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公开(公告)号：US06731184B1
公开(公告)日：2004-05-04
申请号：US09603252
申请日：2000-06-26
申请人： Hideki Muto , Koji Tanaka , Koji Furutani , Takahiro Watanabe , Takanori Uejima , Norio Nakajima
发明人： Hideki Muto , Koji Tanaka , Koji Furutani , Takahiro Watanabe , Takanori Uejima , Norio Nakajima
IPC分类号： H01P115
CPC分类号： H04B1/48
摘要： A high frequency switching component for being connected to a transmission circuit, a reception circuit, and an antenna to be used for switching to either a state in which the transmission circuit is connected to the antenna, or a state in which the reception circuit is connected to the antenna, comprising: a multilayer circuit board, on which there is formed a circuit including: a transmission circuit terminal to be connected to the transmission circuit; a reception circuit terminal to be connected to the reception circuit; an antenna terminal to be connected to be the antenna; a ground terminal; a first diode whose anode is connected to the transmission circuit terminal and the cathode thereof is connected to the antenna terminal; a second diode whose anode is connected to the reception circuit terminal and the cathode thereof is connected to the ground terminal; a signal line for connecting the transmission circuit terminal, the reception circuit terminal, and the antenna terminal via the first diode; and an inductor or an LC filter disposed between the signal line and the ground terminal to reduce noise on the signal line; in which the transmission circuit terminal, the reception circuit terminal, the antenna terminal, the ground terminal, the first diode, and the second diode are disposed on a surface of the multilayer circuit board; at least a part of the signal line being disposed inside the multilayer circuit board; and the inductor being disposed either inside or on the surface of the multilayer circuit board.
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2.发明授权公开(公告)号：US06633748B1
公开(公告)日：2003-10-14
申请号：US09426231
申请日：1999-10-22
申请人： Takahiro Watanabe , Koji Tanaka , Koji Furutani , Hideki Muto , Takanori Uejima , Norio Nakajima
发明人： Takahiro Watanabe , Koji Tanaka , Koji Furutani , Hideki Muto , Takanori Uejima , Norio Nakajima
IPC分类号： H04B144
CPC分类号： H04B1/0057 , H03H7/46 , H03H7/463 , H03H2001/0085 , H03H2250/00 , H04B1/005 , H04B1/48
摘要： The invention provides a composite high frequency component constituting a part of a microwave circuit having plural signal paths corresponding to their respective frequencies, comprising: a diplexer for coupling transmitting signals from the plural signal paths for transmission and distributing receiving signals into said plural signal paths for reception; plural high frequency switches for separating the plural signal paths into a transmission section and a reception section, respectively; plural filters introduced in the signal paths; said diplexer, said high frequency switch, and said filters being integrated into a ceramic multi-layer substrate formed by lamination of plural ceramic sheet layers. According to the above described composite high frequency component, the diplexer, the high frequency switches, and the filters which constitute the composite high frequency component are integrated into the ceramic multi-layer substrate formed by lamination of plural ceramic sheet layers. Thus, the matching and adjustment between the diplexer and the high frequency switches can be easily performed. It is unnecessary to provide a matching circuit for matching and adjusting the diplexer and the high frequency switches, and moreover, the high frequency switches and the filters.
