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公开(公告)号:US06996902B2
公开(公告)日:2006-02-14
申请号:US10389515
申请日:2003-03-14
IPC分类号: H01K3/10
CPC分类号: H05K3/4069 , H05K1/0366 , H05K1/115 , H05K3/0032 , H05K3/0047 , H05K3/4614 , H05K3/4652 , H05K2201/0287 , H05K2201/029 , H05K2201/0355 , H05K2201/094 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/24994 , Y10T428/249953
摘要: A circuit board includes an electrical insulator layer formed of a reinforcer sheet with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes provided in a high-density portion of the reinforcer sheet are formed to have a smaller cross-section than the inner via holes provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass-epoxy base material is used for an insulator layer.
摘要翻译: 电路板包括由其面内方向具有密度分布的增强片形成的电绝缘体层,填充在电绝缘体层的厚度方向上的多个内部通孔中的电导体和连接到电绝缘体层的布线层 到电导体。 设置在加强片的高密度部分中的内通孔形成为具有比设置在加强片的低密度部分中的内通孔更小的横截面。 以这种方式,可以提供一种电路板,其可以实现高密度布线和具有较小变化的内部通孔连接电阻,当包括在其面内方向上具有密度分布的增强片的基底材料 玻璃 - 环氧树脂基材用于绝缘体层。
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公开(公告)号:US06686029B2
公开(公告)日:2004-02-03
申请号:US10373520
申请日:2003-02-24
IPC分类号: B32B300
CPC分类号: H05K3/4069 , H05K1/0366 , H05K1/115 , H05K3/0032 , H05K3/0047 , H05K3/4614 , H05K3/4652 , H05K2201/0287 , H05K2201/029 , H05K2201/0355 , H05K2201/094 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/24994 , Y10T428/249953
摘要: A circuit board includes an electrical insulator layer formed of a reinforcer sheet with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes provided in a high-density portion of the reinforcer sheet are formed to have a smaller cross-section than the inner via holes provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass-epoxy base material is used for an insulator layer.
摘要翻译: 电路板包括由其面内方向具有密度分布的增强片形成的电绝缘体层,填充在电绝缘体层的厚度方向上的多个内部通孔中的电导体和连接到电绝缘体层的布线层 到电导体。 设置在加强片的高密度部分中的内通孔形成为具有比设置在加强片的低密度部分中的内通孔更小的横截面。 以这种方式,可以提供一种电路板,其可以实现高密度布线和具有较小变化的内部通孔连接电阻,当包括在其面内方向上具有密度分布的增强片的基底材料 玻璃 - 环氧树脂基材用于绝缘体层。
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公开(公告)号:US06558780B2
公开(公告)日:2003-05-06
申请号:US10045344
申请日:2001-10-25
IPC分类号: B32B300
CPC分类号: H05K3/4069 , H05K1/0366 , H05K1/115 , H05K3/0032 , H05K3/0047 , H05K3/4614 , H05K3/4652 , H05K2201/0287 , H05K2201/029 , H05K2201/0355 , H05K2201/094 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/24994 , Y10T428/249953
摘要: A circuit board includes an electrical insulator layer formed of a reinforcer sheet with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes provided in a high-density portion of the reinforcer sheet are formed to have a smaller cross-section than the inner via holes provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass-epoxy base material is used for an insulator layer.
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公开(公告)号:US07047629B2
公开(公告)日:2006-05-23
申请号:US10686576
申请日:2003-10-17
申请人: Shinobu Kokufu , Takeshi Suzuki , Fumio Echigo , Daizo Andoh , Tatsuo Ogawa , Yoshihiro Kawakita , Satoru Tomekawa
发明人: Shinobu Kokufu , Takeshi Suzuki , Fumio Echigo , Daizo Andoh , Tatsuo Ogawa , Yoshihiro Kawakita , Satoru Tomekawa
IPC分类号: H05K3/20
CPC分类号: H05K3/4069 , H05K3/282 , H05K3/389 , H05K3/4614 , H05K2201/0239 , H05K2201/0355 , H05K2203/1461 , Y10T29/49126 , Y10T29/49128 , Y10T29/49153 , Y10T29/49155 , Y10T29/49165 , Y10T29/49171 , Y10T428/24917
摘要: A circuit board manufacturing method including the steps of forming a through hole on an insulator layer and then filling the through hole with a conductive paste; dispersing and forming a protective agent on an adhesion surface of a conductor foil so as to include adhesion surface regions where the protective agent does not exist; sticking the conductor foil to the insulator layer; and abutting a plurality of conductive powders constituting the conductive paste and the conductor foil to each other through the adhesion surface regions by means of heating and pressurizing the insulator layer and conductor foil.
