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公开(公告)号：US08348503B2
公开(公告)日：2013-01-08
申请号：US11764703
申请日：2007-06-18
IPC分类号： G01K3/00
CPC分类号： C23C14/562 , C23C14/042 , C23C14/541 , H01L51/0008 , H01L51/0023 , H01L51/529 , H01L51/56 , H01L2924/0002 , H01L2924/00
摘要： A system and method for providing an active array of temperature sensing and cooling elements, including an active heatsink which further includes an active temperature sensing layer, a thermoelectric cooling layer, and a heatsink, which further includes a plurality of cooling channels. The temperature sensing element within the active temperature sensing layer includes a plurality of switching transistors, a linear transistor, a current sense resistor, a thermistor, a voltage sensing bus, a voltage setting bus, a current measurement bus, a measurement switching bus, a sense control bus, a storage capacitor, and a supply voltage, all under the control of a process control computer. The method of using an active array of temperature sensing and cooling elements includes the steps of aligning the shadow mask, depositing the material, detecting a thermal gradient, and controlling the thermoelectric cooling.
摘要翻译： 一种用于提供温度感测和冷却元件的有源阵列的系统和方法，包括有源散热器，其还包括有源温度感测层，热电冷却层和散热器，其还包括多个冷却通道。 有源温度检测层内的温度检测元件包括多个开关晶体管，线性晶体管，电流检测电阻，热敏电阻，电压感测总线，电压设定总线，电流测量总线，测量开关总线， 感测控制总线，存储电容器和电源电压，全部由过程控制计算机控制。 使用温度感测和冷却元件的有源阵列的方法包括对准荫罩，沉积材料，检测热梯度和控制热电冷却的步骤。
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公开(公告)号：US07232694B2
公开(公告)日：2007-06-19
申请号：US10950646
申请日：2004-09-28
CPC分类号： C23C14/562 , C23C14/042 , C23C14/541 , H01L51/0008 , H01L51/0023 , H01L51/529 , H01L51/56 , H01L2924/0002 , H01L2924/00
摘要： A system and method for active array temperature sensing and cooling. The system includes an active temperature sensing layer, a thermoelectric cooling layer and a heatsink layer. The temperature sensing layer is formed of temperature sensing elements that sense the temperature gradient across an unevenly heated region of the active array substrate. The thermoelectric cooling layer controls the temperature gradient sensed by the temperature sensing layer. The heatsink layer includes a plurality of cooling channels for absorbing thermal energy from the unevenly heated region. The system is under the control of a process control computer.
摘要翻译： 一种用于有源阵列温度感测和冷却的系统和方法。 该系统包括有源温度感测层，热电冷却层和散热层。 温度感测层由感测有源阵列基板的不均匀加热区域温度梯度的温度感测元件形成。 热电冷却层控制由感温层感测的温度梯度。 散热层包括用于从不均匀加热的区域吸收热能的多个冷却通道。 该系统由过程控制计算机控制。
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3.发明授权System for and method of planarizing the contact region of a via by use of a continuous inline vacuum deposition 有权通过使用连续在线真空沉积来平坦化通孔的接触区域的系统和方法公开(公告)号：US07361585B2
公开(公告)日：2008-04-22
申请号：US11044140
申请日：2005-01-27
IPC分类号： H01L21/4763 , H01L21/36 , H01L21/20 , H01L21/336
CPC分类号： H01L21/768 , H01L21/6715 , H01L21/67173 , H01L21/67207 , H01L21/76802 , H05K1/0393 , H05K3/143 , H05K3/4076 , H05K3/467 , H05K2201/0179 , H05K2203/1545
摘要： A multi-layer electronic device can be formed to include an insulative substrate (212), a first vapor deposited conductor layer (312) on the insulative substrate (212), a first vapor deposited insulator layer (314) on the first conductor layer (312), the first insulator layer (314) having at least one via hole (316) therein, and a vapor deposited conductive filler (320) in the via hole (316) of the first insulator layer (314). Desirably, the conductive filler (320) is deposited in the via hole (316) of the first insulator layer (314) such that the surface of the conductive filler (320) opposite the first conductor layer (312) is substantially planar with the surface of the first insulator layer (314) opposite the first conductor layer (312).