摘要翻译： 本发明提供构成具有与其各自频率对应的多个信号路径的微波电路的一部分的复合高频分量，包括：双工器，用于耦合来自多个信号路径的发送信号，用于传输，并将接收信号分配到所述多个信号路径中， 接待处 多个高频开关，分别将多个信号路径分离成发送部分和接收部分; 在信号路径中引入多个滤波器; 所述双工器，所述高频开关，并且所述滤波器集成到通过层叠多个陶瓷片层而形成的陶瓷多层基板中。 根据上述复合高频分量，构成复合高频分量的双工器，高频开关和滤波器集成在通过层叠多个陶瓷片层而形成的陶瓷多层基板中。 因此，可以容易地进行双工器与高频开关之间的匹配和调整。 不需要提供用于匹配和调整双工器和高频开关的匹配电路，还有高频开关和滤波器。
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3.发明授权公开(公告)号：US06445262B1
公开(公告)日：2002-09-03
申请号：US09672715
申请日：2000-09-28
申请人： Koji Tanaka , Koji Furutani , Takahiro Watanabe , Hideki Muto , Takanori Uejima , Norio Nakajima
发明人： Koji Tanaka , Koji Furutani , Takahiro Watanabe , Hideki Muto , Takanori Uejima , Norio Nakajima
IPC分类号： H03H972
CPC分类号： H03H7/463 , H03H2001/0085 , H03H2250/00
摘要： A composite high frequency component and a mobile communication apparatus incorporating the same which needs no matching circuits and can easily be miniaturized. The composite high frequency component is constituted of a diplexer, high frequency switches, high frequency filters, and surface acoustic wave filters. The diplexer is formed by first inductors and first capacitors. The high frequency switches are formed by diodes, second inductors, and second capacitors. The high frequency filters are formed by third inductors and third capacitors.
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公开(公告)号：US07183875B2
公开(公告)日：2007-02-27
申请号：US10698427
申请日：2003-11-03
申请人： Hideki Muto , Koji Tanaka , Koji Furutani , Takahiro Watanabe , Takanori Uejima , Norio Nakajima
发明人： Hideki Muto , Koji Tanaka , Koji Furutani , Takahiro Watanabe , Takanori Uejima , Norio Nakajima
CPC分类号： H04B1/48
摘要： A high frequency switching component for being connected to a transmission circuit, a reception circuit, and an antenna to be used for switching to either a state in which the transmission circuit is connected to the antenna, or a state in which the reception circuit is connected to the antenna, comprising: a multilayer circuit board, on which there is formed a circuit including: a transmission circuit terminal to be connected to the transmission circuit; a reception circuit terminal to be connected to the reception circuit; an antenna terminal to be connected to be the antenna; a ground terminal; a first diode whose anode is connected to the transmission circuit terminal and the cathode thereof is connected to the antenna terminal; a second diode whose anode is connected to the reception circuit terminal and the cathode thereof is connected to the ground terminal; a signal line for connecting the transmission circuit terminal, the reception circuit terminal, and the antenna terminal via the first diode; and an inductor or an LC filter disposed between the signal line and the ground terminal to reduce noise on the signal line; in which the transmission circuit terminal, the reception circuit terminal, the antenna terminal, the ground terminal, the first diode, and the second diode are disposed on a surface of the multilayer circuit board; at least a part of the signal line being disposed inside the multilayer circuit board; and the inductor being disposed either inside or on the surface of the multilayer circuit board.
摘要翻译： 用于连接到发送电路，接收电路和用于切换到发送电路连接到天线的状态的天线的高频开关组件或接收电路连接的状态 包括：多层电路板，其上形成有电路，所述电路包括：发送电路端子，连接到所述发送电路; 连接到接收电路的接收电路端子; 要连接成天线的天线端子; 地面终端; 其阳极连接到传输电路端子及其阴极的第一二极管连接到天线端子; 阳极连接到接收电路端子和其阴极的第二二极管连接到接地端子; 用于经由第一二极管连接发送电路端子，接收电路端子和天线端子的信号线; 以及设置在信号线和接地端子之间的电感器或LC滤波器，以减少信号线上的噪声; 其中传输电路端子，接收电路端子，天线端子，接地端子，第一二极管和第二二极管设置在多层电路板的表面上; 信号线的至少一部分设置在多层电路板的内部; 并且电感器设置在多层电路板的内部或表面上。
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5.发明授权公开(公告)号：US07200365B2
公开(公告)日：2007-04-03
申请号：US10441218
申请日：2003-05-20
申请人： Takahiro Watanabe , Koji Tanaka , Koji Furutani , Hideki Muto , Takanori Uejima , Norio Nakajima
发明人： Takahiro Watanabe , Koji Tanaka , Koji Furutani , Hideki Muto , Takanori Uejima , Norio Nakajima
IPC分类号： H04B1/40
CPC分类号： H04B1/0057 , H03H7/46 , H03H7/463 , H03H2001/0085 , H03H2250/00 , H04B1/005 , H04B1/48
摘要： The invention provides a composite high frequency component constituting a part of a microwave circuit having plural signal paths corresponding to their respective frequencies, comprising: a diplexer for coupling transmitting signals from the plural signal paths for transmission and distributing receiving signals into said plural signal paths for reception; plural high frequency switches for separating the plural signal paths into a transmission section and a reception section, respectively; plural filters introduced in the signal paths; said diplexer, said high frequency switch, and said filters being integrated into a ceramic multi-layer substrate formed by lamination of plural ceramic sheet layers. According to the above described composite high frequency component, the diplexer, the high frequency switches, and the filters which constitute the composite high frequency component are integrated into the ceramic multi-layer substrate formed by lamination of plural ceramic sheet layers. Thus, the matching and adjustment between the diplexer and the high frequency switches can be easily performed. It is unnecessary to provide a matching circuit for matching and adjusting the diplexer and the high frequency switches, and moreover, the high frequency switches and the filters.
