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1.发明申请公开(公告)号：US20200230701A1
公开(公告)日：2020-07-23
申请号：US16486140
申请日：2018-04-04
摘要： A sealing structure with a surface of a base material with a through-hole, an underlying metal film, and a sealing member bonded to the underlying metal film to seal the through-hole. The sealing member includes a compressed product of a metal powder including gold having a purity of 99.9% by mass or more and a lid-like metal film including a bulk-like metal including gold and having a thickness of not less than 0.01 μm and not more than 5 μm. The sealing material includes an outer periphery-side densified region in contact with an underlying metal film and a center-side porous region in contact with the through-hole. The shape of pores in the densified region is specified, and the horizontal length (l) of a pore in the radial direction at any cross-section of the densified region and the width (W) of the densified region satisfy the relationship of l≤0.1W.
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公开(公告)号：US20220219237A1
公开(公告)日：2022-07-14
申请号：US17632221
申请日：2020-07-20
摘要： A gold powder comprising gold having a purity of 99.9% by mass or more and having an average particle size of 0.01 μm or more and 1.0 μm or less, a content of a chloride ion is 100 ppm or less, and a content of a cyanide ion is 10 ppm or more and 1000 ppm or less. A total of the content of a chloride ion and the content of a cyanide ion is preferably 110 ppm or more and 1000 ppm or less. The gold powder has improved adaptability to various processes including bonding or the like with a content of a chloride ion, that is, an impurity, optimized. A gold paste using this gold powder is suitably used in various uses for bonding such as die bonding of a semiconductor chip, sealing a semiconductor package, and forming an electrode/wire.
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3.发明申请公开(公告)号：US20220102228A1
公开(公告)日：2022-03-31
申请号：US16083162
申请日：2017-04-06
IPC分类号： H01L23/10 , H01L21/48 , H01L21/683
摘要： A sealing structure including: a set of base members forming a sealed space; a through-hole which is formed in at least one of the base members, and communicates with the sealed space; and a sealing member that seals the through-hole. An underlying metal film including a bulk-like metal such as gold is provided on a surface of the base member provided with the through-hole. The sealing member seals the through-hole while being bonded to the underlying metal film, and includes: a sealing material which is bonded to the underlying metal film, and includes a compressed product of a metal powder of gold or the like, the metal powder having a purity of 99.9% by mass or more; and a lid-like metal film which is bonded to the sealing material, and includes a bulk-like metal such as gold. Further, the sealing material includes: an outer periphery-side densified region being in contact with an underlying metal film; and a center-side porous region being in contact with the through-hole. The densified region has a porosity of 10% or less in terms of an area ratio at any cross-section.
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公开(公告)号：US20180044175A1
公开(公告)日：2018-02-15
申请号：US15556161
申请日：2015-08-18
IPC分类号： B81C1/00
CPC分类号： B81C1/00269 , B81C3/00 , B81C2203/0118 , B81C2203/019 , B81C2203/036 , H01L23/02
摘要： The present invention relates to a package production method includes the step of superposing a pair of substrates on each other, and bonding the substrates to each other to hermetically seal the inside of a sealing region surrounded by a sealing material, which is formed on any of the substrates. The sealing material is formed of a sintered body obtained by sintering a metal powder of at least one selected from gold, silver, palladium and platinum, the metal powder having a purity of 99.9% by weight or more and an average particle size of 0.005 μm to 1.0 μm, at least one core material having a width smaller than the width of the sealing material in a cross-sectional shape, and protruding from the periphery is formed on the substrate, and the core material compresses the sealing material to exhibit a sealing effect when the pair of substrates are bonded to each other. Accordingly, a sufficient sealing effect can be exhibited while a pressuring force to the substrate is reduced.
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5.发明申请AIRTIGHT-SEALING PACKAGE MEMBER, PRODUCTION METHOD THEREFOR, AND AIRTIGHT-SEALED PACKAGE PRODUCTION METHOD USING THIS AIRTIGHT-SEALING PACKAGE MEMBER 有权空气密封包装件，其生产方法和使用这种密封包装件的空气密封包装生产方法公开(公告)号：US20160311677A1
公开(公告)日：2016-10-27
申请号：US15102215
申请日：2014-12-22
CPC分类号： B81B7/0045 , B81C1/00269 , B81C1/00325 , B81C2203/019 , H01B1/02 , H01L21/50 , H01L21/56 , H01L23/00 , H01L23/10 , H01L24/94 , H01L51/5243 , H01L51/5246 , H01L2924/0002 , H01L2924/10253 , H01L2924/16235 , H01L2924/16598 , H01L2924/167 , H01L2924/00
摘要： The present invention is to provide an hermetic-sealing package member including a substrate and at least one frame-like sealing material for defining a sealing region formed on the substrate, in which the sealing material is formed of a sintered body obtained by sintering at least one metal powder selected from gold, silver, palladium, or platinum having a purity of 99.9 wt % or greater and an average particle size of 0.005 μm to 1.0 μm, and with respect to an arbitrary cross-section toward an outside from the sealing region, a length of an upper end of the sealing material is shorter than a length of a lower end. Examples of a cross-sectional shape of the sealing material may include one formed to have a base portion having a certain height and at least one mountain portion protruding from the base portion or one formed to have a mountain portion having substantially a triangular shape in which the length of the lower end of the sealing material is a bottom. By use of the hermetic-sealing package member of the present invention, a load is reduced at the time of hermetic-sealing and a sufficient sealing effect can be obtained.
摘要翻译： 本发明提供一种密封封装构件，其包括基板和至少一个框状密封材料，用于限定形成在基板上的密封区域，其中密封材料由至少烧结获得的烧结体形成 选自纯度为99.9重量％以上，平均粒径为0.005〜1.0微米的金，银，钯或铂的一种金属粉末，并且相对于从密封区域向外侧的任意横截面 密封材料的上端的长度比下端的长度短。 密封材料的截面形状的实例可以包括形成为具有一定高度的基部和从基部突出的至少一个山部或形成为具有基本上三角形形状的山部的一个，其中 密封材料的下端的长度为底部。 通过使用本发明的密封封装构件，在气密密封时减少了负荷，可获得足够的密封效果。
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