公开(公告)号：US5424368A

公开(公告)日：1995-06-13

申请号：US191218

申请日：1994-02-03

申请人： Tadakazu Miyazaki ,  Masahide Mizumori ,  Miki Motomura

发明人： Tadakazu Miyazaki ,  Masahide Mizumori ,  Miki Motomura

IPC分类号： G03F7/004 ,  C08F8/30 ,  G03F7/012 ,  G03F7/033 ,  G03F7/038 ,  G03F7/20 ,  H01L21/027 ,  H05K3/00 ,  C08F265/00

CPC分类号： C09D11/101 ,  C08F8/44 ,  G03F7/012 ,  C08F2800/10

摘要： A photosensitive resin having at least one group as shown below in Chemical Formula (1) in a molecule. ##STR1## wherein n represents an integer from 1 to 10. Since the photosensitive resin has an azido group in a molecule having an adsorption region higher than 300 nm, the resin is highly sensitive. Therefore, an emulsion coating photo mask or a soda glass photo mask, which allows light permeation within the abosorption region of the azido group and is cheap in industry, can be used as the photo mask for the photosensitive resin of the invention. The photosensitive resin is particularly useful as a photo resist.

摘要翻译： 在分子中具有化学式（1）所示的至少一个基团的感光性树脂。 （1）其中n表示1〜10的整数。由于感光性树脂在吸附区域高于300nm的分子中具有叠氮基，所以树脂高度敏感。 因此，作为本发明的感光性树脂的光掩模，可以使用能够使光吸收在叠氮化物的吸收区域内并且在工业上便宜的乳液涂布光掩模或钠玻璃光罩。 光敏树脂特别适用于光刻胶。

公开(公告)号：US20070269987A1

公开(公告)日：2007-11-22

申请号：US10552606

申请日：2004-05-07

申请人： Tomoharu Nakano ,  Fumihiro Nakajima ,  Tadakazu Miyazaki ,  Duncan Brown ,  Matthew Healy

发明人： Tomoharu Nakano ,  Fumihiro Nakajima ,  Tadakazu Miyazaki ,  Duncan Brown ,  Matthew Healy

IPC分类号： H01L21/321

CPC分类号： C09G1/02 ,  H01L21/31053

摘要： An abrasive liquid for CMP process characterized by comprising an abrasive material, an aqueous solvent and an addition agent, and containing abrasive particles having a particle diameter of 20 to 80 nm by 15 weight % or more on the basis of the weight of the abrasive liquid; and a method of polishing by using the abrasive liquid are appropriate for the processing of flattening the surface of a device wafer on which at least a silicon oxide film is formed, and take effect of being capable of stably performing superior abrasive properties such as flattening properties, low flaw properties and high washing properties, and then are the most appropriate for the processing of flattening the surface of a semiconductor device comprising a layer insulation film or an element separation film, a magnetic head and a substrate for a liquid crystal display in the semiconductor industry.

摘要翻译： 一种用于CMP工艺的磨料液体，其特征在于包括研磨材料，水性溶剂和添加剂，并且基于研磨液的重量，包含粒径为20至80nm至15重量％或更多的磨料颗粒 ; 并且通过使用研磨液的研磨方法适用于对至少形成有氧化硅膜的器件晶片的表面进行平坦化处理，并且能够稳定地进行优异的研磨性能如扁平化性能 低缺陷特性和高洗涤性，最适合用于对包含层间绝缘膜或元件分离膜，磁头和液晶显示器用基板的半导体器件的表面进行平坦化处理 半导体行业。