摘要翻译： 多层电子器件可以形成为在绝缘基板（212）上包括绝缘基板（212），第一蒸镀导体层（312），第一导体层上的第一蒸镀绝缘体层（314） 312），其中具有至少一个通孔（316）的第一绝缘体层（314）和在第一绝缘体层（314）的通孔（316）中的气相沉积导电填料（320）。 期望地，导电填料（320）沉积在第一绝缘体层（314）的通孔（316）中，使得与第一导体层（312）相对的导电填料（320）的表面与表面 与第一导体层（312）相对的第一绝缘体层（314）。
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4.发明授权System for and method of forming via holes by use of selective plasma etching in a continuous inline shadow mask deposition process 有权在连续的在线荫罩沉积工艺中通过使用选择性等离子体蚀刻来形成通孔的系统和方法公开(公告)号：US07268431B2
公开(公告)日：2007-09-11
申请号：US11026365
申请日：2004-12-30
IPC分类号： H01L23/52
CPC分类号： C23C14/562 , C23C14/042 , C23C14/5826 , C23C14/5873 , H01L21/76802 , H01L21/76877 , Y10T29/41
摘要： In a shadow mask vapor deposition system, a first conductor is vapor deposited on a substrate and an insulator is vapor deposited on the first conductor. A second conductor is then vapor deposited on at least the insulator. The insulator layer is plasma etched either before or after the vapor deposition of the second conductor to define in the insulator layer a via hole through which at least a portion of the first conductor is exposed. An electrical connection is established between the first and second conductors by way of the via hole.
摘要翻译： 在荫罩气相沉积系统中，将第一导体气相沉积在衬底上，并且在第一导体上蒸镀绝缘体。 然后在至少绝缘体上气相沉积第二导体。 在第二导体的气相沉积之前或之后等离子体蚀刻绝缘体层，以在绝缘体层中限定通孔，第一导体的至少一部分通过该通孔露出。 通过通孔在第一和第二导体之间建立电连接。
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公开(公告)号：US07132361B2
公开(公告)日：2006-11-07
申请号：US11020907
申请日：2004-12-23
IPC分类号： H01L21/4763
CPC分类号： H01L21/76802 , H01L21/67173 , H01L21/67207 , H05K1/0393 , H05K3/143 , H05K3/4076 , H05K3/467 , H05K2203/1545 , Y10S438/944 , Y10S438/945
摘要： Via holes are formed in a continuous inline shadow mask production system by depositing a first conductor layer and subsequently depositing a first insulator layer over a portion of the first conductor layer. The first insulator layer is deposited in a manner to define at least one notch along its edge. The second insulator layer is then deposited on another portion of the first conductor layer in a manner whereupon the second insulator layer slightly overlaps each notch of the first insulator layer, thereby forming the one or more via holes. A conductive filler can optionally be deposited in each via hole. Lastly, a second conductive layer can be deposited over the first insulator layer, the second insulator layer and, if provided, the conductive filler.
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6.发明申请System For And Method Of Planarizing The Contact Region Of A Via By Use Of A Continuous Inline Vacuum Deposition Process 审中-公开通过使用连续在线真空沉积工艺平面化通孔的接触区域的系统和方法公开(公告)号：US20080190659A1
公开(公告)日：2008-08-14
申请号：US12103903
申请日：2008-04-16
IPC分类号： H05K1/00
CPC分类号： H05K3/467 , H01L21/6715 , H01L21/67173 , H01L21/67207 , H05K1/0393 , H05K3/143 , H05K3/4076 , H05K2201/0179 , H05K2203/1545
摘要： A multi-layer electronic device can be formed to include an insulative substrate (212), a first vapor deposited conductor layer (312) on the insulative substrate (212), a first vapor deposited insulator layer (314) on the first conductor layer (312), the first insulator layer (314) having at least one via hole (316) therein, and a vapor deposited conductive filler (320) in the via hole (316) of the first insulator layer (314). Desirably, the conductive filler (320) is deposited in the via hole (316) of the first insulator layer (314) such that the surface of the conductive filler (320) opposite the first conductor layer (312) is substantially planar with the surface of the first insulator layer (314) opposite the first conductor layer (312).
