公开(公告)号：US06333253B1

公开(公告)日：2001-12-25

申请号：US09696049

申请日：2000-10-26

申请人： Terri J. Brownfield ,  Raj N. Master

发明人： Terri J. Brownfield ,  Raj N. Master

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  B23K1/203 ,  B23K3/082 ,  H01L24/11 ,  H01L24/75 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30107 ,  H05K3/3436 ,  H05K3/3489

摘要： A method and apparatus are provided for selectively depositing flux on a plurality of flip-chip bumps arranged on a semiconductor by mounting a flux stamp on the semiconductor chip. The flux stamp has a plurality of flux holes arranged in a pattern substantially identically corresponding to the arrangement of the flip-chip bumps of the semiconductor chip. Different flux stamps are prepared for various kinds of semiconductor chips having different flip-chip bump arrangements. Flux is deposited though the flux holes of the flux stamp which selectively exposing the upper surfaces of the flip-chip bumps of the chip, thereby leaving no flux on the chip surface between the flip-chip bumps.

摘要翻译： 提供一种方法和装置，用于通过在半导体芯片上安装焊剂印模来选择性地在布置在半导体上的多个倒装凸块上沉积焊剂。 磁通印模具有以与半导体芯片的倒装芯片凸块的布置基本相同的形式布置的多个磁通孔。 为具有不同倒装芯片凸块布置的各种半导体芯片准备不同的磁通量戳。 焊剂通过焊剂压块的通孔沉积，其选择性地暴露芯片的倒装芯片凸块的上表面，从而在倒装芯片凸块之间的芯片表面上不留下焊剂。

公开(公告)号：US06597444B1

公开(公告)日：2003-07-22

申请号：US09627436

申请日：2000-07-28

申请人： Jonathan D. Halderman ,  Terri J. Brownfield

发明人： Jonathan D. Halderman ,  Terri J. Brownfield

IPC分类号： G01N2100

CPC分类号： G01N21/6456 ,  G01N21/35 ,  G01N21/8422 ,  G01N21/956 ,  G01N2021/646 ,  H05K1/0269 ,  H05K3/3489

摘要： A package assembly is formed by applying flux to a substrate and inspecting the applied flux to determine whether the amount applied is adequate to form reliable interconnections between a device and the substrate. Embodiments include applying a rosin based flux on a laminate substrate and inspecting the coverage of the applied flux by fluorescent spectroscopy.

摘要翻译： 通过将助焊剂施加到衬底并检查所施加的焊剂以确定所施加的量是否足以在器件和衬底之间形成可靠的互连来形成封装组件。 实施例包括在层压基板上施加松香基焊剂并通过荧光光谱法检查施加的焊剂的覆盖范围。

公开(公告)号：US06527164B1

公开(公告)日：2003-03-04

申请号：US09584128

申请日：2000-05-31

申请人： Terri J. Brownfield ,  Jonathan D. Halderman

发明人： Terri J. Brownfield ,  Jonathan D. Halderman

IPC分类号： B23K2800

CPC分类号： B23K1/206 ,  B23K1/008

摘要： A method of cleaning residue on surfaces in a reflow furnace includes introducing a solvent into the furnace chamber; reacting the solvent with the residue to form a product; and, removing the product from the furnace chamber. The solvent is gaseous, such as an etch gas. Also, the product of the reaction between the residue and the solvent can is gaseous. The gaseous product can then be exhausted from the reflow furnace. A reflow furnace for practicing the method is also disclosed.

摘要翻译： 在回流炉的表面上清洗残渣的方法包括将溶剂引入炉室; 使溶剂与残余物反应以形成产物; 并从炉室中取出产品。 溶剂是气态的，例如蚀刻气体。 此外，残留物和溶剂之间的反应的产物是气态的。 然后气体产物可以从回流炉中排出。 还公开了用于实施该方法的回流炉。

公开(公告)号：US06683387B1

公开(公告)日：2004-01-27

申请号：US09593816

申请日：2000-06-15

申请人： Terri J. Brownfield

发明人： Terri J. Brownfield

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/19041 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/0401

摘要： A carrier member is provided that has a plurality of landing pads thereon where at least one of the landing pads has a depression therein to hold at least one solder terminal of a device to be mounted thereto. Embodiments include a ceramic or a bismaleimide-triazine epoxy laminate carrier having an array of landing pads formed by depositing a eutectic solder, where each landing pad in the comer of the array has a depression therein.

摘要翻译： 提供一种载体构件，其上具有多个着陆垫，其中至少一个着陆垫具有凹陷以保持待安装的装置的至少一个焊接端子。 实施方案包括具有通过沉积共晶焊料形成的着陆焊盘阵列的陶瓷或双马来酰亚胺 - 三嗪环氧树脂层压载体，其中阵列的角落中的每个着陆垫具有凹陷。

公开(公告)号：US06399902B1

公开(公告)日：2002-06-04

申请号：US09630414

申请日：2000-08-01

申请人： Terri J. Brownfield ,  Jonathan D. Halderman

发明人： Terri J. Brownfield ,  Jonathan D. Halderman

IPC分类号： G01G1300

CPC分类号： H01L22/26 ,  B23K1/203 ,  B23K2101/40 ,  G01G19/00 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

摘要： This invention is directed to controlling the amount of flux dispensed onto the surface of an IC component. The component is continually weighed and data is fed back to a controller that controls the dispensing of flux onto the IC component. When the proper amount of flux is dispensed, the controller terminates the dispensing of the flux.

摘要翻译： 本发明涉及控制分配到IC部件表面上的通量的量。 该组件被连续称重并将数据反馈给控制器，该控制器控制向IC组件分配助焊剂。 当分配适量的助焊剂时，控制器终止焊剂的分配。