公开(公告)号：US20070289706A1

公开(公告)日：2007-12-20

申请号：US11649203

申请日：2007-01-04

申请人： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

发明人： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

IPC分类号： C09J5/06

CPC分类号： H05K3/4614 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4069 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/0568 ,  H05K2203/063 ,  Y10T29/49117

摘要： A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.

摘要翻译： 一种制造多层板的方法包括以下步骤：将粘合油墨施加到第一基板的端子上，粘合油墨包括含有填料和固化剂的热固性树脂，填料由镀有焊料的金属颗粒形成， 金属颗粒各自具有第一熔点，并且焊料具有低于第一熔点的第二熔点; 将第二基板接合到由热固性树脂构成的接合片，并且具有设置在与第二基板的端子对应的部分中的通孔; 并且利用接合片以这样的方式对第一和第二基板进行加热和加压，使得端子彼此相对以实现粘合片和粘合油墨的固化并形成一体结构。

公开(公告)号：US07943001B2

公开(公告)日：2011-05-17

申请号：US11649203

申请日：2007-01-04

申请人： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

发明人： Takashi Nakagawa ,  Seiichi Sugano ,  Kenji Iida ,  Yasutomo Maehara ,  Hitoshi Suzuki ,  Kaoru Sugimoto ,  Kenji Fukuzono ,  Takashi Kanda ,  Hiroaki Date ,  Tomohisa Yagi

IPC分类号： H04K3/34

CPC分类号： H05K3/4614 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4069 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/0568 ,  H05K2203/063 ,  Y10T29/49117

摘要： A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.

摘要翻译： 一种制造多层板的方法包括以下步骤：将粘合油墨施加到第一基板的端子上，粘合油墨包括含有填料和固化剂的热固性树脂，填料由镀有焊料的金属颗粒形成， 金属颗粒各自具有第一熔点，并且焊料具有低于第一熔点的第二熔点; 将第二基板接合到由热固性树脂构成的接合片，并且具有设置在与第二基板的端子对应的部分中的通孔; 并且利用接合片以这样的方式对第一和第二基板进行加热和加压，使得端子彼此相对以实现粘合片和粘合油墨的固化并形成一体结构。

公开(公告)号：US20090084590A1

公开(公告)日：2009-04-02

申请号：US12188257

申请日：2008-08-08

申请人： Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

发明人： Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

IPC分类号： H05K1/00

CPC分类号： H05K1/0366 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09145 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

摘要翻译： 电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。 电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。

公开(公告)号：US08119923B2

公开(公告)日：2012-02-21

申请号：US12188257

申请日：2008-08-08

申请人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

发明人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

IPC分类号： H05K1/00 ,  B32B9/00

CPC分类号： H05K1/0366 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09145 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

摘要翻译： 电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。 电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。

公开(公告)号：US08152953B2

公开(公告)日：2012-04-10

申请号：US12365279

申请日：2009-02-04

申请人： Hideaki Yoshimura ,  Takashi Nakagawa ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi

发明人： Hideaki Yoshimura ,  Takashi Nakagawa ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi

IPC分类号： B32B37/12

CPC分类号： H05K3/321 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0218 ,  H05K2201/0323 ,  H05K2201/0361 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/061

摘要： The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.

摘要翻译： 响应于粘合片的软化，第一支撑体被压靠在第二支撑体上。 允许填料在第一导电焊盘和第二导电焊盘之间彼此可靠地接触。 粘合片软化后，填料熔化。 金属间化合物形成在填料和导电性焊盘之间以及填料之间。 电连接以这种方式建立在第一导电焊盘和第二导电焊盘之间。 然后将基质材料和粘合片固化。 第一支撑体和第二支撑体彼此牢固地接合。

公开(公告)号：US20110100690A1

公开(公告)日：2011-05-05

申请号：US12915786

申请日：2010-10-29

申请人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi ,  Hiroki Ikeda ,  Katsu Yanagimoto

发明人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi ,  Hiroki Ikeda ,  Katsu Yanagimoto

IPC分类号： H05K1/02 ,  B32B15/08 ,  B23K35/12 ,  H01B1/02 ,  B23K31/02

CPC分类号： H05K3/4614 ,  H01B1/02 ,  H01B1/026 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/01327 ,  H05K1/186 ,  H05K3/1216 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4069 ,  H05K3/4647 ,  H05K2201/0272 ,  H05K2201/09036 ,  H05K2201/10992 ,  Y10T428/31678 ,  H01L2924/00

摘要： An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases.

