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公开(公告)号:US09418937B2
公开(公告)日:2016-08-16
申请号:US13315642
申请日:2011-12-09
申请人: Thomas Detzel , Johann Gross , Robert Illing , Maximilian Krug , Sven Gustav Lanzerstorfer , Michael Nelhiebel , Werner Robl , Michael Rogalli , Stefan Woehlert
发明人: Thomas Detzel , Johann Gross , Robert Illing , Maximilian Krug , Sven Gustav Lanzerstorfer , Michael Nelhiebel , Werner Robl , Michael Rogalli , Stefan Woehlert
IPC分类号: H01L23/52 , H01L23/532 , H01L21/288
CPC分类号: H01L23/3735 , H01L21/2885 , H01L21/4882 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要: An integrated circuit includes a base element and a copper element over the base element, the copper element having a thickness of at least 5 μm and a ratio of average grain size to thickness of less than 0.7.
摘要翻译: 集成电路包括在基底元件上的基底元件和铜元件,铜元素的厚度至少为5μm,平均晶粒尺寸与厚度之比小于0.7。
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公开(公告)号:US20130147047A1
公开(公告)日:2013-06-13
申请号:US13315642
申请日:2011-12-09
申请人: Thomas Detzel , Johann Gross , Robert Illing , Maximilian Krug , Sven Gustav Lanzerstorfer , Michael Nelhiebel , Werner Robl , Michael Rogalli , Stefan Woehlert
发明人: Thomas Detzel , Johann Gross , Robert Illing , Maximilian Krug , Sven Gustav Lanzerstorfer , Michael Nelhiebel , Werner Robl , Michael Rogalli , Stefan Woehlert
CPC分类号: H01L23/3735 , H01L21/2885 , H01L21/4882 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要: An integrated circuit includes a base element and a copper element over the base element, the copper element having a thickness of at least 5 μm and a ratio of average grain size to thickness of less than 0.7.
摘要翻译: 集成电路包括在基底元件上的基底元件和铜元件,铜元件具有至少5μm的厚度,并且平均晶粒尺寸与厚度之比小于0.7。
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