公开(公告)号：US09762203B2

公开(公告)日：2017-09-12

申请号：US14596696

申请日：2015-01-14

Applicant: TDK CORPORATION

Inventor： Takeshi Yanata ,  Yo Saito ,  Kazuto Takeya ,  Katsunari Moriai ,  Takashi Inagaki ,  Takahiro Itami ,  Takeshi Oyanagi ,  Hitoshi Ishida

IPC: H01L41/053 ,  H03H9/10

CPC classification number: H03H9/1021 ,  H01L41/053 ,  H01L2924/16195

Abstract: A piezoelectric device has: a ceramic substrate having a first principal surface and a second principal surface opposed to each other; a piezoelectric element arranged on the first principal surface; a frame having a first face and a second face opposed to each other and arranged on the ceramic substrate so as to surround the piezoelectric element; a metal layer arranged on the second face of the frame; and a metal lid arranged on the metal layer so as to close a space surrounded by the frame. The first face of the frame is in contact with the first principal surface of the ceramic substrate. The metal layer and the metal lid are joined to each other by resistance welding. The frame has a composite portion containing a metal and a metal oxide and the composite portion includes the second face and is in contact with the metal layer.

公开(公告)号：US09324483B2

公开(公告)日：2016-04-26

申请号：US14514738

申请日：2014-10-15

Applicant: TDK CORPORATION

Inventor： Yo Saito ,  Kouki Yamada ,  Daisuke Tsuchida

IPC: H01C3/04 ,  H01C7/00 ,  H01C1/14 ,  H01C7/04 ,  H01C17/00 ,  H01C7/02

CPC classification number: H01C7/008 ,  H01C1/1413 ,  H01C7/023 ,  H01C7/04 ,  H01C7/043 ,  H01C17/00 ,  H01C17/006 ,  Y10T29/49085

Abstract: A chip thermistor 1 has a thermistor portion 7 comprised of a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions 9, 9 comprised of a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion 7 so as to sandwich in the thermistor portion 7 between the composite portions 9, 9; and external electrodes 5, 5 connected to the pair of composite portions 9, 9, respectively. In this manner, the pair of composite portions 9, 9 are used as bulk electrodes and, for this reason, the resistance of the chip thermistor 1 can be adjusted mainly with consideration to the resistance in the thermistor portion 7, without need for much consideration to the distance between the external electrodes 5, 5 and other factors.

Abstract translation: 片式热敏电阻1具有热敏电阻部7，其由含有Mn，Ni，Co的各种金属氧化物的陶瓷材料构成，作为主要成分; 由Ag-Pd的复合材料和Mn，Ni和Co的各种金属氧化物构成的一对复合部分9,9，并且布置在热敏电阻部分7的两侧，以夹在热敏电阻部分7之间 复合部分9,9; 以及分别与一对复合部9,9连接的外部电极5,5。 以这种方式，一对复合部分9,9被用作体电极，为此，可以主要考虑到热敏电阻部分7中的电阻来调整芯片热敏电阻1的电阻，而不需要太多考虑 到外部电极5,5之间的距离等因素。

公开(公告)号：US09726552B2

公开(公告)日：2017-08-08

申请号：US14642053

申请日：2015-03-09

Applicant: TDK CORPORATION

Inventor： Takeshi Yanata ,  Yo Saito ,  Kazuto Takeya ,  Katsunari Moriai ,  Takashi Inagaki ,  Takahiro Itami ,  Takeshi Oyanagi ,  Hitoshi Ishida

IPC: H01L41/053 ,  H03H9/08 ,  G01K1/14 ,  G01K7/22 ,  H03H9/05 ,  H03H9/02 ,  H03H9/10

CPC classification number: G01K7/22 ,  G01K1/14 ,  H01L41/0533 ,  H03H9/02102 ,  H03H9/0519 ,  H03H9/0557 ,  H03H9/1014 ,  H03H9/1021

Abstract: Provided is a piezoelectric device capable of improving measurement precision of a temperature of a piezoelectric element. A piezoelectric device (1) includes a package (2) including a housing member (4) having a thermistor substrate (3) and a frame (7) provided to project from a first main surface (3a) of the thermistor substrate (3) and in which a housing part (6) is formed by the first main surface (3a) and the frame (7) and a lid (9) provided on the frame (7) to cover a space (5) of the housing part (6), and a piezoelectric vibration element (5) provided on the first main surface (3a) of the thermistor substrate (3) in the housing part (6), wherein the thermistor substrate (3) is a multilayer negative temperature coefficient (NTC) thermistor.

公开(公告)号：US09230718B2

公开(公告)日：2016-01-05

申请号：US14061238

申请日：2013-10-23

Applicant: TDK CORPORATION

Inventor： Daisuke Tsuchida ,  Yo Saito ,  Kouki Yamada

IPC: H01C7/10 ,  H01C7/00 ,  H01C1/148 ,  H01C17/28 ,  H01C17/00 ,  H01G4/232

CPC classification number: H01C7/008 ,  H01C1/148 ,  H01C17/006 ,  H01C17/283 ,  H01G4/2325

Abstract: A chip thermistor includes a thermistor element body and a pair of outer electrodes. The thermistor element body has a pair of end faces opposing each other and a main face connecting the end faces to each other. The pair of outer electrodes are arranged on the pair of end faces, respectively. The pair of outer electrodes have a width in a direction intersecting the opposing direction of the pair of end faces made narrower with distance from the thermistor element body.

Abstract translation: 片式热敏电阻包括热敏电阻元件本体和一对外电极。 热敏电阻元件主体具有彼此相对的一对端面和将端面彼此连接的主面。 一对外电极分别设置在一对端面上。 一对外部电极在与热敏电阻元件主体的距离变窄的方向上与所述一对端面的相对方向相交的方向具有宽度。