PATTERN FORMING PROCESS AND RESIST-MODIFYING COMPOSITION
    1.
    发明申请
    PATTERN FORMING PROCESS AND RESIST-MODIFYING COMPOSITION 有权
    图案形成过程和电阻修饰组合物

    公开(公告)号:US20100209849A1

    公开(公告)日:2010-08-19

    申请号:US12708196

    申请日:2010-02-18

    IPC分类号: G03F7/027 G03F7/20 G03F7/004

    摘要: A patterning process includes (1) coating and baking a first positive resist composition to form a first resist film, exposing, post-exposure baking, and alkali developing to form a first resist pattern, (2) applying a resist-modifying composition to the first resist pattern and heating to modify the first resist pattern, (3) coating and baking a second positive resist composition to form a second resist film, exposing, post-exposure baking, and alkali developing to form a second resist pattern. The modified first resist film has a contact angle with pure water of 50°-85°.

    摘要翻译: 图案化工艺包括(1)涂覆和烘烤第一正性抗蚀剂组合物以形成第一抗蚀剂膜,曝光,曝光后烘烤和碱显影以形成第一抗蚀剂图案,(2)将抗蚀剂改性组合物施加到 第一抗蚀剂图案和加热以修饰第一抗蚀剂图案,(3)涂覆和烘烤第二正性抗蚀剂组合物以形成第二抗蚀剂膜,曝光,曝光后烘烤和碱显影以形成第二抗蚀剂图案。 改性的第一抗蚀剂膜与纯水的接触角为50°-85°。

    Pattern forming process and resist-modifying composition
    2.
    发明授权
    Pattern forming process and resist-modifying composition 有权
    图案形成工艺和抗蚀剂改性组合物

    公开(公告)号:US08367310B2

    公开(公告)日:2013-02-05

    申请号:US12708196

    申请日:2010-02-18

    IPC分类号: G03F7/26

    摘要: A patterning process includes (1) coating and baking a first positive resist composition to form a first resist film, exposing, post-exposure baking, and alkali developing to form a first resist pattern, (2) applying a resist-modifying composition to the first resist pattern and heating to modify the first resist pattern, (3) coating and baking a second positive resist composition to form a second resist film, exposing, post-exposure baking, and alkali developing to form a second resist pattern. The modified first resist film has a contact angle with pure water of 50°-85°.

    摘要翻译: 图案化工艺包括(1)涂覆和烘烤第一正性抗蚀剂组合物以形成第一抗蚀剂膜,曝光,曝光后烘烤和碱显影以形成第一抗蚀剂图案,(2)将抗蚀剂改性组合物施加到 第一抗蚀剂图案和加热以修饰第一抗蚀剂图案,(3)涂覆和烘烤第二正性抗蚀剂组合物以形成第二抗蚀剂膜,曝光,曝光后烘烤和碱显影以形成第二抗蚀剂图案。 改性的第一抗蚀剂膜与纯水的接触角为50°-85°。

    Resist-modifying composition and pattern forming process
    3.
    发明授权
    Resist-modifying composition and pattern forming process 有权
    抗蚀剂改性组合物和图案形成工艺

    公开(公告)号:US08329384B2

    公开(公告)日:2012-12-11

    申请号:US12785930

    申请日:2010-05-24

    IPC分类号: G03F7/00 G03F7/004 G03F7/40

    摘要: A patterning process includes (1) coating a first positive resist composition onto a substrate, baking, exposing, post-exposure baking, and alkali developing to form a first resist pattern, (2) coating a resist-modifying composition onto the first resist pattern and heating to effect modifying treatment, and (3) coating a second positive resist composition, baking, exposing, post-exposure baking, and alkali developing to form a second resist pattern. The resist modifying composition comprises a base resin comprising recurring units having formula (1) wherein A1 is alkylene, R1 is H or methyl, R2 is alkyl or bond together to form a nitrogen-containing heterocycle, and an alcohol-based solvent.

    摘要翻译: 图案化工艺包括(1)将第一正性抗蚀剂组合物涂覆在基材上,烘烤,曝光,曝光后烘烤和碱显影以形成第一抗蚀剂图案,(2)将抗蚀剂改性组合物涂覆到第一抗蚀剂图案上 加热进行改性处理,(3)涂布第二正性抗蚀剂组合物,烘烤,曝光,曝光后烘烤和碱显影以形成第二抗蚀剂图案。 抗蚀剂改性组合物包括含有式(1)的重复单元的基础树脂,其中A1是亚烷基,R1是H或甲基,R2是烷基或键合在一起形成含氮杂环和醇类溶剂。

    RESIST-MODIFYING COMPOSITION AND PATTERN FORMING PROCESS
    5.
    发明申请
    RESIST-MODIFYING COMPOSITION AND PATTERN FORMING PROCESS 有权
    电阻修饰组合物和图案形成工艺