摘要翻译： 本发明提供构成具有与其各自频率对应的多个信号路径的微波电路的一部分的复合高频分量，包括：双工器，用于耦合来自多个信号路径的发送信号，用于传输，并将接收信号分配到所述多个信号路径中， 接待处 多个高频开关，分别将多个信号路径分离成发送部分和接收部分; 在信号路径中引入多个滤波器; 所述双工器，所述高频开关，并且所述滤波器集成到通过层叠多个陶瓷片层而形成的陶瓷多层基板中。 根据上述复合高频分量，构成复合高频分量的双工器，高频开关和滤波器集成在通过层叠多个陶瓷片层而形成的陶瓷多层基板中。 因此，可以容易地进行双工器与高频开关之间的匹配和调整。 不需要提供用于匹配和调整双工器和高频开关的匹配电路，以及高频开关和滤波器。
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6.发明授权公开(公告)号：US06563396B2
公开(公告)日：2003-05-13
申请号：US10176124
申请日：2002-06-19
申请人： Koji Tanaka , Koji Furutani , Takahiro Watanabe , Hideki Muto , Takanori Uejima , Norio Nakajima
发明人： Koji Tanaka , Koji Furutani , Takahiro Watanabe , Hideki Muto , Takanori Uejima , Norio Nakajima
IPC分类号： H03H976
CPC分类号： H03H7/463 , H03H2001/0085 , H03H2250/00
摘要： A composite high frequency component and a mobile communication apparatus incorporating the same which needs no matching circuits and can easily be miniaturized. The composite high frequency component is constituted of a diplexer, high frequency switches, high frequency filters, and surface acoustic wave filters. The diplexer is formed by first inductors and first capacitors. The high frequency switches are formed by diodes, second inductors, and second capacitors. The high frequency filters are formed by third inductors and third capacitors.
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7.发明授权公开(公告)号：US06928298B2
公开(公告)日：2005-08-09
申请号：US09801497
申请日：2001-03-08
CPC分类号： H04B1/52 , H03H7/463 , H04B1/0053 , H04B1/406
摘要： A mobile communication device, preferably in the form of a dual-band cellular phone, includes two communications systems supporting different frequency bands, such as DCS in the 1.8 GHz band and GSM in the 900 MHz band. The mobile communication device includes an antenna, a high-frequency composite unit, DCS and GSM transmitters, and DCS and GSM receivers. The high-frequency composite unit contains a diplexer, DCS and GSM high-frequency switches, DCS and GSM high-frequency filters or notch filters, and a directional coupler.
