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公开(公告)号:US07145231B2
公开(公告)日:2006-12-05
申请号:US10844392
申请日:2004-05-13
申请人: Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
发明人: Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
IPC分类号: H01L23/34
CPC分类号: H01L24/16 , H01L23/142 , H01L23/367 , H01L23/3677 , H01L23/49822 , H01L23/49833 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/29139 , H01L2224/2929 , H01L2224/32057 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83385 , H01L2224/83851 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H05K1/0206 , H05K1/0207 , H05K1/021 , H05K1/056 , H05K1/144 , H05K3/384 , H05K3/4608 , H05K3/4641 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/09563 , H05K2201/09572 , H05K2201/0959 , H05K2201/096 , H05K2201/09845 , H05K2201/10734 , H01L2924/05432 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.
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公开(公告)号:US20090008128A1
公开(公告)日:2009-01-08
申请号:US12184119
申请日:2008-07-31
申请人: Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
发明人: Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
IPC分类号: H05K1/00
CPC分类号: H01L24/16 , H01L23/142 , H01L23/367 , H01L23/3677 , H01L23/49822 , H01L23/49833 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/29139 , H01L2224/2929 , H01L2224/32057 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83385 , H01L2224/83851 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H05K1/0206 , H05K1/0207 , H05K1/021 , H05K1/056 , H05K1/144 , H05K3/384 , H05K3/4608 , H05K3/4641 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/09563 , H05K2201/09572 , H05K2201/0959 , H05K2201/096 , H05K2201/09845 , H05K2201/10734 , H01L2924/05432 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.
摘要翻译: 本发明提供一种电子设备,其具有包括金属板的金属芯基板,形成在金属板上的绝缘层和形成在绝缘层上的导电层,以及电子部件,并且导电层和导体层的端子 电子部件连接。 在电子设备中,具有高导热性的部件被布置成与金属板和电子部件都接触。 因此,电子设备的散热性提高。
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公开(公告)号:US06744135B2
公开(公告)日:2004-06-01
申请号:US10147073
申请日:2002-05-17
申请人: Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
发明人: Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
IPC分类号: H01L2334
CPC分类号: H01L24/16 , H01L23/142 , H01L23/367 , H01L23/3677 , H01L23/49822 , H01L23/49833 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/29139 , H01L2224/2929 , H01L2224/32057 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83385 , H01L2224/83851 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H05K1/0206 , H05K1/0207 , H05K1/021 , H05K1/056 , H05K1/144 , H05K3/384 , H05K3/4608 , H05K3/4641 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/09563 , H05K2201/09572 , H05K2201/0959 , H05K2201/096 , H05K2201/09845 , H05K2201/10734 , H01L2924/05432 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.
摘要翻译: 本发明提供一种电子设备,其具有包括金属板的金属芯基板,形成在金属板上的绝缘层和形成在绝缘层上的导电层,以及电子部件,并且导电层和导体层的端子 电子部件连接。 在电子设备中,具有高导热性的部件被布置成与金属板和电子部件两者接触。 因此,电子设备的散热性提高。
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公开(公告)号:US07425762B2
公开(公告)日:2008-09-16
申请号:US11607910
申请日:2006-12-04
申请人: Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
发明人: Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
IPC分类号: H01L23/34
CPC分类号: H01L24/16 , H01L23/142 , H01L23/367 , H01L23/3677 , H01L23/49822 , H01L23/49833 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/29139 , H01L2224/2929 , H01L2224/32057 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83385 , H01L2224/83851 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H05K1/0206 , H05K1/0207 , H05K1/021 , H05K1/056 , H05K1/144 , H05K3/384 , H05K3/4608 , H05K3/4641 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/09563 , H05K2201/09572 , H05K2201/0959 , H05K2201/096 , H05K2201/09845 , H05K2201/10734 , H01L2924/05432 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.
摘要翻译: 本发明提供一种电子设备,其具有包括金属板的金属芯基板,形成在金属板上的绝缘层和形成在绝缘层上的导电层,以及电子部件,并且导电层和导体层的端子 电子部件连接。 在电子设备中,具有高导热性的部件被布置成与金属板和电子部件都接触。 因此,电子设备的散热性提高。
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公开(公告)号:US20070080447A1
公开(公告)日:2007-04-12
申请号:US11607910
申请日:2006-12-04
申请人: Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
发明人: Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
CPC分类号: H01L24/16 , H01L23/142 , H01L23/367 , H01L23/3677 , H01L23/49822 , H01L23/49833 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/29139 , H01L2224/2929 , H01L2224/32057 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83385 , H01L2224/83851 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H05K1/0206 , H05K1/0207 , H05K1/021 , H05K1/056 , H05K1/144 , H05K3/384 , H05K3/4608 , H05K3/4641 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/09563 , H05K2201/09572 , H05K2201/0959 , H05K2201/096 , H05K2201/09845 , H05K2201/10734 , H01L2924/05432 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.
