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    Micro-Pattern Forming Method, and Micro-Channel Transistor and Micro-Channel Light-Emitting Transistor Forming Method Using Same
    1.
    发明申请
    Micro-Pattern Forming Method, and Micro-Channel Transistor and Micro-Channel Light-Emitting Transistor Forming Method Using Same 有权
    微图案形成方法和微通道晶体管和微通道发光晶体管的形成方法

    公开(公告)号：US20130203198A1

    公开(公告)日：2013-08-08

    申请号：US13877875

    申请日：2011-10-06

    申请人： Sung Yong Min ,  Tae Sik Kim ,  Tae-Woo Lee

    发明人： Sung Yong Min ,  Tae Sik Kim ,  Tae-Woo Lee

    IPC分类号： H01L51/00

    CPC分类号： H01L51/0005 ,  B81C1/00031 ,  G03F7/164 ,  H01L51/0016 ,  H01L51/0023 ,  H01L51/0541 ,  H01L51/0545 ,  H01L51/102 ,  H01L51/428 ,  H01L51/5296 ,  Y02E10/549

    摘要： Provided is a method of forming a micropattern according to an aspect of the present invention. The method of forming a micropattern may include forming an organic wire or organic-inorganic hybrid wire mask pattern having a circular or elliptical cross section on a substrate, forming a material layer on an entire surface of the substrate having the organic wire or organic-inorganic hybrid wire mask pattern formed thereon, and removing the organic wire or organic-inorganic hybrid wire mask pattern from the substrate to allow only the material layer on a portion of the substrate having no organic wire or organic-inorganic hybrid wire mask pattern formed thereon to be remained.

    摘要翻译： 提供了根据本发明的一个方面的形成微图案的方法。 形成微图案的方法可以包括在基板上形成具有圆形或椭圆形横截面的有机线或有机 - 无机混合线掩模图案，在具有有机线或有机 - 无机的基底的整个表面上形成材料层 在其上形成的混合线掩模图案，以及从基板去除有机线或有机 - 无机混合线掩模图案，以仅允许在其上形成的无机线或有机 - 无机混合线掩模图案的基板的一部分上的材料层 留下来

    ELECTRIC FIELD AUXILIARY ROBOTIC NOZZLE PRINTER AND METHOD FOR MANUFACTURING ORGANIC WIRE PATTERN ALIGNED USING SAME
    3.
    发明申请
    ELECTRIC FIELD AUXILIARY ROBOTIC NOZZLE PRINTER AND METHOD FOR MANUFACTURING ORGANIC WIRE PATTERN ALIGNED USING SAME 审中-公开
    电动辅助机器人喷嘴和制造有机电路图案的方法

    公开(公告)号：US20130216724A1

    公开(公告)日：2013-08-22

    申请号：US13877806

    申请日：2011-10-06

    申请人： Tae-Woo Lee ,  Sung Yong Min

    发明人： Tae-Woo Lee ,  Sung Yong Min

    IPC分类号： H01B13/00

    CPC分类号： H01B13/0026 ,  B82Y40/00 ,  H01L51/0005 ,  H01L51/0022 ,  H01L51/0036 ,  H01L51/0042 ,  H01L51/0558

    摘要： Provided according to an aspect of the present disclosure is an electric field aided robotic nozzle printer including a solution storage apparatus for supplying a discharging solution; a nozzle for discharging the discharging solution supplied by the solution storage apparatus; a voltage applying apparatus for applying high voltage onto the nozzle; a flat and movable collector, in which organic wires formed after discharge from the nozzle are aligned; a robot stage, which is installed below the collector and enables to move the collector in an x-y direction (horizontal direction) within a horizontal plane; a micro distance controller for regulating the distance between the nozzle and the collector in a Z direction (vertical direction); and a base plate, which is installed below the robot stage, for maintaining flatness of the collector and preventing vibration generated during the operation of the robot stage.

    摘要翻译： 根据本公开的一个方面提供的是一种电场辅助机器人喷嘴打印机，其包括用于提供排放溶液的溶液存储装置; 用于排出由溶液储存装置供应的排放溶液的喷嘴; 用于向喷嘴施加高电压的电压施加装置; 平面可动集电体，其中从喷嘴排出后形成的有机线对齐; 机器人台架，其安装在收集器下方，能够在水平面内沿x-y方向（水平方向）移动收集器; 用于在Z方向（垂直方向）上调节喷嘴和收集器之间的距离的微距离控制器; 以及安装在机器人台下方的基板，用于保持集电器的平整度，并防止在机器人工作台的操作期间产生的振动。

    Forced air injection system for rapid evaporation of wastewater
    4.
    发明授权
    Forced air injection system for rapid evaporation of wastewater 有权

    公开(公告)号：US11220439B2

    公开(公告)日：2022-01-11

    申请号：US16901230

    申请日：2020-06-15

    申请人： Tae-Woo Lee

    发明人： Tae-Woo Lee

    IPC分类号： C02F1/04 ,  B01D1/20 ,  B01D1/14

    摘要： A wastewater evaporation system includes a plurality of tube sections configured to direct compressed air into the wastewater. A portion of the manifold defines an injection head configured to be at least partially submerged below a surface of the wastewater. The wastewater evaporation system also includes an air compressor configured to direct the compressed air to the manifold. The wastewater evaporation system also includes a buoy system coupled to the manifold. The buoy system includes a buoy configured to maintain a portion of the manifold above the surface of the wastewater.