公开(公告)号：US20110233187A1

公开(公告)日：2011-09-29

申请号：US13153660

申请日：2011-06-06

申请人： Tatsuya KAWAJI ,  Yuichi SAKAI ,  Masatoshi KANEDA

发明人： Tatsuya KAWAJI ,  Yuichi SAKAI ,  Masatoshi KANEDA

IPC分类号： H05B3/68

CPC分类号： H01L21/67109 ,  H01L21/6838 ,  H01L21/6875

摘要： A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.

摘要翻译： 公开的用于加热其上涂覆有薄膜的基板的加热装置包括具有用于向处理室供应第一气体的气体供给开口的处理室和用于从处理室排出第一气体的排气开口; 加热板，其设置在所述处理室中并且包括用于加热所述基板的加热元件; 多个突起，布置在所述加热板上以支撑所述基板; 多个吸入孔，形成在加热板中，以便通过吸引衬底吸引加热板; 以及气体入口，其适于将第二气体供应到由所述多个突起支撑的所述加热板和所述基板之间的间隙。