-
公开(公告)号:USD562234S1
公开(公告)日:2008-02-19
申请号:US29278749
申请日:2007-04-09
-
公开(公告)号:USD562233S1
公开(公告)日:2008-02-19
申请号:US29278747
申请日:2007-04-09
-
公开(公告)号:USD561095S1
公开(公告)日:2008-02-05
申请号:US29278750
申请日:2007-04-09
-
公开(公告)号:US20120236500A1
公开(公告)日:2012-09-20
申请号:US13329423
申请日:2011-12-19
申请人: Masato Higuchi , Yasuhiko Kawanami , Katsushi Terazono , Koji Higashikawa , Akira Sasaki , Takayuki Morihara , Takashi Aoki , Tetsuya Ito , Yukihisa Nakabayashi , Tasuku Isobe , Kiyonori Koguma
发明人: Masato Higuchi , Yasuhiko Kawanami , Katsushi Terazono , Koji Higashikawa , Akira Sasaki , Takayuki Morihara , Takashi Aoki , Tetsuya Ito , Yukihisa Nakabayashi , Tasuku Isobe , Kiyonori Koguma
IPC分类号: H05K7/20
CPC分类号: H01L23/473 , H01L25/112 , H01L2224/16225 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011 , H02M7/003 , H01L2924/00
摘要: A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.
摘要翻译: 布线基板包括:导体板,包括布线部分和连接到功率转换半导体元件的电极部分;液体冷却管,安装在导体板附近并使冷却液供应到其中;以及绝缘树脂材料,布置在 至少在导体板和液体冷却管之间。
-
公开(公告)号:US20120235162A1
公开(公告)日:2012-09-20
申请号:US13330540
申请日:2011-12-19
申请人: Tasuku ISOBE , Yasuhiko Kawanami , Yukihisa Nakabayashi , Masato Higuchi , Koji Higashikawa , Katsushi Terazono , Akira Sasaki , Takayuki Morihara , Takashi Aoki , Tetsuya Ito , Kiyonori Koguma
发明人: Tasuku ISOBE , Yasuhiko Kawanami , Yukihisa Nakabayashi , Masato Higuchi , Koji Higashikawa , Katsushi Terazono , Akira Sasaki , Takayuki Morihara , Takashi Aoki , Tetsuya Ito , Kiyonori Koguma
CPC分类号: H01L23/473 , H01L23/3121 , H01L23/3677 , H01L23/467 , H01L23/49827 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/30 , H01L24/32 , H01L25/072 , H01L25/115 , H01L25/117 , H01L25/18 , H01L2224/05647 , H01L2224/06181 , H01L2224/29116 , H01L2224/29118 , H01L2224/29144 , H01L2224/29211 , H01L2224/29216 , H01L2224/29244 , H01L2224/29294 , H01L2224/29295 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29411 , H01L2224/29455 , H01L2224/30181 , H01L2224/32225 , H01L2224/32245 , H01L2224/48847 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/07802 , H01L2924/09701 , H01L2924/10272 , H01L2924/1033 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H02M7/003 , H01L2924/01014 , H01L2924/01042 , H01L2924/0105 , H01L2924/00 , H01L2224/48 , H01L2924/01004
摘要: This power converter includes a power-conversion semiconductor element, an electrode conductor having a substantially flat upper end surface, and a sealant. The sealant allows the substantially flat upper end surface of the electrode conductor to be exposed at an upper surface of the sealant, and provides electrical connection with an external device at the upper end surface of the exposed electrode conductor.
摘要翻译: 该功率转换器包括功率转换半导体元件,具有基本平坦的上端面的电极导体和密封剂。 密封剂允许电极导体的基本上平坦的上端表面暴露在密封剂的上表面处,并且在暴露的电极导体的上端表面处提供与外部装置的电连接。
-
公开(公告)号:US08537550B2
公开(公告)日:2013-09-17
申请号:US13329423
申请日:2011-12-19
申请人: Masato Higuchi , Yasuhiko Kawanami , Katsushi Terazono , Koji Higashikawa , Akira Sasaki , Takayuki Morihara , Takashi Aoki , Tetsuya Ito , Yukihisa Nakabayashi , Tasuku Isobe , Kiyonori Koguma
发明人: Masato Higuchi , Yasuhiko Kawanami , Katsushi Terazono , Koji Higashikawa , Akira Sasaki , Takayuki Morihara , Takashi Aoki , Tetsuya Ito , Yukihisa Nakabayashi , Tasuku Isobe , Kiyonori Koguma
IPC分类号: H05K7/20
CPC分类号: H01L23/473 , H01L25/112 , H01L2224/16225 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011 , H02M7/003 , H01L2924/00
摘要: A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.
摘要翻译: 布线基板包括:导体板,包括布线部分和连接到功率转换半导体元件的电极部分;液体冷却管,安装在导体板附近并使冷却液供应到其中;以及绝缘树脂材料,布置在 至少在导体板和液体冷却管之间。
-
-
-
-
-