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公开(公告)号:US20120122278A1
公开(公告)日:2012-05-17
申请号:US13007530
申请日:2011-01-14
申请人: Kwan Ho LEE , Yong Hui Joo , Tae Hyun KIM , Seog Moon CHOI
发明人: Kwan Ho LEE , Yong Hui Joo , Tae Hyun KIM , Seog Moon CHOI
IPC分类号: H01L21/98
CPC分类号: H01L24/83 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/73 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/05001 , H01L2224/0554 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/82801 , H01L2224/83192 , H01L2224/83238 , H01L2224/83385 , H01L2224/838 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/1579 , H01L2924/351 , H05K3/3494 , H05K2201/09681 , H05K2203/1115 , H05K2203/1121 , H01L2924/00014 , H01L2924/00 , H01L2924/01083 , H01L2924/00012
摘要: Disclosed herein is a method of method of manufacturing a semiconductor package board, including: providing a substrate including a connection part formed on one side thereof, the connection part being provided thereon with a solder layer; disposing a conductive heat generator equipped with current wiring on the solder layer; applying current to the current wiring and thus heating the solder layer to attach a semiconductor chip to the connection part; and removing the current wiring from the conductive heat generator. The method is advantageous in that the semiconductor chip is attached to the substrate by applying current to the current wiring of the conductive heat generator to locally heat only the solder layer, thus reducing thermal stress and preventing the deformation of the substrate.
摘要翻译: 本发明公开了一种制造半导体封装板的方法,包括:提供包括形成在其一侧上的连接部分的基板,所述连接部分设置有焊料层; 在焊料层上配置配有电流布线的导电发热体; 向当前布线施加电流,从而加热焊料层以将半导体芯片附接到连接部分; 并从导电热发生器去除当前布线。 该方法的优点在于,通过向导电发热体的电流布线施加电流而将半导体芯片附接到基板,以仅局部加热焊料层,从而降低热应力并防止基板的变形。
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2.
公开(公告)号:US20120106109A1
公开(公告)日:2012-05-03
申请号:US13007485
申请日:2011-01-14
申请人: Tae Hyun KIM , Yong Hui Joo , Seog Moon CHOI
发明人: Tae Hyun KIM , Yong Hui Joo , Seog Moon CHOI
CPC分类号: H01L24/83 , H01L23/3735 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/36 , H01L24/40 , H01L25/072 , H01L2224/291 , H01L2224/29309 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29366 , H01L2224/32245 , H01L2224/33181 , H01L2224/40095 , H01L2224/40225 , H01L2224/45124 , H01L2224/83192 , H01L2224/83193 , H01L2224/83801 , H01L2224/8384 , H01L2224/8385 , H01L2224/84801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/181 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00 , H01L2224/48 , H01L2924/00012 , H01L2224/37099
摘要: Disclosed herein are a power module using sintering die attach and a manufacturing method of the same. The power module includes: a substrate having an insulating layer formed on a surface of a metal plate; a circuit layer formed on the substrate and including a wiring pattern and an electrode pattern; a device mounted on the wiring pattern; a sintering die attach layer applying a metal paste between the wiring pattern and the device and sintering the metal paste to bond the wiring pattern to the device; and a lead frame electrically connecting the device to the electrode pattern, whereby making it possible to to simplify and facilitate the process, increase electrical efficiency and improve radiation characteristics, and manufacture firm and reliable power module.
摘要翻译: 这里公开了使用烧结管芯附着的功率模块及其制造方法。 功率模块包括:具有形成在金属板的表面上的绝缘层的基板; 形成在所述基板上并且包括布线图案和电极图案的电路层; 安装在所述布线图案上的装置; 在所述布线图案和所述器件之间施加金属膏的烧结片附着层,烧结所述金属膏以将所述布线图案与所述器件接合; 以及将该器件电连接到电极图案的引线框架,由此使得可以简化和便利工艺,提高电效率和改善辐射特性,并制造牢固可靠的电源模块。
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3.
公开(公告)号:US08630097B2
公开(公告)日:2014-01-14
申请号:US13007485
申请日:2011-01-14
申请人: Tae Hyun Kim , Yong Hui Joo , Seog Moon Choi
发明人: Tae Hyun Kim , Yong Hui Joo , Seog Moon Choi
IPC分类号: H05K7/10
CPC分类号: H01L24/83 , H01L23/3735 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/36 , H01L24/40 , H01L25/072 , H01L2224/291 , H01L2224/29309 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29366 , H01L2224/32245 , H01L2224/33181 , H01L2224/40095 , H01L2224/40225 , H01L2224/45124 , H01L2224/83192 , H01L2224/83193 , H01L2224/83801 , H01L2224/8384 , H01L2224/8385 , H01L2224/84801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/181 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00 , H01L2224/48 , H01L2924/00012 , H01L2224/37099
摘要: Disclosed herein are a power module using sintering die attach and a manufacturing method of the same. The power module includes: a substrate having an insulating layer formed on a surface of a metal plate; a circuit layer formed on the substrate and including a wiring pattern and an electrode pattern; a device mounted on the wiring pattern; a sintering die attach layer applying a metal paste between the wiring pattern and the device and sintering the metal paste to bond the wiring pattern to the device; and a lead frame electrically connecting the device to the electrode pattern, whereby making it possible to simplify and facilitate the process, increase electrical efficiency and improve radiation characteristics, and manufacture firm and reliable power module.
摘要翻译: 这里公开了使用烧结管芯附着的功率模块及其制造方法。 功率模块包括:具有形成在金属板的表面上的绝缘层的基板; 形成在所述基板上并且包括布线图案和电极图案的电路层; 安装在所述布线图案上的装置; 在所述布线图案和所述器件之间施加金属膏的烧结片附着层,烧结所述金属膏以将所述布线图案与所述器件接合; 以及将该器件电连接到电极图案的引线框架,由此使得可以简化和便利工艺,提高电效率和改善辐射特性,并制造牢固可靠的电源模块。
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