公开(公告)号：US6040398A

公开(公告)日：2000-03-21

申请号：US146075

申请日：1998-09-02

申请人： Toshihiko Kinsho ,  Munekazu Satake ,  Tadakazu Miyazaki

发明人： Toshihiko Kinsho ,  Munekazu Satake ,  Tadakazu Miyazaki

IPC分类号： C08G59/50 ,  C08G65/333 ,  C08L63/00 ,  C09K3/10 ,  C08F283/000

CPC分类号： C09K3/10 ,  C08G59/5046 ,  C08G65/33306 ,  C08L63/00 ,  C09K2200/0647

摘要： An epoxy curing agent comprising a heterocycle-containing compound having a backbone chain selected from the group consisting of polyether, polyvinyl, polyester, polyamide, polycarbonate, and novolac chains and at least two heterocyclic groups of the following general formula (1) as side chains, and a one-component (type) epoxy resin composition comprising said epoxy curing agent and a polyepoxy compound, ##STR1## wherein R.sub.1 and R.sup.2 may be the same or different and each represents hydrogen, straight-chain or branched C.sub.1 to C.sub.6 alkyl or alkenyl, or C.sub.6 to C.sub.8 aryl; or R.sub.1 and R.sup.2, taken together with the adjacent carbon atom, represents C.sub.5 to C.sub.7 cycloalkyl; R.sup.3 represents C.sub.1 to C.sub.10 alkylene. The object is to provide the one-component (type) epoxy resin composition having fast-curing feature, an improved storage stability, and an improved degree of workability.

摘要翻译： 环氧固化剂，其包含具有选自聚醚，聚乙烯，聚酯，聚酰胺，聚碳酸酯和酚醛清漆链的主链的含杂环化合物和作为侧链的以下通式（1）的至少两个杂环基 以及包含所述环氧固化剂和聚环氧化合物的单组分（型）环氧树脂组合物，其中R 1和R 2可以相同或不同，各自表示氢，直链或支链C 1至C 6烷基或链烯基，或 C6〜C8芳基; 或R 1和R 2与相邻碳原子一起表示C5至C7环烷基; R3表示C1〜C10亚烷基。 本发明的目的是提供具有快速固化特征的单组分（型）环氧树脂组合物，改进的储存稳定性和改进的可加工性程度。

公开(公告)号：US5837785A

公开(公告)日：1998-11-17

申请号：US683564

申请日：1996-07-12

申请人： Toshihiko Kinsho ,  Munekazu Satake ,  Tadakazu Miyazaki

发明人： Toshihiko Kinsho ,  Munekazu Satake ,  Tadakazu Miyazaki

IPC分类号： C08G59/50 ,  C08G65/333 ,  C08L63/00 ,  C09K3/10 ,  C08F283/00

CPC分类号： C09K3/10 ,  C08G59/5046 ,  C08G65/33306 ,  C08L63/00 ,  C09K2200/0647

摘要： An epoxy curing agent comprising a heterocycle-containing compound having a backbone clain selected from the group consisting of polyether, polyvinyl, polyester, polyamide, polycarbonate, and novolac chains and at least two heterocyclic groups of the following general formula (1) as side chains, and a one-component (type) epoxy resin composition comprising said epoxy curing agent and a polyepoxy compound, ##STR1## wherein R.sup.1 and R.sup.2 may be the same or different and each represents hydrogen, straight-chain or branched C.sub.1 to C.sub.6 alkyl or alkenyl, or C.sub.6 to C.sub.8 aryl; or R.sup.1 and R.sup.2, taken together with the adjacent carbon atom, represents C.sub.5 to C.sub.7 cycloalkyl; R.sup.3 represents C.sub.1 to C.sub.10 alkylene. The object is to provide the one-component (type) epoxy resin composition having fast-curing feature, an improved storage stability, and an improved degree of workability.

摘要翻译： 一种环氧固化剂，其包含具有选自聚醚，聚乙烯，聚酯，聚酰胺，聚碳酸酯和酚醛清漆链的骨架骨架的含杂环化合物和作为侧链的以下通式（1）的至少两个杂环基 ，以及包含所述环氧固化剂和聚环氧化合物的单组分（型）环氧树脂组合物，其中R1和R2可以相同或不同，各自表示氢，直链或支链C1至 C6烷基或烯基，或C6至C8芳基; 或R 1和R 2与相邻碳原子一起表示C5至C7环烷基; R3表示C1〜C10亚烷基。 本发明的目的是提供具有快速固化特征的单组分（型）环氧树脂组合物，改进的储存稳定性和改进的可加工性程度。