公开(公告)号：US20240079222A1

公开(公告)日：2024-03-07

申请号：US18262444

申请日：2022-01-19

申请人： Tokyo Electron Limited

发明人： Takashi Terada ,  Yuji Mimura ,  Hiroshi Maeda ,  Takuro Masuzumi ,  Masaru Honda ,  Ryoichi Sakamoto

IPC分类号： H01J37/32 ,  G01N21/71 ,  H01J49/42 ,  H01L21/67

CPC分类号： H01J37/32917 ,  G01N21/718 ,  H01J49/42 ,  H01L21/67092 ,  H01J2237/24571 ,  H01J2237/336 ,  H01L24/80

摘要： A surface modifying apparatus is configured to modify a bonding surface of a substrate to be bonded to another substrate by plasma of a processing gas. The surface modifying apparatus includes a processing vessel; a measuring unit; and a controller. The processing vessel is configured to accommodate the substrate therein. The measuring unit is configured to measure a value indicating an amount of moisture in the processing vessel. The controller is configured to determine whether or not bonding strength between the substrate and the another substrate, when it is assumed that the substrate modified in the processing vessel is bonded to the another substrate, is good based on the value indicating the amount of moisture in the processing vessel measured by the measuring unit.

公开(公告)号：US09724906B2

公开(公告)日：2017-08-08

申请号：US14633393

申请日：2015-02-27

申请人： TOKYO ELECTRON LIMITED

发明人： Masanori Itou ,  Ryoichi Sakamoto ,  Takashi Sakaue

IPC分类号： B32B38/10 ,  B32B43/00 ,  H01L21/67 ,  H01L21/683

CPC分类号： B32B43/006 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/6838 ,  H01L2221/6839 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1184 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1978

摘要： A delamination method for delaminating a laminated substrate which includes a first and a second substrates bonded to each other, includes: adjusting a position of the laminated substrate at a holding unit by a position adjusting unit and disposing the holding unit at a predetermined height position; disposing a sharp member of a delamination inducing unit at a predetermined height position; detecting a contact of the sharp member by bringing the sharp member into contact with a side surface of one end portion of the laminated substrate; inserting the sharp member into the side surface of the one end portion of the laminated substrate; and delaminating the second substrate from the first substrate by a plurality of suction movement units which sucks the second substrate of the laminated substrate to move the second substrate away from the first substrate.

公开(公告)号：US20240079214A1

公开(公告)日：2024-03-07

申请号：US18262422

申请日：2022-01-13

申请人： Tokyo Electron Limited

发明人： Yuji Mimura ,  Hiroshi Maeda ,  Takuro Masuzumi ,  Takashi Terada ,  Masaru Honda ,  Ryoichi Sakamoto ,  Takashi Fuse ,  Yusuke Kubota

IPC分类号： H01J37/32

CPC分类号： H01J37/32449 ,  H01J37/32743 ,  H01J37/32981 ,  H01J2237/336

摘要： A surface modifying method of modifying a bonding surface of a substrate to be bonded to another substrate by plasma of a processing gas includes an adjusting process and a modifying process. In the adjusting process, an amount of moisture in a processing vessel is adjusted by supplying a humidified gas into the processing vessel allowed to accommodate the substrate therein. In the modifying process, the bonding surface of the substrate is modified by forming the plasma of the processing gas in the processing vessel in a state that the amount of moisture in the processing vessel is adjusted.

公开(公告)号：US20230207331A1

公开(公告)日：2023-06-29

申请号：US17995931

申请日：2021-03-30

申请人： Tokyo Electron Limited

发明人： Takuo Kawauchi ,  Masataka Matsunaga ,  Ryoichi Sakamoto ,  Masaru Honda ,  Satoshi Nishimura

