为金属扩散屏障

    公开(公告)号：US5599582A

    公开(公告)日：1997-02-04

    申请号：US475412

    申请日：1995-06-07

    申请人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    发明人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    IPC分类号： B32B7/10 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/52 ,  H05K1/03 ,  H05K3/46 ,  B05D5/10

    CPC分类号： C08G73/1089 ,  C08G73/1003 ,  C08G73/1007 ,  C08G73/101 ,  H01B3/306 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

    摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

    摘要翻译： 本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层 的末端不饱和粘合聚酰亚胺和聚酰亚胺。 在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络 嵌入在陶瓷和/或聚合物基材内。 还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。 新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。 本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
    3.
    发明授权
    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
    多层包装中的粘合层和有机材料作为金属扩散屏障

    公开(公告)号：US5582858A

    公开(公告)日：1996-12-10

    申请号：US474985

    申请日：1995-06-07

    申请人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    发明人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    IPC分类号： B32B7/10 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/52 ,  H05K1/03 ,  H05K3/46 ,  B05D5/10

    CPC分类号： C08G73/1089 ,  C08G73/1003 ,  C08G73/1007 ,  C08G73/101 ,  H01B3/306 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

    摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

    摘要翻译： 本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层 的末端不饱和粘合聚酰亚胺和聚酰亚胺。 在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络 嵌入在陶瓷和/或聚合物基材内。 在制造该制品时，可以在接合操作之前将表面处理技术如湿法或等离子体/任选的硅烷偶联剂施加到基底，粘合聚酰亚胺膜或聚酰亚胺膜上。 还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。 新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。 本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
    4.
    发明授权
    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
    多层包装中的粘合层和有机材料作为金属扩散屏障

    公开(公告)号：US5326643A

    公开(公告)日：1994-07-05

    申请号：US771929

    申请日：1991-10-07

    申请人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    发明人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    IPC分类号： B32B7/10 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/52 ,  H05K1/03 ,  H05K3/46 ,  B32B9/00

    CPC分类号： C08G73/1089 ,  C08G73/1003 ,  C08G73/1007 ,  C08G73/101 ,  H01B3/306 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

    摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

    摘要翻译： 本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层 的末端不饱和粘合聚酰亚胺和聚酰亚胺。 在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络 嵌入在陶瓷和/或聚合物基材内。 在制造该制品时，可以在接合操作之前将表面处理技术如湿法或等离子体/任选的硅烷偶联剂施加到基底，粘合聚酰亚胺膜或聚酰亚胺膜上。 还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。 新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。 本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

    Precision alignment of plates
    6.
    发明授权
    Precision alignment of plates 有权
    板的精确对准

    公开(公告)号：US6104466A

    公开(公告)日：2000-08-15

    申请号：US226475

    申请日：1999-01-07

    申请人： Stephen L. Buchwalter ,  David A. Lewis ,  Shui-Chih Alan Lien ,  Sampath Purushothaman ,  John J. Ritsko

    发明人： Stephen L. Buchwalter ,  David A. Lewis ,  Shui-Chih Alan Lien ,  Sampath Purushothaman ,  John J. Ritsko

    IPC分类号： G02F1/1333 ,  G02F1/13 ,  G02F1/0337

    CPC分类号： G02F1/1333 ,  G02F2001/133354

    摘要： A system for aligning two plates, in accordance with the present invention, includes a first plate having a lithographically patterned structure formed on a first surface. A second plate also has a lithographically patterned structure formed on a second surface, the first and second surfaces being disposed to face each other. The patterned structures of the plates have corresponding and opposing edges to provide an interference fit between the patterned structures of the first and second plates wherein self-alignment between the first and second plates is realized by engaging the corresponding and opposing edges in the interference fit. A method for aligning two plates includes the steps of providing the system described above, coarsely aligning the plates in a first state which includes an interference between the patterned structures, adjusting at least one of plates to provide a second state having a clearance fit between the patterned structures and moving the plates together and returning to the first state to align the plates relative to each other.

    摘要翻译： 根据本发明的用于对准两个板的系统包括形成在第一表面上的具有光刻图案化结构的第一板。 第二板还具有形成在第二表面上的光刻图案结构，第一和第二表面被设置为彼此面对。 板的图案化结构具有对应的和相对的边缘，以在第一和第二板的图案化结构之间提供过盈配合，其中第一和第二板之间的自对准是通过在干涉配合中接合相应和相对的边缘来实现的。 一种用于对准两个板的方法包括以下步骤：提供上述系统，在第一状态下将板粗略对准，该第一状态包括图案化结构之间的干涉，调节板中的至少一个以提供第二状态， 图案化结构并将板移动到一起并返回到第一状态以使板相对于彼此对准。

    Precision alignment of plates
    10.
    发明授权
    Precision alignment of plates 失效
    板的精确对准

    公开(公告)号：US06177975B1

    公开(公告)日：2001-01-23

    申请号：US09559958

    申请日：2000-04-27

    申请人： Stephen L. Buchwalter ,  David A. Lewis ,  Shui-Chih Alan Lien ,  Sampath Purushothaman ,  John J. Ritsko

    发明人： Stephen L. Buchwalter ,  David A. Lewis ,  Shui-Chih Alan Lien ,  Sampath Purushothaman ,  John J. Ritsko

    IPC分类号： G02F113

    CPC分类号： G02F1/1333 ,  G02F2001/133354

    摘要： A system for aligning two plates, in accordance with the present invention, includes a first plate having a lithographically patterned structure formed on a first surface. A second plate also has a lithographically patterned structure formed on a second surface, the first and second surfaces being disposed to face each other. The patterned structures of the plates have corresponding and opposing edges to provide an interference fit between the patterned structures of the first and second plates wherein self-alignment between the first and second plates is realized by engaging the corresponding and opposing edges in the interference fit. A method for aligning two plates includes the steps of providing the system described above, coarsely aligning the plates in a first state which includes an interference between the patterned structures, adjusting at least one of plates to provide a second state having a clearance fit between the patterned structures and moving the plates together and returning to the first state to align the plates relative to each other.

    摘要翻译： 根据本发明的用于对准两个板的系统包括形成在第一表面上的具有光刻图案化结构的第一板。 第二板还具有形成在第二表面上的光刻图案结构，第一和第二表面被设置为彼此面对。 板的图案化结构具有对应的和相对的边缘，以在第一和第二板的图案化结构之间提供过盈配合，其中第一和第二板之间的自对准是通过在干涉配合中接合相应和相对的边缘来实现的。 一种用于对准两个板的方法包括以下步骤：提供上述系统，在第一状态下将板粗略对准，该第一状态包括图案化结构之间的干涉，调节板中的至少一个以提供第二状态， 图案化结构并将板移动到一起并返回到第一状态以使板相对于彼此对准。