Semiconductor device and method of fabricating the same
    2.
    发明申请
    Semiconductor device and method of fabricating the same 失效
    半导体装置及其制造方法

    公开(公告)号:US20090289326A1

    公开(公告)日:2009-11-26

    申请号:US12318504

    申请日:2008-12-30

    IPC分类号: H01L29/92 H01L21/02

    摘要: A semiconductor device, includes: a first storage node contact plug penetrating a first interlayer insulation layer and partially protruding above the first interlayer insulation layer; a second storage node contact plug contacting the first storage node contact plug that protrudes above the first interlayer insulation layer; a storage node contacting a top surface of the second storage node contact plug; and a second interlayer insulation layer formed over the first interlayer insulation layer, wherein the second interlayer insulation layer surrounds an outer sidewall at a bottom region of the first storage node, and the second storage node contact plug, and wherein the first storage node contact plug protruding above the first interlayer insulation layer and the second storage node contact plug.

    摘要翻译: 一种半导体器件,包括:穿过第一层间绝缘层并部分地突出在第一层间绝缘层上方的第一存储节点接触插塞; 与所述第一存储节点接触插头接触的第二存储节点接触插塞,所述第一存储节点接触插头突出在所述第一层间绝缘层之上; 接触所述第二存储节点接触插塞的顶表面的存储节点; 以及形成在所述第一层间绝缘层上的第二层间绝缘层,其中所述第二层间绝缘层围绕所述第一存储节点的底部区域处的外侧壁和所述第二存储节点接触插塞,并且其中所述第一存储节点接触插塞 突出在第一层间绝缘层和第二存储节点接触插塞上方。

    Method for fabricating semiconductor device
    3.
    发明授权
    Method for fabricating semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US07998825B2

    公开(公告)日:2011-08-16

    申请号:US12344154

    申请日:2008-12-24

    IPC分类号: H01L21/02

    摘要: A method for fabricating a semiconductor device includes: forming an etch stop pattern over a conductive layer, the etch stop pattern having a first opening exposing a top surface of the conductive layer; forming an insulation layer over the etch stop pattern; selectively etching the insulation layer to form a second opening exposing the top surface of the conductive layer; and enlarging the second opening until the etch stop pattern is exposed.

    摘要翻译: 一种用于制造半导体器件的方法包括:在导电层上形成蚀刻停止图案,所述蚀刻停止图案具有暴露所述导电层顶表面的第一开口; 在所述蚀刻停止图案上形成绝缘层; 选择性地蚀刻绝缘层以形成暴露导电层的顶表面的第二开口; 并扩大第二个开口,直到蚀刻停止图案被曝光。

    Capacitor and method for fabricating the same
    5.
    发明授权
    Capacitor and method for fabricating the same 有权
    电容器及其制造方法

    公开(公告)号:US08993396B2

    公开(公告)日:2015-03-31

    申请号:US13596007

    申请日:2012-08-27

    摘要: A method for fabricating a capacitor includes forming a mold structure over a substrate, wherein the mold structure has a plurality of open parts and has a mold layer stacked with a support layer; forming cylinder type lower electrodes in the open parts; forming a first upper electrode over an entire surface of a structure including the cylinder type lower electrodes to fill the cylinder type lower electrodes; defining a through hole that passes through portions of the first upper electrode and the support layer; removing the mold layer through the through hole and exposing the cylinder type lower electrodes; forming a second upper electrode to fill the through hole and spaces between the cylinder type lower electrodes; and forming a third upper electrode to connect the second upper electrode and the first upper electrode with each other.

    摘要翻译: 一种电容器的制造方法,其特征在于,在基板上形成模具结构体,其中,所述模具结构体具有多个开口部,并且具有层叠有支承层的模层; 在开口部分形成圆筒型下电极; 在包括所述圆筒型下电极的结构的整个表面上形成第一上电极以填充所述圆筒型下电极; 限定穿过所述第一上电极和所述支撑层的部分的通孔; 通过通孔去除模具层并暴露圆柱形下电极; 形成第二上部电极以填充所述圆筒形下部电极之间的通孔和间隔; 以及形成第三上电极,以将第二上电极和第一上电极彼此连接。

    METHOD OF REPAIRING A POLYMER MASK
    6.
    发明申请
    METHOD OF REPAIRING A POLYMER MASK 审中-公开
    修复聚合物掩模的方法

    公开(公告)号:US20090095922A1

    公开(公告)日:2009-04-16

    申请号:US12282662

    申请日:2007-05-11

    IPC分类号: G21G5/00

    CPC分类号: G03F1/72

    摘要: A method of repairing defects to a patterned polymer mask for a photolithography process is described, illustrated, and claimed. Generally, there are two types of defects to a polymer mask, which are an ink spot on a transparent polymer substrate and an ink void in a patterned area. The ink spot is repaired by an effective ablation by a laser that does not substantially affect a transparency of the polymer substrate. The ink void is repaired by various embodiments using laser-assisted touch-up processes, wherein the laser-assisted touch-up restores the void to block UV light during a photolithography exposure.

    摘要翻译: 对用于光刻工艺的图案化聚合物掩模修复缺陷的方法进行了说明和说明。 通常,聚合物掩模存在两种类型的缺陷,聚合物掩模是透明聚合物基底上的油墨点和图案区域中的油墨空隙。 通过激光器的有效消融来修复墨点,其基本上不影响聚合物基底的透明度。 通过使用激光辅助翻页工艺的各种实施例来修复墨水空隙,其中激光辅助翻页在光刻曝光期间恢复空隙以阻挡UV光。

    Semiconductor device and method of fabricating the same
    7.
    发明授权
    Semiconductor device and method of fabricating the same 失效
    半导体装置及其制造方法

    公开(公告)号:US08053326B2

    公开(公告)日:2011-11-08

    申请号:US12318504

    申请日:2008-12-30

    IPC分类号: H01L21/20

    摘要: A semiconductor device, includes: a first storage node contact plug penetrating a first interlayer insulation layer and partially protruding above the first interlayer insulation layer; a second storage node contact plug contacting the first storage node contact plug that protrudes above the first interlayer insulation layer; a storage node contacting a top surface of the second storage node contact plug; and a second interlayer insulation layer formed over the first interlayer insulation layer, wherein the second interlayer insulation layer surrounds an outer sidewall at a bottom region of the first storage node, and the second storage node contact plug, and wherein the first storage node contact plug protruding above the first interlayer insulation layer and the second storage node contact plug.

    摘要翻译: 一种半导体器件,包括:穿过第一层间绝缘层并部分地突出在第一层间绝缘层上方的第一存储节点接触插塞; 与所述第一存储节点接触插头接触的第二存储节点接触插塞,所述第一存储节点接触插头突出在所述第一层间绝缘层之上; 接触所述第二存储节点接触插塞的顶表面的存储节点; 以及形成在所述第一层间绝缘层上的第二层间绝缘层,其中所述第二层间绝缘层围绕所述第一存储节点的底部区域处的外侧壁和所述第二存储节点接触插塞,并且其中所述第一存储节点接触插塞 突出在第一层间绝缘层和第二存储节点接触插塞上方。