    公开(公告)号:US20100297563A1

    公开(公告)日:2010-11-25

    申请号:US12785930

    申请日:2010-05-24

    IPC分类号: G03F7/20

    摘要: A patterning process includes (1) coating a first positive resist composition onto a substrate, baking, exposing, post-exposure baking, and alkali developing to form a first resist pattern, (2) coating a resist-modifying composition onto the first resist pattern and heating to effect modifying treatment, and (3) coating a second positive resist composition, baking, exposing, post-exposure baking, and alkali developing to form a second resist pattern. The resist modifying composition comprises a base resin comprising recurring units having formula (1) wherein A1 is alkylene, R1 is H or methyl, R2 is alkyl or bond together to form a nitrogen-containing heterocycle, and an alcohol-based solvent.

    摘要翻译: 图案化工艺包括(1)将第一正性抗蚀剂组合物涂覆在基材上,烘烤,曝光,曝光后烘烤和碱显影以形成第一抗蚀剂图案,(2)将抗蚀剂改性组合物涂覆到第一抗蚀剂图案上 加热进行改性处理,(3)涂布第二正性抗蚀剂组合物,烘烤,曝光,曝光后烘烤和碱显影以形成第二抗蚀剂图案。 抗蚀剂改性组合物包括含有式(1)的重复单元的基础树脂,其中A1是亚烷基,R1是H或甲基,R2是烷基或键合在一起形成含氮杂环,和醇类溶剂。

    Resist-modifying composition and pattern forming process
    6.
    发明授权
    Resist-modifying composition and pattern forming process 有权
    抗蚀剂改性组合物和图案形成工艺

    公开(公告)号:US08426105B2

    公开(公告)日:2013-04-23

    申请号:US12786759

    申请日:2010-05-25

    IPC分类号: G03F7/004

    摘要: A patterning process includes (1) coating a first positive resist composition onto a substrate, baking, exposing, post-exposure baking, and alkali developing to form a first resist pattern, (2) coating a resist-modifying composition onto the first resist pattern and heating to effect modifying treatment, and (3) coating a second positive resist composition, baking, exposing, post-exposure baking, and alkali developing to form a second resist pattern. The resist-modifying composition comprises a carbamate compound and a solvent.

    摘要翻译: 图案化工艺包括(1)将第一正性抗蚀剂组合物涂覆在基材上,烘烤,曝光,曝光后烘烤和碱显影以形成第一抗蚀剂图案,(2)将抗蚀剂改性组合物涂覆到第一抗蚀剂图案上 加热进行改性处理,(3)涂布第二正性抗蚀剂组合物,烘烤,曝光,曝光后烘烤和碱显影以形成第二抗蚀剂图案。 抗蚀剂改性组合物包含氨基甲酸酯化合物和溶剂。

    Polymer, resist composition and patterning process
    10.
    发明授权
    Polymer, resist composition and patterning process 有权
    聚合物,抗蚀剂组合物和图案化工艺

    公开(公告)号:US06566037B2

    公开(公告)日:2003-05-20

    申请号:US09797878

    申请日:2001-03-05

    IPC分类号: G03F7038

    摘要: A polymer comprising recurring units of formula (1) and having a Mw of 1,000-500,000 is provided. R1 is H, methyl or CH2CO2R3, R2 is H, methyl or CO2R3, R3 is alkyl, R4 is H, alkyl, alkoxyalkyl or acyl, R5 and R15 are acid labile groups, and at least one of R6 to R9 is a carboxyl or hydroxyl-containing monovalent hydrocarbon group, and the reminders are H or alkyl, at least one of R10 to R13 is a monovalent hydrocarbon group containing a —CO2— partial structure, and the reminders are H or alkyl, R14 is a polycyclic hydrocarbon group or polycyclic hydrocarbon-containing alkyl group, Z is a trivalent hydrocarbon group, k=0 or 1, x is>0, a, b, c and d are≧0, satisfying x+a+b+c+d=1. A resist composition comprising the polymer has significantly improved sensitivity, resolution and etching resistance and is very useful in microfabrication.

    摘要翻译: 提供了包含式(1)的重复单元并且具有1,000-500,000的Mw的聚合物.R1是H,甲基或CH2CO2R3,R2是H,甲基或CO2R3,R3是烷基,R4是H,烷基,烷氧基烷基或酰基 R 5和R 15为酸不稳定基团,R 6〜R 9中的至少一个为羧基或羟基的一价烃基,提醒为H或烷基,R 10〜R 13中的至少一个为含有 -CO 2部分结构,提醒为H或烷基,R 14为多环烃基或含多环烃基的烷基,Z为三价烃基,k = 0或1,x为> 0,a,b, c和d为> = 0,满足x + a + b + c + d = 1。 包含聚合物的抗蚀剂组合物具有显着提高的灵敏度,分辨率和耐蚀刻性,并且在微细加工中非常有用。