公开(公告)号：US20240270964A1

公开(公告)日：2024-08-15

申请号：US18490614

申请日：2023-10-19

申请人： The Penn State Research Foundation

发明人： Benjamin J. LEAR ,  Robert J. FORTENBAUGH ,  Kaitlin HAAS

IPC分类号： C08L83/04 ,  B29C64/124 ,  B29K83/00 ,  B33Y10/00 ,  B33Y70/00

CPC分类号： C08L83/04 ,  B29C64/124 ,  B33Y10/00 ,  B33Y70/00 ,  B29K2083/00 ,  C08L2203/30 ,  C08L2205/025

摘要： Thermosetting formulations useful for forming bulk structures such as in additive manufacturing can include (a) a compound including reactive functional groups, (b) a curing agent having functional groups reactive with the reactive functional groups of the compound, and (c) a photothermally active material. Such formulations can be cured by applying actinic radiation to the formulation.

公开(公告)号：US20200056043A1

公开(公告)日：2020-02-20

申请号：US16610249

申请日：2018-05-04

申请人： The Penn State Research Foundation

发明人： Benjamin J. LEAR ,  Robert J. FORTENBAUGH

IPC分类号： C08L83/04 ,  B33Y10/00 ,  B33Y70/00 ,  B29C64/124

摘要： Thermosetting formulations useful for forming bulk structures such as in additive manufacturing can include (a) a compound including reactive functional groups, (b) a curing agent having functional groups reactive with the reactive functional groups of the compound, and (c) a photothermally active material. Such formulations can be cured by applying actinic radiation to the formulation.