IPC分类号： H01L21/447 ,  H01L21/67 ,  H01L21/677 ,  H01L21/02

CPC分类号： H01L21/447 ,  H01L21/67201 ,  H01L21/6773 ,  H01L21/67739 ,  H01L21/02002

摘要： A first transfer device and a second transfer device are configured to transfer a first substrate and a second substrate in a normal pressure atmosphere. A third transfer device is configured to transfer the first substrate and the second substrate in a decompressed atmosphere. A load lock chamber has accommodation sections allowed to accommodate therein the first substrate and the second substrate, and is allowed to switch an inside of the accommodation sections between the normal pressure atmosphere and the decompressed atmosphere. Multiple gates are respectively disposed on three different sides of the load lock chamber, and allowed to open or close the load lock chamber. The first transfer device, the second transfer device, and the third transfer device carry the first substrate and the second substrate into/out of the load lock chamber through different gates among the multiple gates.

公开(公告)号：US20220384386A1

公开(公告)日：2022-12-01

申请号：US17804163

申请日：2022-05-26

申请人： Tokyo Electron Limited

发明人： Yuji Mimura ,  Hiroshi Maeda ,  Takashi Terada ,  Masaru Honda ,  Ryoichi Sakamoto ,  Yutaka Yamasaki

IPC分类号： H01L23/00 ,  H01J37/32

摘要： A bonding system includes a surface modifying apparatus and a bonding apparatus. The surface modifying apparatus is configured to modify a bonding surface of a substrate to be bonded to another substrate with plasma of a processing gas. The bonding apparatus is configured to bond two substrates modified by the surface modifying apparatus by an intermolecular force. The surface modifying apparatus includes: a processing chamber configured to accommodate therein the substrate; a processing gas supply configured to supply a processing gas containing moisture into the processing chamber; and a plasma forming unit configured to form the plasma of the processing gas containing the moisture.

公开(公告)号：US09576854B2

公开(公告)日：2017-02-21

申请号：US15007403

申请日：2016-01-27

申请人： Tokyo Electron Limited

发明人： Masanori Itou ,  Ryoichi Sakamoto

IPC分类号： B32B38/10 ,  H01L21/78 ,  H01L21/67 ,  H01L21/66 ,  B32B43/00

CPC分类号： H01L21/78 ,  B32B38/10 ,  B32B43/006 ,  H01L21/67092 ,  H01L21/67253 ,  H01L22/12 ,  Y10T156/1179 ,  Y10T156/1184 ,  Y10T156/1961 ,  Y10T156/1967

摘要： Provided is a peeling apparatus configured to suppress damage to a substrate, by forming a peeling start point. The peeling apparatus separates a superimposed substrate made by joining first and second substrates into the first and second substrates, and includes a blade configured to form a notch as a peeling start point between the first and second substrates, and an inspection unit configured to inspect a state of a cutting edge of the blade. The inspection unit includes an imaging unit configured to image the cutting edge of the blade, and an image processing unit configured to process an image of the imaging unit.

摘要翻译： 设置有通过形成剥离开始点来抑制对基板的损伤的剥离装置。 剥离装置将通过将第一基板和第二基板接合而形成的叠加基板分离成第一基板和第二基板，并且包括构造成在第一基板和第二基板之间形成作为剥离起点的切口的刀片，以及检查单元 叶片的切割边缘的状态。 检查单元包括被配置为对刀片的切割边缘进行成像的成像单元和被配置为处理成像单元的图像的图像处理单元。

公开(公告)号：US20160225670A1

公开(公告)日：2016-08-04

申请号：US15007403

申请日：2016-01-27

申请人： Tokyo Electron Limited

发明人： Masanori Itou ,  Ryoichi Sakamoto

IPC分类号： H01L21/78 ,  H01L21/66 ,  H01L21/67

CPC分类号： H01L21/78 ,  B32B38/10 ,  B32B43/006 ,  H01L21/67092 ,  H01L21/67253 ,  H01L22/12 ,  Y10T156/1179 ,  Y10T156/1184 ,  Y10T156/1961 ,  Y10T156/1967

摘要： Provided is a peeling apparatus configured to suppress damage to a substrate, by forming a peeling start point. The peeling apparatus separates a superimposed substrate made by joining first and second substrates into the first and second substrates, and includes a blade configured to form a notch as a peeling start point between the first and second substrates, and an inspection unit configured to inspect a state of a cutting edge of the blade. The inspection unit includes an imaging unit configured to image the cutting edge of the blade, and an image processing unit configured to process an image of the imaging unit.

