Method and processing machine for piercing, drilling, or cutting metal workpieces

    公开(公告)号:US10207361B2

    公开(公告)日:2019-02-19

    申请号:US14693515

    申请日:2015-04-22

    摘要: The disclosure relates to methods and systems for piercing, drilling, or cutting metal workpieces in a laser processing operation. The methods include focusing a pulsed laser beam onto a processing location on a workpiece; detecting process radiation emitted from the processing location; determining an intensity of the process radiation at a plurality of temporally sequential times during pulse pauses; determining an intensity gradient of the process radiation; comparing the intensity gradient with a gradient threshold value; and detecting a spontaneous material removal on the workpiece when the number of times the gradient threshold value has been exceeded is above a predetermined limit value. When a spontaneous material removal is detected, the system changes one or both of a laser parameter and a processing parameter of the laser processing operation. The disclosure also relates to processing machines for carrying out the methods.

    Method for removing, by means of a laser beam, a bulge deposited on the surface of a workpiece when a through hole is formed

    公开(公告)号:US10155287B2

    公开(公告)日:2018-12-18

    申请号:US14966250

    申请日:2015-12-11

    摘要: Methods and systems are implemented for forming a through hole in a workpiece using a laser beam and a process gas, such as oxygen or nitrogen, coming from a gas nozzle. A hole is formed in the workpiece using the laser beam and a process gas emerging from a gas nozzle, such that the formed hole extends only partially through the workpiece. A bulge deposited while forming the hole partially through the workpiece is removed from the workpiece surface by directing a flow of gas through the nozzle toward the workpiece surface as the nozzle is moved with the laser beam switched off, the flow of gas being delivered to the nozzle at a higher pressure than the process gas is delivered to the nozzle during forming the hole partially through the workpiece. Then, the hole is fully pierced through the workpiece by the laser beam using the process gas.

    Method and Processing Machine for Piercing, Drilling, or Cutting Metal Workpieces
    6.
    发明申请
    Method and Processing Machine for Piercing, Drilling, or Cutting Metal Workpieces 审中-公开
    金属工件穿孔,钻孔或切割的方法和加工机

    公开(公告)号:US20150224600A1

    公开(公告)日:2015-08-13

    申请号:US14693515

    申请日:2015-04-22

    IPC分类号: B23K26/38 B23K26/03 B23K26/06

    摘要: The disclosure relates to methods and systems for piercing, drilling, or cutting metal workpieces in a laser processing operation. The methods include focusing a pulsed laser beam onto a processing location on a workpiece; detecting process radiation emitted from the processing location; determining an intensity of the process radiation at a plurality of temporally sequential times during pulse pauses; determining an intensity gradient of the process radiation; comparing the intensity gradient with a gradient threshold value; and detecting a spontaneous material removal on the workpiece when the number of times the gradient threshold value has been exceeded is above a predetermined limit value. When a spontaneous material removal is detected, the system changes one or both of a laser parameter and a processing parameter of the laser processing operation. The disclosure also relates to processing machines for carrying out the methods.

    摘要翻译: 本公开涉及用于在激光加工操作中刺穿,钻孔或切割金属工件的方法和系统。 这些方法包括将脉冲激光束聚焦到工件上的加工位置上; 检测从处理位置发射的过程辐射; 在脉冲暂停期间在多个时间顺序时间确定所述过程辐射的强度; 确定过程辐射的强度梯度; 将强度梯度与梯度阈值进行比较; 并且当已经超过梯度阈值的次数超过预定极限值时,检测工件上的自发材料去除。 当检测到自发的材料去除时,系统改变激光加工操作的激光参数和处理参数中的一个或两个。 本公开还涉及用于执行该方法的处理机。

    Method and processing machine for piercing, drilling or cutting metal workpieces

    公开(公告)号:US11219965B2

    公开(公告)日:2022-01-11

    申请号:US15849979

    申请日:2017-12-21

    摘要: The disclosure relates to methods and systems for piercing, drilling, or cutting metal workpieces in a laser processing operation. The methods include focusing a pulsed laser beam onto a processing location on a workpiece; detecting process radiation emitted from the processing location; determining an intensity of the process radiation at a plurality of temporally sequential times during pulse pauses; determining an intensity gradient of the process radiation; comparing the intensity gradient with a gradient threshold value; and detecting a spontaneous material removal on the workpiece when the number of times the gradient threshold value has been exceeded is above a predetermined limit value. When a spontaneous material removal is detected, the system changes one or both of a laser parameter and a processing parameter of the laser processing operation. The disclosure also relates to processing machines for carrying out the methods.

    Method for Removing, by means of a Laser Beam, a Bulge deposited on the Surface of a Workpiece when a Through Hole is formed
    9.
    发明申请
    Method for Removing, by means of a Laser Beam, a Bulge deposited on the Surface of a Workpiece when a Through Hole is formed 审中-公开
    当形成通孔时,通过激光束去除沉积在工件表面上的凸起的方法

    公开(公告)号:US20160096238A1

    公开(公告)日:2016-04-07

    申请号:US14966250

    申请日:2015-12-11

    摘要: Methods and systems are implemented for forming a through hole in a workpiece using a laser beam and a process gas, such as oxygen or nitrogen, coming from a gas nozzle. A hole is formed in the workpiece using the laser beam and a process gas emerging from a gas nozzle, such that the formed hole extends only partially through the workpiece. A bulge deposited while forming the hole partially through the workpiece is removed from the workpiece surface by directing a flow of gas through the nozzle toward the workpiece surface as the nozzle is moved with the laser beam switched off, the flow of gas being delivered to the nozzle at a higher pressure than the process gas is delivered to the nozzle during forming the hole partially through the workpiece. Then, the hole is fully pierced through the workpiece by the laser beam using the process gas.

    摘要翻译: 实施用于使用来自气体喷嘴的激光束和诸如氧气或氮气的处理气体在工件中形成通孔的方法和系统。 使用激光束和从气体喷嘴出射的处理气体在工件中形成孔,使得所形成的孔仅部分延伸穿过工件。 当激光束被关闭时,当喷嘴移动时,通过将气体流引导通过喷嘴朝向工件表面,从工件表面去除沉积的部分地穿过工件沉积的凸起,气体流被传送到 在比通过工件部分地形成孔期间将处理气体输送到喷嘴的压力高的喷嘴。 然后,通过使用工艺气体的激光束将孔完全刺穿工件。