公开(公告)号：US20150325925A1

公开(公告)日：2015-11-12

申请号：US14132729

申请日：2013-12-18

申请人： Telesphor Teles Kamgaing ,  ADEL ELSHERBINI ,  VALLURI RAO

发明人： Telesphor Teles Kamgaing ,  ADEL ELSHERBINI ,  VALLURI RAO

IPC分类号： H01Q21/00 ,  H01L21/52 ,  H01L23/66 ,  H01L23/498 ,  H01Q1/38 ,  H01L21/48

CPC分类号： H01L23/66 ,  H01L21/4853 ,  H01L21/52 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/19 ,  H01L24/20 ,  H01L2223/6622 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/18162 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q21/0006 ,  H01Q21/0093 ,  H01Q23/00

摘要： Embodiments of an embedded mm-wave radio integrated circuit into a substrate of a phased array module are disclosed. In some embodiments, the phased array module includes a first set of substrate layers made of a first material. The mm-wave radio integrated circuit may be embedded in the first set of substrate layers. A second set of substrate layers may be coupled to the first set of substrate layers. The second set of substrate layers may be made of a second material that has a lower electrical loss than the first material. The second set of substrate layers may include a plurality of antenna elements coupled through vias to the mm-wave radio integrated circuit.

摘要翻译： 公开了将嵌入式毫米波无线电集成电路放入相控阵列模块的衬底中的实施例。 在一些实施例中，相控阵列模块包括由第一材料制成的第一组衬底层。 毫米波无线电集成电路可以嵌入在第一组衬底层中。 第二组衬底层可以耦合到第一组衬底层。 第二组衬底层可以由具有比第一材料低的电损耗的第二材料制成。 第二组衬底层可以包括通过通孔耦合到毫米波无线电集成电路的多个天线元件。

公开(公告)号：US20150163921A1

公开(公告)日：2015-06-11

申请号：US14102676

申请日：2013-12-11

申请人： Sasha Oster ,  Robert L. Sankman ,  Charles Gealer ,  Omkar Karhade ,  John S. Guzek ,  Ravi V. Mahajan ,  James C. Matayabas, JR. ,  Johanna Swan ,  Feras Eid ,  Shawna Liff ,  Timothy McIntosh ,  Telesphor Teles Kamgaing ,  Adel Elsherbini ,  Kemal Aygun

发明人： Sasha Oster ,  Robert L. Sankman ,  Charles Gealer ,  Omkar Karhade ,  John S. Guzek ,  Ravi V. Mahajan ,  James C. Matayabas, JR. ,  Johanna Swan ,  Feras Eid ,  Shawna Liff ,  Timothy McIntosh ,  Telesphor Teles Kamgaing ,  Adel Elsherbini ,  Kemal Aygun

IPC分类号： H05K1/18 ,  G06F1/16 ,  H05K13/04

CPC分类号： H05K1/189 ,  G06F1/163 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/185 ,  H05K13/0469 ,  H05K2201/0137 ,  H05K2203/1469 ,  Y10T29/49146 ,  H01L2924/00

摘要： This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.

摘要翻译： 本公开一般涉及用于制造柔性微电子组件的装置，系统和方法。 在一个实例中，聚合物模制在微电子部件上，聚合物模具在模制之后呈现基本刚性的状态。 相对于微电子部件和聚合物模具形成布线层，布线层包括电耦合到微电子部件的迹线。 输入被施加到聚合物模具，聚合物模具在施加输入时从基本刚性状态转变到基本上柔性的状态。

公开(公告)号：US20150171523A1

公开(公告)日：2015-06-18

申请号：US14104296

申请日：2013-12-12

申请人： Telesphor Teles Kamgaing ,  Adel Elsherbini

发明人： Telesphor Teles Kamgaing ,  Adel Elsherbini

IPC分类号： H01Q21/00 ,  H01L23/00

CPC分类号： H01Q21/22 ,  G06K19/077 ,  H01L24/20 ,  H01L24/82 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15153 ,  H01L2924/15321 ,  H01Q21/0025 ,  H01Q21/0087 ,  H01Q21/0093 ,  H01Q21/065 ,  H01Q23/00

摘要： Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.

摘要翻译： 本文描述的实施例通常涉及相控阵天线系统或封装以及制造和使用系统和封装的技术。 相控阵天线封装可以包括分布式相控阵天线，其包括（1）多个天线子阵列，每个天线子阵列可以包括多个天线，（2）多个射频模块（RFD），每个RFD 位于通过多条迹线的迹线靠近并电耦合到多个天线子阵列中的对应天线子阵列，以及（3）其中多条迹线中的每条迹线被配置为电耦合多个天线子阵列中的天线 的天线连接到位于天线附近的RFD，其中多个迹线的每个迹线被配置为传输毫米波（mm-波）无线电信号，并且其中多个迹线各自具有基本均匀的长度。

公开(公告)号：US20180097268A1

公开(公告)日：2018-04-05

申请号：US15282050

申请日：2016-09-30

申请人： Sasha Oster ,  Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Teles Kamgaing ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

发明人： Sasha Oster ,  Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Teles Kamgaing ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC分类号： H01P3/16 ,  H01P11/00 ,  H05K7/14

CPC分类号： H01P3/122 ,  H01P3/14 ,  H01P3/16 ,  H01P11/006

摘要： A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.