摘要翻译： 设置有通过形成剥离开始点来抑制对基板的损伤的剥离装置。 剥离装置将通过将第一基板和第二基板接合而形成的叠加基板分离成第一基板和第二基板，并且包括构造成在第一基板和第二基板之间形成作为剥离起点的切口的刀片，以及检查单元 叶片的切割边缘的状态。 检查单元包括被配置为对刀片的切割边缘进行成像的成像单元和被配置为处理成像单元的图像的图像处理单元。

公开(公告)号：US09162435B2

公开(公告)日：2015-10-20

申请号：US14492364

申请日：2014-09-22

申请人： Tokyo Electron Limited

发明人： Masaru Honda ,  Ryoichi Sakamoto

IPC分类号： B32B38/10 ,  B32B38/18 ,  H01L21/67 ,  B32B43/00

CPC分类号： B32B38/18 ,  B32B38/10 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1944 ,  Y10T156/1967 ,  Y10T156/1994

摘要： Disclosed is a peel-off apparatus comprising: a first holding unit configured to hold a first substrate of a superimposed substrate; a second holding unit configured to hold a second substrate of the superimposed substrate; and a moving unit configured to move a part of outer periphery of the first holding unit to be separated from the second holding unit. The first holding unit includes: a plate type elastic member connected to the moving unit; and a plurality of adsorbing units provided in the elastic member to adsorb the first substrate. An outer periphery adsorbing unit which becomes a peel-off beginning point includes: a pad member whose adsorbing surface of the first substrate is open to form a hollow portion; and a support member fitted into the hollow portion of the pad member having a hardness higher than that of the pad member.

摘要翻译： 公开了一种剥离装置，包括：第一保持单元，被配置为保持叠加的基板的第一基板; 第二保持单元，被配置为保持叠加的基板的第二基板; 以及移动单元，其构造成使得所述第一保持单元的外周的一部分与所述第二保持单元分离。 第一保持单元包括：连接到移动单元的板状弹性构件; 以及多个吸附单元，设置在弹性部件中以吸附第一基板。 成为剥离开始点的外周吸附单元包括：第一基板的吸附面打开以形成中空部的垫部件; 以及安装在所述垫构件的所述中空部分中的硬度高于所述衬垫构件的硬度的支撑构件。

公开(公告)号：US20230055853A1

公开(公告)日：2023-02-23

申请号：US17820299

申请日：2022-08-17

申请人： Tokyo Electron Limited

发明人： Takashi Terada ,  Yuji Mimura ,  Hiroshi Maeda ,  Kazutaka Noda ,  Masaru Honda ,  Ryoichi Sakamoto ,  Yutaka Yamasaki ,  Tatsuya Kitayama ,  Akira Fukutomi

IPC分类号： B32B43/00

摘要： A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.

公开(公告)号：US09643396B2

公开(公告)日：2017-05-09

申请号：US14723778

申请日：2015-05-28

申请人： TOKYO ELECTRON LIMITED

发明人： Masaru Honda ,  Ryoichi Sakamoto ,  Katsuhiro Ikeda

IPC分类号： B32B43/00

CPC分类号： B32B43/006 ,  B32B2309/16 ,  B32B2457/14 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/19 ,  Y10T156/1944 ,  Y10T156/1967 ,  Y10T156/1978 ,  Y10T156/1989

摘要： A peeling device which peels a superposed substrate obtained by bonding a first substrate and a second substrate together, from one end portion of the superposed substrate toward the other end portion thereof, includes a first holding unit configured to hold the first substrate of the superposed substrate, a second holding unit configured to hold the second substrate of the superposed substrate, and a moving unit configured to move the first holding unit away from the second holding unit. The moving unit is configured to move in at least a peeling direction of the superposed substrate.