摘要:
When a numerical controller executes a tool-center-point control in which a path of a tool center point with respect to a workpiece is instructed, and the workpiece is machined along the instructed path based on a speed instruction, the numerical controller sets the speed instruction so that the speed instruction is a synthesis speed with respect to a synthesis distance of a relative moving distance between the workpiece and a tool center point and a tool-direction changing distance due to a relative change in a tool direction with respect to the workpiece by a rotary axis. The numerical controller interpolates a position of a linear axis and a position of a rotary axis by the tool-center-point control according to the synthesis speed and drives the linear axis and the rotary axis to the position of the linear axis and the position of the rotary axis created by the interpolation.
摘要:
There are provided a substrate processing apparatus, a method of manufacturing a semiconductor device, and a method of manufacturing a substrate, for growing a SiC epitaxial film at a high-temperature condition. The substrate processing apparatus comprises: a reaction chamber; a first gas supply system configured to supply at least a gas containing silicon atoms and a gas containing chlorine atoms, or a gas containing silicon and chlorine atoms; a second gas supply system configured to supply at least a reducing gas; a third gas supply system configured to supply at least a gas containing carbon atoms; a first gas supply nozzle connected to the first gas supply system or the first and third gas supply systems; a second gas supply nozzle connected to the second gas supply system or the second and third gas supply systems; and a controller configured to control the first to third gas supply systems.
摘要:
An apparatus including a reaction chamber in which substrates are stacked; a first gas supply nozzle installed in a region in which the substrates are stacked; a second gas supply nozzle installed in a different position; a first branch nozzle installed at the first gas supply nozzle in a direction parallel to major surfaces of the substrates, a line of which is branched in a direction of the second gas supply nozzle, and including a first gas supply port; and a second branch nozzle installed at the second gas supply nozzle in the direction parallel to the major surfaces of the substrates, a line of which is branched in a direction of the first gas supply nozzle, and including a second gas supply port; wherein the first gas supply port and the second gas supply port are installed adjacent to each other in a direction that the substrates are stacked.
摘要:
When processing such as SiC epitaxial growth is performed at an ultrahigh temperature of 1500° C. to 1700° C., a film-forming gas can be decreased to heat-resistant temperature of a manifold and film quality uniformity can be improved. A substrate processing apparatus includes a reaction chamber for processing a plurality of substrates, a boat for holding the plurality of substrates, a gas supply nozzle for supplying a film-forming gas to the plurality of substrates, an exhaust port for exhausting the film-forming gas supplied into the reaction chamber, a heat exchange part which defines a second flow path narrower than a first flow path defined by an inner wall of the reaction chamber and the boat, and a gas discharge part installed under the lowermost substrate of the plurality of substrates.
摘要:
Provided is a substrate processing apparatus having a stack structure of wafers that can endure a high temperature without bad influence on film-forming precision. The stack structure includes a holder base (110) configured to hold a wafer (14) at an inner circumference side thereof, and boat columns (31a to 31c) each including a holder retainer (HS) configured to hold an outer circumference side of the holder base (110), wherein an outer diameter of the holder base (110) is larger than that of the wafer (14), and the holder base (110) is detachable from the holder retainers (HS).
摘要:
A numerical controller controlling a 5-axis machine tool compensates setting error that arises when a workpiece is set on the table. Error in the three linear axes and the two rotation axes are compensated using preset error amounts to keep the calculated tool position and tool direction in a command coordinate system. If a trigonometric function used for error compensation has a plurality of solution sets, the solution set closest to the tool direction in the command coordinate system is selected from the plurality of solution sets and used as the positions of the two rotation axes compensated in the above error compensation.
摘要:
A numerical controller controlling a 5-axis machine tool compensates setting error that arises when a workpiece is set on the table. Error in the three linear axes and the two rotation axes are compensated using preset error amounts to keep the calculated tool position and tool direction in a command coordinate system. If a trigonometric function used for error compensation has a plurality of solution sets, the solution set closest to the tool direction in the command coordinate system is selected from the plurality of solution sets and used as the positions of the two rotation axes compensated in the above error compensation.
摘要:
There is provided a semiconductor processing apparatus comprising a processing tube for housing a substrate support member that supports a plurality of substrates stacked at a prescribed pitch in a vertical direction; a gas supply part that extends in a direction in which the substrates are stacked in the processing tube and that has a plurality of gas supply openings; an exhaust part that opens onto the processing tube; a gas rectifying plate that is disposed in a space between a penumbra of the substrates supported on the substrate support member and an inner wall of the processing tube, and that extends from the gas supply part in a circumferential direction of the processing tube and in the direction in which the substrates are stacked; and a gas flow regulating part disposed in a space in the processing tube that is above a top-most gas supply opening and a top-most substrate and in a space in the processing tube that is below a bottom-most substrate and a bottom-most gas supply opening. A thin film formed on the substrate can be made more uniform.
摘要:
A liquid drop discharge head includes a nozzle configured to discharge a liquid drop by using a piezoelectric element. Lead ingredients are not included in the piezoelectric element.
摘要:
A work is installed on a table of a machine tool, and the coordinate system on the work is (X′, Y′, Z′). Each three points on respective three faces of the work, which are orthogonal to one another, A, B, C, D, E, F, G, H and I, are detected with a touch probe. From three points on the same plane, each of three formulas of planes which lies on the three points, respectively, are obtained. A position O′ (XO, YO, ZO) of a point where the three plane intersect with one another is obtained. This position is a parallel translation error. From these three plane formulas, points on the X′, Y′ and Z′ axes each being distant from the position O′ by the length L are obtained. Rotation matrices are obtained from the respective points, position O′ (XO, YO, ZO), and L. Rotary direction errors are obtained using the rotation matrices. In this manner, a work location error which is composed of the three-dimensional parallel translation error and three-dimensional rotary direction errors is obtained.
摘要翻译:工件安装在机床的工作台上,工件上的坐标系为(X',Y',Z')。 A,B,C,D,E,F,G,H和I彼此正交的工件的相应三个面上的每个三个点都用探针检测。 从同一平面上的三个点,分别得到位于三个点上的三个平面的三个公式。 获得三个平面彼此相交的点的位置O'(X O,O,Y O,Z O O)。 这个位置是平行翻译错误。 通过这三个平面公式,可以得到X',Y',Z'各自远离位置O'长度L的点。 旋转矩阵从相应的位置获得,位置O'(X O,O,O,Z O O)和L.旋转方向误差 使用旋转矩阵获得。 以这种方式,获得由三维平行平移平移误差和三维旋转方向误差构成的作业位置误差。