公开(公告)号：US10896825B2

公开(公告)日：2021-01-19

申请号：US15704103

申请日：2017-09-14

申请人： TOSHIBA MEMORY CORPORATION

发明人： Takeori Maeda ,  Ryoji Matsushima ,  Makoto Minaminaka ,  Naoki Iwamasa

IPC分类号： H01L21/56 ,  H01L21/67 ,  B29C45/34 ,  B29C45/14

摘要： A mold according to an embodiment includes a first surface to be in contact with a surface of a substrate to be processed. A cavity portion recedes in a first direction being away from the first surface. A vent portion recedes in the first direction and is closer to the first surface than the cavity portion. The vent portion communicates with the cavity portion and serves as a discharge path for gas in the cavity portion. A suction portion recedes in the first direction and is farther from the first surface than the vent portion. The suction portion communicates with the vent portion. A first opening/closing portion is provided between the vent portion and the suction portion, and opens and closes or narrows down the discharge path. A second opening/closing portion is provided between the first opening/closing portion and the suction portion, and opens and closes the discharge path.

公开(公告)号：US10262879B2

公开(公告)日：2019-04-16

申请号：US15414165

申请日：2017-01-24

申请人： Toshiba Memory Corporation

发明人： Takeori Maeda ,  Ryoji Matsushima

IPC分类号： H01L21/67 ,  B29C45/14 ,  B29C45/34 ,  B29L31/34 ,  B29C45/02

摘要： According to one embodiment, a mold device includes a first mold. The first mold includes a substrate clamping surface, a cavity, a suction part, a vent, first and second intermediate cavities and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, and is recessed from the substrate clamping surface to a vent depth. The first intermediate cavity is provided between the vent and the suction part, and is recessed from the substrate clamping surface. The second intermediate cavity is provided between the first intermediate cavity and the suction part, and is recessed from the substrate clamping surface to a second intermediate cavity depth. The opening/closing part opens and closes the path.

公开(公告)号：US09997484B2

公开(公告)日：2018-06-12

申请号：US15252139

申请日：2016-08-30

申请人： TOSHIBA MEMORY CORPORATION

发明人： Takeori Maeda ,  Masatoshi Fukuda ,  Ryoji Matsushima ,  Hideo Aoki

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/17 ,  H01L21/56 ,  H01L23/3142 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/1319 ,  H01L2224/1403 ,  H01L2224/14133 ,  H01L2224/14505 ,  H01L2224/14517 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1712 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635

摘要： A semiconductor device includes a wiring substrate, a first semiconductor element, a second semiconductor element, a bump, a bonding portion, and a resin portion. The second semiconductor element is between the wiring substrate and the first semiconductor element. The bump is between the first and second semiconductor elements and electrically connects the first and second semiconductor elements. The bonding portion is between the first and second semiconductor elements, bonds the first semiconductor element to the second semiconductor element, and has a first elastic modulus. The resin portion has a second elastic modulus higher than the first elastic modulus. The resin portion is between the first and second semiconductor elements. The first semiconductor element is between a second portion of the resin portion and the wiring substrate. A third portion of the resin portion is overlapped with the first and second semiconductor elements.

公开(公告)号：US11114322B2

公开(公告)日：2021-09-07

申请号：US15455475

申请日：2017-03-10

申请人： Toshiba Memory Corporation

发明人： Takeori Maeda ,  Ryoji Matsushima ,  Makoto Kawaguchi ,  Masaaki Wakui

IPC分类号： H01L21/67 ,  B29C45/03 ,  B29C45/02 ,  B29C45/14 ,  B29C45/77 ,  B29C45/78 ,  B29C45/80 ,  B29C45/34 ,  H01L21/687 ,  B29L31/34

摘要： According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.