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    Multilayer circuit board and method of manufacturing the same
    3.
    发明授权
    Multilayer circuit board and method of manufacturing the same 失效
    多层电路板及其制造方法

    公开(公告)号：US06833511B2

    公开(公告)日：2004-12-21

    申请号：US09995085

    申请日：2001-11-27

    申请人： Yoshiyuki Uchinono ,  Kazuo Sawada ,  Yasufumi Masaki ,  Masahide Muto

    发明人： Yoshiyuki Uchinono ,  Kazuo Sawada ,  Yasufumi Masaki ,  Masahide Muto

    IPC分类号： H05K103

    CPC分类号： H05K1/183 ,  B29L2031/3493 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/027 ,  H05K3/403 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/09645 ,  Y10T29/49155

    摘要： A molded interconnect device (MID) having a multilayer circuit of a reduced thickness, in which a layer-to-layer connection(s) is formed with high reliability, is provided as a multilayer circuit board. The multilayer circuit board comprises a substrate having a first surface and a second surface extending from an end of the first surface at a required angle relative to the first surface, and the multilayer circuit formed on the first surface and composed of a plurality of circuit layers. Each of the circuit layers is provided with a conductive layer having a required circuit pattern and an insulation layer formed on the conductive layer by film formation. The layer-to-layer connection of the multilayer circuit is made through a second conductive layer formed on the second surface of the substrate.

    摘要翻译： 作为多层电路板，提供了具有厚度减小的多层电路的模制互连装置（MID），其中形成了具有高可靠性的层间连接。 多层电路板包括具有第一表面和第二表面的基板，第一表面和第二表面相对于第一表面以所需的角度从第一表面的端部延伸，并且多层电路形成在第一表面上并且由多个电路层 。 每个电路层设置有具有所需电路图案的导电层和通过成膜形成在导电层上的绝缘层。 通过形成在基板的第二表面上的第二导电层制成多层电路的层间连接。

    Connector-use contact and production method for component to be soldered
    7.
    发明申请
    Connector-use contact and production method for component to be soldered 有权
    用于要焊接的部件的连接器 - 使用接触和生产方法

    公开(公告)号：US20050103761A1

    公开(公告)日：2005-05-19

    申请号：US10505453

    申请日：2003-10-10

    申请人： Yasunori Miki ,  Hiroshi Yanagida ,  Shouichi Nagata ,  Shin Sato ,  Yoshiyuki Uchinono ,  Kenji Jonen ,  Masaharu Ishikawa ,  Hiroshi Iwano ,  Syunichi Nakayama

    发明人： Yasunori Miki ,  Hiroshi Yanagida ,  Shouichi Nagata ,  Shin Sato ,  Yoshiyuki Uchinono ,  Kenji Jonen ,  Masaharu Ishikawa ,  Hiroshi Iwano ,  Syunichi Nakayama

    IPC分类号： H01R4/02 ,  H01R12/55 ,  H01R13/03 ,  B23K26/36

    CPC分类号： H01R13/03 ,  H01R4/028

    摘要： In a contact for a connector, a metal material id processed to be bent in a predetermined shape in a manner so that a terminal portion is formed in the vicinity of an end and a contacting portion is formed in the vicinity of the other end. A nickel plating layer as a foundation plating layer and a gold plating layer are formed on substantially entire surface of the contact including the terminal portion and the contacting portion. Laser beams are irradiated at a portion between the terminal portion and the contacting portion, and especially in the vicinity of the terminal portion so that the nickel plating layer as the foundation plating layer is unsheathed by removing the gold plating layer or gold in the gold plating layer and nickel in the foundation layer are alloyed. Nickel and the alloy of nickel and gold respectively have low wetting property with respect to solder, so that diffusion of melted solder stops at the portion.

    摘要翻译： 在用于连接器的接触件中，在另一端附近形成加工成预定形状的金属材料id，使得在端部附近形成端子部分和接触部分。 在包括端子部分和接触部分的触点的基本整个表面上形成作为基底镀层的镀镍层和镀金层。 激光束在端子部分和接触部分之间的部分，特别是在端子部分附近被照射，使得作为基底镀层的镀镍层通过去除金镀层或镀金中的金而未被脱模 基层中的层和镍合金化。 镍和镍的合金分别相对于焊料具有低的润湿性，使得熔化的焊料的扩散停止在该部分处。

    METHOD FOR PRODUCING THREE-DIMENSIONAL SHAPED OBJECT
    8.
    发明申请
    METHOD FOR PRODUCING THREE-DIMENSIONAL SHAPED OBJECT 有权
    生产三维形状对象的方法

    公开(公告)号：US20140147328A1

    公开(公告)日：2014-05-29

    申请号：US14119224

    申请日：2012-05-22

    申请人： Satoshi Abe ,  Isamu Matsumoto ,  Masataka Takenami ,  Isao Fuwa ,  Yoshikazu Higashi ,  Yoshiyuki Uchinono ,  Norio Yoshida

    发明人： Satoshi Abe ,  Isamu Matsumoto ,  Masataka Takenami ,  Isao Fuwa ,  Yoshikazu Higashi ,  Yoshiyuki Uchinono ,  Norio Yoshida

    IPC分类号： B22F3/24 ,  B22F3/105

    CPC分类号： B22F3/24 ,  B22F3/1055 ,  B22F2003/247 ,  B29C64/153 ,  B29C67/0077 ,  B29L2031/085 ,  B33Y10/00 ,  Y02P10/295 ,  Y02P70/523

    摘要： A method for manufacturing a three-dimensional shaped object, comprising: (i) forming a powder layer on a base plate by a sliding movement of a squeegee blade, followed by forming a solidified layer by irradiating a predetermined portion of the powder layer with a light beam, thereby allowing sintering of the powder of the predetermined portion or melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, and then irradiating another predetermined portion of the new powder layer with the light beam, steps (i) and (ii) being repeatedly performed, wherein machining is performed at least once on an outer surface of a shaped object precursor obtained during manufacturing, and after machining, at least one solidified layer is formed, and followed by upper face machining to remove a raised solidified portion generated at a peripheral edge of the solidified layer.

