摘要:
A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.
摘要:
A driving method in which, when a sustain discharge is caused only at each discharge cell set in on-mode by applying a sustain pulse to each row electrode pair of a plasma display panel, the electric field between row electrodes of each row electrode pair can be intensified by applying an auxiliary pulse to each column electrode of the plasma display panel together with the sustain pulse.
摘要:
In a health exercise assist system, a portable music playback apparatus acquires a preset exercise plan, a history of exercise information, and a music playback history and stores them. An information processing apparatus produces a service request including at least one of the preset exercise plan, the history of exercise information, and the music playback history acquired from the portable music playback apparatus, and transmits it to a service information providing apparatus. In accordance with the service request received from the information processing apparatus, the service information providing apparatus produces service information and returns the produced service information to the information processing apparatus. The information processing apparatus provides the received service information to a user of the audio playback apparatus.
摘要:
A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.
摘要:
A straightening plate provided in its central part with a gas exhaust opening is disposed under a face plate serving as a heating plate. A temperature-reducing purge ring is disposed between the face plate and the straightening plate. The temperature-reducing purge ring has an outside diameter substantially equal to that of the straightening plate and is provided in its inner circumference with plural gas jetting holes. The temperature-reducing purge ring is disposed close to the face plate such that a thin gap is formed between the temperature-reducing purge ring and the face plate. When a cooling gas is jetted radially inward through the gas jetting holes of the temperature-reducing purge ring, a vacuum is created between the lower surface of the face plate and the upper surface of the temperature-reducing purge ring. Consequently, a large amount of air is sucked into the space between the face plate and the straightening plate and flows together with the cooling gas, so that the face plate can be rapidly cooled.