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公开(公告)号:US09726552B2
公开(公告)日:2017-08-08
申请号:US14642053
申请日:2015-03-09
Applicant: TDK CORPORATION
Inventor: Takeshi Yanata , Yo Saito , Kazuto Takeya , Katsunari Moriai , Takashi Inagaki , Takahiro Itami , Takeshi Oyanagi , Hitoshi Ishida
CPC classification number: G01K7/22 , G01K1/14 , H01L41/0533 , H03H9/02102 , H03H9/0519 , H03H9/0557 , H03H9/1014 , H03H9/1021
Abstract: Provided is a piezoelectric device capable of improving measurement precision of a temperature of a piezoelectric element. A piezoelectric device (1) includes a package (2) including a housing member (4) having a thermistor substrate (3) and a frame (7) provided to project from a first main surface (3a) of the thermistor substrate (3) and in which a housing part (6) is formed by the first main surface (3a) and the frame (7) and a lid (9) provided on the frame (7) to cover a space (5) of the housing part (6), and a piezoelectric vibration element (5) provided on the first main surface (3a) of the thermistor substrate (3) in the housing part (6), wherein the thermistor substrate (3) is a multilayer negative temperature coefficient (NTC) thermistor.
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公开(公告)号:US10575404B2
公开(公告)日:2020-02-25
申请号:US16134733
申请日:2018-09-18
Applicant: TDK CORPORATION
Inventor: Naoyoshi Yoshida , Kouki Yamada , Hisashi Aiba , Kazuto Takeya , Hiroya Nakamura
Abstract: An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.
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公开(公告)号:US09762203B2
公开(公告)日:2017-09-12
申请号:US14596696
申请日:2015-01-14
Applicant: TDK CORPORATION
Inventor: Takeshi Yanata , Yo Saito , Kazuto Takeya , Katsunari Moriai , Takashi Inagaki , Takahiro Itami , Takeshi Oyanagi , Hitoshi Ishida
IPC: H01L41/053 , H03H9/10
CPC classification number: H03H9/1021 , H01L41/053 , H01L2924/16195
Abstract: A piezoelectric device has: a ceramic substrate having a first principal surface and a second principal surface opposed to each other; a piezoelectric element arranged on the first principal surface; a frame having a first face and a second face opposed to each other and arranged on the ceramic substrate so as to surround the piezoelectric element; a metal layer arranged on the second face of the frame; and a metal lid arranged on the metal layer so as to close a space surrounded by the frame. The first face of the frame is in contact with the first principal surface of the ceramic substrate. The metal layer and the metal lid are joined to each other by resistance welding. The frame has a composite portion containing a metal and a metal oxide and the composite portion includes the second face and is in contact with the metal layer.
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