摘要翻译： 导电体包括：第一导电材料; 第二导电材料; 以及至少用于导电的将第一导电材料接合到第二导电材料的接合材料。 接合材料由含有铜 - 锡基金属间化合物相和锡 - 铋相的金属结构制成，铜 - 锡基金属间化合物相在第一导电材料和第二导电材料之间连续，锡 - 铋 相被铜 - 锡基金属间化合物相包围。

公开(公告)号：US06869822B2

公开(公告)日：2005-03-22

申请号：US10105287

申请日：2002-03-26

申请人： Tomohisa Yagi ,  Nobuhiro Imaizumi ,  Yasuhiro Usui ,  Kenji Fukuzono

发明人： Tomohisa Yagi ,  Nobuhiro Imaizumi ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/12 ,  H01L23/498 ,  H01L21/44

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512

摘要： According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.

摘要翻译： 根据制造半导体器件的方法，通过倒装芯片接合，半导体芯片通过凸块接合到基板。 然后，将密封粘合剂组合物装载在半导体芯片和基板之间以提供粘合剂密封。 能够两阶段硬化的密封粘合剂组合物至少含有第一主要树脂成分，第二主要树脂成分和硬化剂。 然后，加热粘合剂密封件进行一次硬化。 然后，将基板放置在母板上，其中焊料材料插入在基板和母板之间。 最后，将粘合剂密封加热以进行二次硬化，同时将焊料回流焊接到母板上。

公开(公告)号：US20050110169A1

公开(公告)日：2005-05-26

申请号：US11019617

申请日：2004-12-23

申请人： Tomohisa Yagi ,  Nobuhiro Imaizumi ,  Yasuhiro Usui ,  Kenji Fukuzono

发明人： Tomohisa Yagi ,  Nobuhiro Imaizumi ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/12 ,  H01L23/498 ,  H01L23/495

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512

摘要： According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.

摘要翻译： 根据制造半导体器件的方法，通过倒装芯片接合，半导体芯片通过凸块接合到基板。 然后，在半导体芯片和基板之间加载密封粘合剂组合物以提供粘合剂密封。 能够两阶段硬化的密封粘合剂组合物至少含有第一主要树脂成分，第二主要树脂成分和硬化剂。 然后，加热粘合剂密封件进行一次硬化。 然后，将基板放置在母板上，其中焊料材料插入在基板和母板之间。 最后，将粘合剂密封加热以进行二次硬化，同时将焊料回流焊接到母板上。

公开(公告)号：US20070222039A1

公开(公告)日：2007-09-27

申请号：US11526100

申请日：2006-09-25

申请人： Takashi Kanda ,  Kenji Fukuzono

发明人： Takashi Kanda ,  Kenji Fukuzono

IPC分类号： H01L23/58

CPC分类号： H01L24/83 ,  H01L21/6835 ,  H01L23/36 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/16 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81101 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19106 ,  H05K3/323 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/467 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/05599

摘要： A semiconductor device includes a multi-layer substrate and a semiconductor element mounted on the multi-layer substrate. The multi-layer substrate contains a plurality of circuit-formation layers joined by a first resin material. The semiconductor element is mounted on the multi-layer substrate by being joined to the multi-layer substrate by a second resin material. The first resin material and the second resin material are curable in the same heating condition.

摘要翻译： 半导体器件包括多层基板和安装在多层基板上的半导体元件。 多层基板包含由第一树脂材料连接的多个电路形成层。 半导体元件通过第二树脂材料与多层基板接合而安装在多层基板上。 第一树脂材料和第二树脂材料在相同的加热条件下可固化。

公开(公告)号：US07053493B2

公开(公告)日：2006-05-30

申请号：US10992651

申请日：2004-11-22

申请人： Takashi Kanda ,  Kenji Fukuzono

发明人： Takashi Kanda ,  Kenji Fukuzono

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/562 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device including a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted. The adhesive has a coefficient of thermal expansion smaller than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or larger than 10 GPa. Otherwise, the adhesive has a coefficient of thermal expansion larger than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or smaller than 10 GPa. The height of the stiffener is less than that of the external terminals.

摘要翻译： 一种半导体器件，包括衬底，安装在衬底上的半导体元件和经由粘合剂附着到衬底的与安装半导体元件的表面相对的表面的加强件。 粘合剂的热膨胀系数小于基材和加强件的热膨胀系数，并且粘合剂的纵向弹性模量等于或大于10GPa。 否则，粘合剂的热膨胀系数大于基材和加强件的热膨胀系数，并且粘合剂的纵向弹性模量等于或小于10GPa。 加强件的高度小于外部端子的高度。