    摘要翻译： 一种三维成形体的制造方法，包括：（i）通过刮板的滑动运动在基板上形成粉末层，然后通过用粉末层的规定部分照射形成固化层 光束，从而允许烧结预定部分的粉末或熔化并随后固化; 和（ii）通过在所得固化层上新形成粉末层形成另一固化层，然后用光束照射新粉末层的另一预定部分，重复执行步骤（i）和（ii），其中机械加工 在制造过程中获得的成形体前体的外表面上至少进行一次，在机械加工后形成至少一个固化层，然后进行上表面加工，除去在固化后的周边部分产生的升高的凝固部分 层。

    METHOD FOR MANUFACTURING THREE-DIMENSIONALLY SHAPED OBJECT AND THREE-DIMENSIONALLY SHAPED OBJECT
    9.
    发明申请
    METHOD FOR MANUFACTURING THREE-DIMENSIONALLY SHAPED OBJECT AND THREE-DIMENSIONALLY SHAPED OBJECT 有权
    制造三维形状对象和三维形状对象的方法

    公开(公告)号：US20130075575A1

    公开(公告)日：2013-03-28

    申请号：US13702210

    申请日：2011-06-09

    申请人： Satoshi Abe ,  Yoshiyuki Uchinono ,  Isao Fuwa ,  Norio Yoshida ,  Kazuho Morimoto

    发明人： Satoshi Abe ,  Yoshiyuki Uchinono ,  Isao Fuwa ,  Norio Yoshida ,  Kazuho Morimoto

    IPC分类号： B29C33/02

    CPC分类号： B29C33/02 ,  B22F3/1055 ,  B22F2003/1056 ,  B23P15/00 ,  B29C35/0272 ,  B29C35/0805 ,  B29C64/153 ,  B29C64/40 ,  B33Y10/00 ,  B33Y50/02 ,  Y02P10/295

    摘要： There is provided a method for manufacturing a three-dimensional shaped object, the method comprising the repeated steps of: (i) forming a solidified layer by irradiating a predetermined portion of a powder layer with a light beam, thereby allowing a sintering of the powder in the predetermined portion or a melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, followed by the irradiation of a predetermined portion of the powder layer with the light beam, wherein a heater element is disposed on the solidified layer during the repeated steps (i) and (ii), and thereby the heater element is situated within the three-dimensional shaped object.

    摘要翻译： 提供了一种制造三维成形物体的方法，该方法包括以下重复步骤：（i）通过用光束照射粉末层的预定部分来形成固化层，从而允许粉末的烧结 在预定部分或其熔融和随后的固化中; 和（ii）通过在所得到的固化层上新形成粉末层，然后用光束照射粉末层的预定部分，形成另一个固化层，其中在重复的过程中将加热元件设置在固化层上 步骤（i）和（ii），从而加热器元件位于三维成形物体内。

    Process of fabricating a three-dimensional object from a light curable liquid resin
    10.
    发明授权
    Process of fabricating a three-dimensional object from a light curable liquid resin 失效
    从光固化液体树脂制造三维物体的工艺

    公开(公告)号：US5503793A

    公开(公告)日：1996-04-02

    申请号：US300570

    申请日：1994-09-06

    申请人： Yoshiyuki Uchinono ,  Yoshikazu Higashi

    发明人： Yoshiyuki Uchinono ,  Yoshikazu Higashi

    IPC分类号： B29C35/08 ,  B29C41/12 ,  B29C67/00 ,  B29K105/24 ,  B29C41/02

    CPC分类号： B29C67/0062 ,  B29C41/12

    摘要： A three-dimensional object is fabricated from a light curable liquid resin by repeating the following process to superimpose a plurality of cured resin layers. The process utilizes a vessel containing a volume of the liquid resin and a vertically movable platform. In the process, the platform is immersed in the liquid resin in the vessel to dispose an overlay surface of an immediately previously cured layer sufficiently below the liquid level of the liquid resin. The platform is then raised such that the overlay surface is slightly higher than the liquid level of the liquid resin in the vessel, while keeping the liquid resin on the overlay surface connected with the surrounding liquid resin in the vessel by the effect of surface tension acting on the liquid resin. An excess amount of the liquid resin on the overlay surface is removed to form a liquid resin layer having a desired thickness. The platform is lowered such that an upper surface of the liquid resin layer is substantially in flush with the surrounding liquid level in the vessel, while keeping the desired thickness of the liquid resin layer. A light is then radiated to the liquid resin layer so as to cure it into the cured resin layer.

    摘要翻译： 通过重复以下处理来叠加多个固化树脂层，由光可固化液体树脂制造三维物体。 该方法利用容纳液体树脂的容器和可垂直移动的平台。 在该过程中，将平台浸入容器中的液体树脂中，以将刚刚预先固化的层的覆盖表面设置在液体树脂的液面以下。 然后将平台升高使得覆盖表面略高于容器中液体树脂的液面，同时通过表面张力作用将液体树脂保持在与周围液体树脂连接的覆盖表面上 在液体树脂上。 除去过量的覆盖表面上的液体树脂以形成具有所需厚度的液体树脂层。 降低平台，使得液体树脂层的上表面与容器中的周围液面基本齐平，同时保持液体树脂层的期望厚度。 然后将光照射到液态树脂层，使其固化成固化树脂层。