摘要翻译: 本发明提供一种电子设备,其具有包括金属板的金属芯基板,形成在金属板上的绝缘层和形成在绝缘层上的导电层,以及电子部件,并且导电层和导体层的端子 电子部件连接。 在电子设备中,具有高导热性的部件被布置成与金属板和电子部件都接触。 因此,电子设备的散热性提高。
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公开(公告)号:US20060068609A1
公开(公告)日:2006-03-30
申请号:US11183972
申请日:2005-07-19
申请人: Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Isamu Yoshida , Masahiko Asano , Koji Sato , Shuji Eguchi , Kaoru Uchiyama
发明人: Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Isamu Yoshida , Masahiko Asano , Koji Sato , Shuji Eguchi , Kaoru Uchiyama
IPC分类号: H05K1/00
CPC分类号: H05K5/069 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/19105 , H01L2924/3025 , H05K1/0313 , H05K3/3447 , H05K5/0069 , H05K2201/0999 , H05K2201/10189 , H05K2201/10977 , H05K2201/2009 , Y10S439/935 , H01L2924/00
摘要: An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.
摘要翻译: 一种电子设备包括具有通孔并使用玻璃化转变温度超过150℃的树脂作为基底的电路板,具有开口的金属外壳和安装在所述开口的连接器 金属壳体,其中连接器的销插入通孔中,销和通孔与导电构件连接,并且还在导电构件上设置用于固定连接器和板的加强构件,从而改善 电子设备的可靠性。
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公开(公告)号:US07445455B2
公开(公告)日:2008-11-04
申请号:US11183972
申请日:2005-07-19
申请人: Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Isamu Yoshida , Masahiko Asano , Koji Sato , Shuji Eguchi , Kaoru Uchiyama
发明人: Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Isamu Yoshida , Masahiko Asano , Koji Sato , Shuji Eguchi , Kaoru Uchiyama
IPC分类号: H01R12/00
CPC分类号: H05K5/069 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/19105 , H01L2924/3025 , H05K1/0313 , H05K3/3447 , H05K5/0069 , H05K2201/0999 , H05K2201/10189 , H05K2201/10977 , H05K2201/2009 , Y10S439/935 , H01L2924/00
摘要: An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.
摘要翻译: 一种电子设备包括具有通孔并使用玻璃化转变温度超过150℃的树脂作为基底的电路板,具有开口的金属外壳和安装在所述开口的连接器 金属壳体,其中连接器的销插入通孔中,销和通孔与导电构件连接,并且还在导电构件上设置用于固定连接器和板的加强构件,从而改善 电子设备的可靠性。
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公开(公告)号:US07554039B2
公开(公告)日:2009-06-30
申请号:US10535857
申请日:2003-06-20
申请人: Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Kaoru Uchiyama , Shuji Eguchi , Masahiko Asano , Koji Sato
发明人: Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Kaoru Uchiyama , Shuji Eguchi , Masahiko Asano , Koji Sato
IPC分类号: H05K1/00
CPC分类号: H05K1/021 , H01L23/3677 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/19105 , H05K1/0206 , H05K1/056 , H05K1/182 , H05K3/3436 , H05K3/4608 , H05K2201/10734 , H05K2203/049 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.
摘要翻译: 在具有作为MCM结构的插入器基板的电子设备中,提高了散热性能,同时保持了插入器基板和母板之间的接合的可靠性。 在本发明中,中间层基板和母板两者都使用具有高热容量和高导热性的金属芯基材。 此外,在内插基板和母板的至少一个上设置有芯金属露出的部分。 在芯金属露出部上直接形成焊点焊盘,并将插入基板与母板焊接。
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公开(公告)号:US20080142571A1
公开(公告)日:2008-06-19
申请号:US11949849
申请日:2007-12-04
IPC分类号: B23K1/06
CPC分类号: H05K1/144 , H01L2924/0002 , H05K1/056 , H05K3/328 , H05K3/3447 , H05K3/368 , H05K3/4015 , H05K2201/042 , H05K2201/0979 , H05K2201/1028 , H05K2201/10303 , H05K2201/10318 , H05K2201/10856 , H05K2201/10924 , H05K2203/0285 , H01L2924/00
摘要: Since an electronic device of the present invention has a pair of joint pieces thereof formed (extended) on both sides with respect to one end of the body thereof, the pair of joint pieces both connected to one of the substrates improves the joining strength between the lead frame connector and the one of substrates and ensures the reliability of electrical connection between the lead frame connector and the one of the substrates.
摘要翻译: 由于本发明的电子设备具有相对于其本体的一端在两侧形成(延伸)的一对连接件,所以与一个基板连接的一对连接件提高了两者之间的接合强度 引线框架连接器和基板之一,并且确保引线框架连接器和一个基板之间的电连接的可靠性。
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公开(公告)号:US20060234420A1
公开(公告)日:2006-10-19
申请号:US10535857
申请日:2003-06-20
申请人: Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Kaoru Uchiyama , Shuji Eguchi , Masahiko Asano , Koji Sato
发明人: Takehide Yokozuka , Masahide Harada , Shiro Yamashita , Kaoru Uchiyama , Shuji Eguchi , Masahiko Asano , Koji Sato
IPC分类号: H01L21/00
CPC分类号: H05K1/021 , H01L23/3677 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/19105 , H05K1/0206 , H05K1/056 , H05K1/182 , H05K3/3436 , H05K3/4608 , H05K2201/10734 , H05K2203/049 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a mother board is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.
摘要翻译: 在具有作为MCM结构的中介基板的电子设备中,提高了散热性能,同时保持了插入器基板和母板之间的接合的可靠性。 在本发明中,中间层基板和母板两者都使用具有高热容量和高导热性的金属芯基材。 此外,在内插基板和母板的至少一个上设置有芯金属露出的部分。 在芯金属露出部上直接形成焊点焊盘,并将插入基板与母板焊接。
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