摘要翻译: 一种电路板制造方法,包括以下步骤:在绝缘体层上形成通孔,然后用导电浆料填充所述通孔; 在导体箔的粘合表面上分散形成保护剂,以包括不存在保护剂的粘合表面区域; 将导体箔粘附到绝缘体层上; 并且通过加热和加压绝缘体层和导体箔,通过粘合表面区域将构成导电浆料和导体箔的多个导电粉末彼此邻接。
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公开(公告)号:US06518514B2
公开(公告)日:2003-02-11
申请号:US09928869
申请日:2001-08-13
申请人: Takeshi Suzuki , Tatsuo Ogawa , Yoshihiro Bessho , Satoru Tomekawa , Yasuhiro Nakatani , Yoji Ueda , Susumu Matsuoka , Daizo Andoh , Fumio Echigo
发明人: Takeshi Suzuki , Tatsuo Ogawa , Yoshihiro Bessho , Satoru Tomekawa , Yasuhiro Nakatani , Yoji Ueda , Susumu Matsuoka , Daizo Andoh , Fumio Echigo
IPC分类号: H01R1204
CPC分类号: H05K1/0373 , H05K1/036 , H05K3/20 , H05K3/202 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0195 , H05K2201/0209 , H05K2201/068 , H05K2203/1461 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917
摘要: A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.
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公开(公告)号:US06866892B2
公开(公告)日:2005-03-15
申请号:US10607306
申请日:2003-06-27
CPC分类号: H05K1/024 , H05K1/036 , H05K3/20 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2203/1461 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T29/49165 , Y10T428/24917 , Y10T428/31511
摘要: A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.
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公开(公告)号:US06713688B2
公开(公告)日:2004-03-30
申请号:US09986453
申请日:2001-11-08
申请人: Shinobu Kokufu , Takeshi Suzuki , Fumio Echigo , Daizo Andoh , Tatsuo Ogawa , Yoshihiro Kawakita , Satoru Tomekawa
发明人: Shinobu Kokufu , Takeshi Suzuki , Fumio Echigo , Daizo Andoh , Tatsuo Ogawa , Yoshihiro Kawakita , Satoru Tomekawa
IPC分类号: H05K1204
CPC分类号: H05K3/4069 , H05K3/282 , H05K3/389 , H05K3/4614 , H05K2201/0239 , H05K2201/0355 , H05K2203/1461 , Y10T29/49126 , Y10T29/49128 , Y10T29/49153 , Y10T29/49155 , Y10T29/49165 , Y10T29/49171 , Y10T428/24917
摘要: A protective agent 6 for protecting a wiring 1 is dispersed and placed in mottle-like on an interface between a via 3 and a wiring layer 2. Then, each dimension of interface regions 7 where the protective agent 6 does not exist is set to such a size that a plurality of conductive powders 4 constituting the via 3 can abutted on the wiring layer 2. Therefore, the plurality of conductive powders 4 and the wiring layer 2 are abutted each other in each interface region 7 where the protective agent 6 does not exist to electrically connect, thereby stabilizing the connection resistance for a prolonged period of time.
摘要翻译: 用于保护布线1的保护剂6在通孔3和布线层2之间的界面上分散并放置成斑驳状。然后,将不存在保护剂6的界面区域7的每个尺寸设定为 构成通孔3的多个导电粉末4可以与布线层2抵接的尺寸。因此,在保护剂6不是的各界面区域7中,多个导电粉末4和布线层2彼此抵接 存在电连接,从而稳定连接电阻长时间。
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公开(公告)号:US06596381B2
公开(公告)日:2003-07-22
申请号:US09962245
申请日:2001-09-26
IPC分类号: B32B300
CPC分类号: H05K1/024 , H05K1/036 , H05K3/20 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2203/1461 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T29/49165 , Y10T428/24917 , Y10T428/31511
摘要: A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.
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公开(公告)号:US20060283626A1
公开(公告)日:2006-12-21
申请号:US11511416
申请日:2006-08-29
IPC分类号: H05K1/03
CPC分类号: H05K1/024 , H05K1/036 , H05K3/20 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2203/1461 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T29/49165 , Y10T428/24917 , Y10T428/31511
摘要: A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.
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公开(公告)号:US07103971B2
公开(公告)日:2006-09-12
申请号:US11060314
申请日:2005-02-18
IPC分类号: H01K3/10
CPC分类号: H05K1/024 , H05K1/036 , H05K3/20 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2203/1461 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T29/49165 , Y10T428/24917 , Y10T428/31511
摘要: A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.
摘要翻译: 压缩功能层60设置在至少一个板表面上。 压缩功能层60通过将板厚度方向的压力接收到包括该层的树脂板10而增加被压缩的功能。 由此,向导体14施加足够的压力。
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