摘要翻译： 优选地以双频蜂窝电话的形式的移动通信设备包括支持不同频带的两个通信系统，例如1.8GHz频带中的DCS和900MHz频带中的GSM。 移动通信设备包括天线，高频复合单元，DCS和GSM发射机以及DCS和GSM接收机。 高频复合单元包含双工器，DCS和GSM高频开关，DCS和GSM高频滤波器或陷波滤波器以及定向耦合器。
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公开(公告)号：US08368484B2
公开(公告)日：2013-02-05
申请号：US12906212
申请日：2010-10-18
申请人： Takanori Uejima
发明人： Takanori Uejima
CPC分类号： H03H7/463 , H03H2001/0085
摘要： A high-frequency switch module includes an ESD device, a switch IC, and a SAW filter element that are mounted on the surface of a multilayer substrate. A ground-side land for the ESD device is connected to an external-connection ground electrode for the ESD device by via holes and plane electrode patterns. A ground connection land for the switch IC and a ground connection land for the SAW filter element are connected to a common inner ground electrode by via holes, and are connected to a common external-connection ground electrode by via holes and another common inner ground electrode.
摘要翻译： 高频开关模块包括安装在多层基板的表面上的ESD装置，开关IC和SAW滤波器元件。 用于ESD器件的接地侧焊盘通过通孔和平面电极图案连接到ESD器件的外部连接接地电极。 用于开关IC的接地连接平台和用于SAW滤波器元件的接地连接用地通过通孔连接到公共内部接地电极，并且通过通孔和另一公共内部接地电极连接到公共外部接地电极 。
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公开(公告)号：US08654542B2
公开(公告)日：2014-02-18
申请号：US13232101
申请日：2011-09-14
申请人： Hisanori Murase , Takanori Uejima
发明人： Hisanori Murase , Takanori Uejima
CPC分类号： H01P1/15 , H01P1/10 , H05K1/0227 , H05K1/0237 , H05K2201/09663 , H05K2201/09972
摘要： In a high-frequency switch module, a switch IC is mounted on a multilayer board to define a high-frequency switch module. The multilayer board includes two internal wirings and two internal ground electrodes. The internal ground electrodes are spaced apart from each other at an interval when viewed from a lamination direction of the multilayer board. The first internal wiring is located on the upper surface side of the first internal ground electrode, and is entirely separated from an RF wiring, and the first internal wiring includes a power supply wiring for supplying power to the switch IC. The second internal wiring is located on the upper surface side of the second internal ground electrode, and is entirely separated from the power supply wiring, and the second internal wiring includes a signal wiring through which an RF signal propagates.
摘要翻译： 在高频开关模块中，开关IC安装在多层板上以形成高频开关模块。 多层板包括两个内部布线和两个内部接地电极。 当从多层板的层叠方向观察时，内部接地电极以间隔彼此间隔开。 第一内部布线位于第一内部接地电极的上表面侧，并且与RF布线完全分离，并且第一内部布线包括用于向开关IC供电的电源布线。 第二内部布线位于第二内部接地电极的上表面侧，并且与电源布线完全分离，并且第二内部布线包括RF信号通过其传播的信号布线。
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公开(公告)号：US08334731B2
公开(公告)日：2012-12-18
申请号：US12786656
申请日：2010-05-25
申请人： Takanori Uejima
发明人： Takanori Uejima
摘要： A high-frequency module includes at least first and second signal circuits that are each connected between a common antenna port and at least first and second signal ports. The first signal circuit includes a first inductor connected in series between the antenna port and the first signal port, a first capacitor connected in series between the first inductor and the first signal port, and a second inductor connected in shunt between the first capacitor and the first signal port. Series resonance is produced between the first inductor, the first capacitor, and the second inductor at a frequency within the frequency band of a target signal of the second signal circuit.
摘要翻译： 高频模块至少包括第一和第二信号电路，每个信号电路连接在公共天线端口与至少第一和第二信号端口之间。 第一信号电路包括串联连接在天线端口和第一信号端口之间的第一电感器，串联连接在第一电感器和第一信号端口之间的第一电容器和连接在第一电容器和第一电容器之间的第二电感器 第一个信号端口。 在第一电感器，第一电容器和第二电感器之间以第二信号电路的目标信号的频带内的频率产生串联谐振。
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