摘要翻译： 多层电子器件可以形成为在绝缘基板（212）上包括绝缘基板（212），第一蒸镀导体层（312），第一导体层上的第一蒸镀绝缘体层（314） 312），其中具有至少一个通孔（316）的第一绝缘体层（314）和在第一绝缘体层（314）的通孔（316）中的气相沉积导电填料（320）。 期望地，导电填料（320）沉积在第一绝缘体层（314）的通孔（316）中，使得与第一导体层（312）相对的导电填料（320）的表面与表面 与第一导体层（312）相对的第一绝缘体层（314）。
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公开(公告)号：US20090151630A1
公开(公告)日：2009-06-18
申请号：US12299531
申请日：2006-11-01
CPC分类号： C23C14/042 , H05K3/1225 , H05K2201/068 , H05K2203/0169 , H05K2203/1105
摘要： In a method of preparing and using an aperture mask, a temperature of an aperture mask is increased to a first, mounting temperature (T1), whereupon the size of the aperture mask increases according to its coefficient of thermal expansion (CTEam), until at least one dimension thereof is of a first desired extent. The temperature of a frame is also increased to T1, whereupon the size of the frame grows according to its coefficient of thermal expansion (CTEf), which is lower than CTEam. The aperture mask is fixedly mounted to the frame at T1. The frame mounted aperture mask is then used for depositing a material on a substrate at a deposition temperature T2 that is less than T1, whereupon the frame holds the shadow mask in tension with the one dimension at a second desired extent.
摘要翻译： 在制备和使用孔径掩模的方法中，孔径掩模的温度增加到第一安装温度（T1），于是孔径掩模的尺寸根据其热膨胀系数（CTEam）而增加，直到在 其至少一个维度具有第一期望的程度。 框架的温度也增加到T1，因此，框架的尺寸根据其低于CTEam的热膨胀系数（CTEf）而增长。 光圈掩模在T1固定安装到框架上。 然后将框架安装的孔径掩模用于在小于T1的沉积温度T2下将材料沉积在基板上，于是该框架以相反的尺寸在一个维度上保持荫罩的张力。
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8.发明授权Apparatus for precision alignment of plates used in two-sided contact printing 失效用于双面接触印刷中使用的板的精确对准的装置
公开(公告)号：US5323209A
公开(公告)日：1994-06-21
申请号：US54279
申请日：1993-04-30
申请人： Fusao Ishii , Joseph A. Marcanio , David S. Reuss
发明人： Fusao Ishii , Joseph A. Marcanio , David S. Reuss
CPC分类号： G03F7/2032 , H05K3/0082
摘要： An alignment system for aligning the print plates of a two-sided contact printing station includes expanding pin assemblies each having an expanding collet and a mandrel for engaging and aligning match drilled holes in each of the print plates. An expansion cylinder moves the mandrel into and out of engagement with the expanding collet to cause the collet to expand into engagement with the match drilled holes. The outside profile of the expanding collet forms a straight-pin diameter which corresponds to the diameter of the match drilled holes when expanded. The expanding pin assemblies may be contracted to facilitate moving the print plates apart for advancing the working material.
摘要翻译： 用于对准双面接触印刷站的印刷板的对准系统包括扩展销组件，每个扩展销组件具有扩展夹头和用于接合和对准每个印刷板中的钻孔的心轴。 膨胀缸将心轴移动到与膨胀的夹头啮合并脱离啮合，以使夹头膨胀成与匹配的钻孔接合。 膨胀的夹头的外部轮廓形成对应于扩展时的匹配钻孔的直径的直销直径。 膨胀的销组件可以收缩以便于将印刷板分开以推进工作材料。
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公开(公告)号：US06554438B2
公开(公告)日：2003-04-29
申请号：US09892955
申请日：2001-06-27
申请人： Fusao Ishii , Joseph A. Marcanio
发明人： Fusao Ishii , Joseph A. Marcanio
IPC分类号： G02B7182
CPC分类号： G02B5/0858
摘要： A video projection device includes a cabinet having front and rear sections and a projection tube for projecting a video image. The video projection device also includes a screen located in the front section of the cabinet. The screen has a first surface onto which the video image is projected and a second surface for displaying the video image so that it is observable by a viewer. A mirror is arranged in the cabinet for reflecting light to the first surface of the screen. The mirror is a composite laminate mirror that includes a rigid substrate and a reflective sheet laminated to the rigid substrate. The rigid substrate may be a glass substrate and the reflective sheet may be a flexible plastic sheet. The reflective sheet may have a multilayer construction that includes a metallic film. The reflective sheet may alternatively include a second substrate and at least one thin film layer deposited on the substrate.
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10.发明授权
公开(公告)号：US6072900A
公开(公告)日：2000-06-06
申请号：US196397
申请日：1998-11-19
CPC分类号： G06T7/0006 , G06T2207/10012 , G06T2207/30121
摘要： Apparatus for detecting etch defects in an object having a plurality of openings by generating an image signal of the object representing light intensity values of a plurality of pixels, processing the image signal to form data signals representing light intensity values of groups of pixels, filtering the data signals to remove signals representing the ends of the openings, and pairing two data signals when the groups of pixels represented thereby represent an etch defect.
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