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公开(公告)号：US09725312B1
公开(公告)日：2017-08-08
申请号：US15016527
申请日：2016-02-05
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chien-Ning Hsin , I-Shi Wang , Jen-Hao Liu , Chih-Hang Chang
CPC classification number: B81C1/00357 , B81C1/00269 , B81C2203/036 , B81C2203/037 , H01L21/02334 , H01L21/02337 , H01L21/2007 , H01L21/3105
Abstract: A method for fusion bonding a pair of substrates together with silane preconditioning is provided. A surface of a first oxide layer or a surface of a second oxide layer is preconditioned with silane. The first and second oxide layers are respectively arranged on first and second semiconductor substrates. Water is applied to the surface of the first or second oxide layer. The surfaces of the first and second oxide layers are brought in direct contact. The first and second oxide layers are annealed. A method for manufacturing a microelectromechanical systems (MEMS) package using the fusion bonding is also provided.
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公开(公告)号：US11174156B2
公开(公告)日：2021-11-16
申请号：US16829196
申请日：2020-03-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Hang Chang , I-Shi Wang , Jen-Hao Liu
Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first wafer comprising a first face and a second face opposite the first face and having a plurality of predetermined die areas. A plurality of recesses are disposed in the first face of the first wafer. A first recess of the plurality of recesses extends in a direction substantially parallel to a first edge of at least one of the plurality of predetermined die areas and laterally surrounds the at least one of the plurality of predetermined die areas. A second wafer is bonded to the second face of the first wafer.
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公开(公告)号：US20200024125A1
公开(公告)日：2020-01-23
申请号：US16386993
申请日：2019-04-17
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Hang Chang , I-Shi Wang , Jen-Hao Liu
IPC: B81B3/00
Abstract: A microelectromechanical systems (MEMS) package with roughness for high quality anti-stiction is provided. A device substrate is arranged over a support device. The device substrate comprises a movable element with a lower surface that is rough and that is arranged within a cavity. A dielectric layer is arranged between the support device and the device substrate. The dielectric layer laterally encloses the cavity. An anti-stiction layer lines the lower surface of the movable element. A method for manufacturing the MEMS package is also provided.
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公开(公告)号：US11192775B2
公开(公告)日：2021-12-07
申请号：US16386993
申请日：2019-04-17
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Hang Chang , I-Shi Wang , Jen-Hao Liu
IPC: B81B3/00
Abstract: A microelectromechanical systems (MEMS) package with roughness for high quality anti-stiction is provided. A device substrate is arranged over a support device. The device substrate comprises a movable element with a lower surface that is rough and that is arranged within a cavity. A dielectric layer is arranged between the support device and the device substrate. The dielectric layer laterally encloses the cavity. An anti-stiction layer lines the lower surface of the movable element. A method for manufacturing the MEMS package is also provided.
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公开(公告)号：US20200223689A1
公开(公告)日：2020-07-16
申请号：US16829196
申请日：2020-03-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Hang Chang , I-Shi Wang , Jen-Hao Liu
Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first wafer comprising a first face and a second face opposite the first face and having a plurality of predetermined die areas. A plurality of recesses are disposed in the first face of the first wafer. A first recess of the plurality of recesses extends in a direction substantially parallel to a first edge of at least one of the plurality of predetermined die areas and laterally surrounds the at least one of the plurality of predetermined die areas. A second wafer is bonded to the second face of the first wafer.
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Patent Agency Ranking
公开(公告)号：US10112826B2
公开(公告)日：2018-10-30
申请号：US15456271
申请日：2017-03-10
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Hang Chang , Jen-Hao Liu , I-Shi Wang
Abstract: A method for forming a micro-electro-mechanical system (MEMS) device structure is provided. The method includes forming a recess in a first substrate and forming a dielectric layer on the first substrate and in the recess. The method also includes forming a second substrate on the dielectric layer and etching a portion of the second substrate to form a MEMS structure. The MEMS structure has a plurality of openings. The method further includes etching a portion of the dielectric layer to form a cavity below the openings.
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公开(公告)号：US20170225948A1
公开(公告)日：2017-08-10
申请号：US15016527
申请日：2016-02-05
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chien-Ning Hsin , I-Shi Wang , Jen-Hao Liu , Chih-Hang Chang
IPC: B81C1/00
CPC classification number: B81C1/00357 , B81C1/00269 , B81C2203/036 , B81C2203/037 , H01L21/02334 , H01L21/02337 , H01L21/2007 , H01L21/3105
Abstract: A method for fusion bonding a pair of substrates together with silane preconditioning is provided. A surface of a first oxide layer or a surface of a second oxide layer is preconditioned with silane. The first and second oxide layers are respectively arranged on first and second semiconductor substrates. Water is applied to the surface of the first or second oxide layer. The surfaces of the first and second oxide layers are brought in direct contact. The first and second oxide layers are annealed. A method for manufacturing a microelectromechanical systems (MEMS) package using the fusion bonding is also provided.
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公开(公告)号：US11211354B2
公开(公告)日：2021-12-28
申请号：US16203366
申请日：2018-11-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Hang Chang , Richard Huang , I-shi Wang , Yin-Tun Chou , Jen-Hao Liu
Abstract: In an embodiment, a system includes: a circular frame comprising a first side and a second side opposite the first side, wherein the circular frame comprises an aperture formed therethrough; an insert disposed within the aperture; a first wafer disposed over the insert; a second wafer disposed over the first wafer, wherein both the first wafer and the second wafer are configured for eutectic bonding when heated; two clamps disposed on the first side along the circular frame, wherein the two clamps are configured to contact the second wafer at respective clamp locations; and a plurality of pieces configured to secure the insert within the aperture, the plurality of pieces comprising both fixed and flexible pieces, the plurality of pieces comprising two fixed pieces disposed respectively adjacent to the clamp locations along the second side of the circular frame.
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公开(公告)号：US20190164929A1
公开(公告)日：2019-05-30
申请号：US16203366
申请日：2018-11-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Hang Chang , Richard Huang , I-Shi Wang , Yin-Tun Chou , Jen-Hao Liu
IPC: H01L23/00
Abstract: In an embodiment, a system includes: a circular frame comprising a first side and a second side opposite the first side, wherein the circular frame comprises an aperture formed therethrough; an insert disposed within the aperture; a first wafer disposed over the insert; a second wafer disposed over the first wafer, wherein both the first wafer and the second wafer are configured for eutectic bonding when heated; two clamps disposed on the first side along the circular frame, wherein the two clamps are configured to contact the second wafer at respective clamp locations; and a plurality of pieces configured to secure the insert within the aperture, the plurality of pieces comprising both fixed and flexible pieces, the plurality of pieces comprising two fixed pieces disposed respectively adjacent to the clamp locations along the second side of the circular frame.
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公开(公告)号：US10273141B2
公开(公告)日：2019-04-30
申请号：US15138419
申请日：2016-04-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Hang Chang , I-Shi Wang , Jen-Hao Liu
Abstract: A microelectromechanical systems (MEMS) package with roughness for high quality anti-stiction is provided. A device substrate is arranged over a support device. The device substrate comprises a movable element with a lower surface that is rough and that is arranged within a cavity. A dielectric layer is arranged between the support device and the device substrate. The dielectric layer laterally encloses the cavity. An anti-stiction layer lines the lower surface of the movable element. A method for manufacturing the MEMS package is also provided.
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