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公开(公告)号：US20130112468A1
公开(公告)日：2013-05-09
申请号：US13553414
申请日：2012-07-19
IPC分类号： H05K1/11
CPC分类号： H01R13/646 , H01R13/514 , H01R13/6471 , H01R13/6587 , H01R23/688 , H05K1/0231 , H05K1/0237 , H05K1/115 , H05K1/116 , H05K1/14 , H05K3/429 , H05K7/1445 , H05K2201/044 , H05K2201/09236 , H05K2201/09718 , H05K2201/10189 , H05K2203/1572
摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.
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2.发明申请MIDPLANE ESPECIALLY APPLICABLE TO AN ORTHOGONAL ARCHITECTURE ELECTRONIC SYSTEM 有权MIDPLANE特别适用于正交建筑电子系统公开(公告)号：US20090061684A1
公开(公告)日：2009-03-05
申请号：US12203270
申请日：2008-09-03
IPC分类号： H01R24/00 , H01R13/648
CPC分类号： H05K7/1445 , H01R13/514 , H01R13/6587 , H01R13/6591 , H05K1/0231 , H05K1/0237 , H05K1/116 , H05K1/14 , H05K3/429 , H05K2201/044 , H05K2201/09236 , H05K2201/09718 , H05K2201/10189 , H05K2203/1572
摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.
摘要翻译： 中平面具有连接第一差分连接器的接触端的第一侧和与第二差分连接器的接触端连接的第一侧相对的第二侧。 中平面包括从第一侧延伸到第二侧的多个通孔，其中通孔在第一侧上提供第一信号发射，而第二信号在第二侧上发射。 第一信号发射被设置成多行，每行具有沿着第一线的第一信号发射，并且第一信号沿着基本上平行于第一线的第二线发射。 第二信号发射被提供在多列中，每列具有沿着第三线的第二信号发射，而第二信号沿着基本上平行于第三线的第四线发射。
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公开(公告)号：US20140004724A1
公开(公告)日：2014-01-02
申请号：US13930531
申请日：2013-06-28
申请人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号： H01R12/70
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌件成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。
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公开(公告)号：US20140273557A1
公开(公告)日：2014-09-18
申请号：US14209240
申请日：2014-03-13
申请人： Marc B. Cartier, JR. , Mark W. Gailus , Thomas S. Cohen , John Robert Dunham , Vysakh Sivarajan
发明人： Marc B. Cartier, JR. , Mark W. Gailus , Thomas S. Cohen , John Robert Dunham , Vysakh Sivarajan
IPC分类号： H01R13/646 , H01R43/16 , H01R12/70
CPC分类号： H01R13/6476 , H01R12/585 , H01R12/724 , H01R12/737 , H01R13/514 , H01R43/16 , H01R43/24 , Y10T29/49208
摘要： An electrical connector designed for high speed signals. The connector includes one or more features that, when used alone or in combination, extend performance to higher speeds. These features may include compensation for tie bars that are used to hold conductive members in place for molding a housing around the conductive members. Removal of the tie bars during manufacture of the connector may leave artifacts in the conductive members and/or housing, which may be addressed by the features. The conductive members, for example, may include regions, adjacent tie bar locations, that compensate for portions of the tie bar that are not fully removed. Alternatively or additionally, a housing may include openings around tie bar locations such that a punch may be used to sever the tie bars. These openings may be filled to avoid performance-affecting artifacts.
摘要翻译： 一个专为高速信号设计的电连接器。 连接器包括一个或多个特征，当单独使用或组合使用时，将性能扩展到更高的速度。 这些特征可以包括对用于将导电构件保持在适当位置以用于模制围绕导电构件的壳体的拉杆的补偿。 在制造连接器期间去除连接杆可能会在导电构件和/或外壳中留下瑕疵，这可以通过特征来解决。 例如，导电构件可以包括补偿未完全移除的连杆的部分的相邻连接杆位置的区域。 或者或另外，壳体可以包括围绕连杆位置的开口，使得可以使用冲头来切断连杆。 这些开口可以被填充以避免影响性能的假象。
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公开(公告)号：US20140004746A1
公开(公告)日：2014-01-02
申请号：US13930351
申请日：2013-06-28
申请人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号： H01R12/71
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。
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公开(公告)号：US20140004726A1
公开(公告)日：2014-01-02
申请号：US13930447
申请日：2013-06-28
申请人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。
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公开(公告)号：US20140273663A1
公开(公告)日：2014-09-18
申请号：US14209142
申请日：2014-03-13
申请人： Marc B. Cartier, JR. , Mark W. Gailus , Thomas S. Cohen , John Robert Dunham , Vysakh Sivarajan
发明人： Marc B. Cartier, JR. , Mark W. Gailus , Thomas S. Cohen , John Robert Dunham , Vysakh Sivarajan
IPC分类号： H01R13/646 , H01R43/16
CPC分类号： H01R13/6474 , H01R13/405 , H01R13/6587 , H01R43/16 , H01R43/24 , Y10T29/49204
摘要： An electrical connector designed for high speed signals. The connector includes one or more features that, when used alone or in combination, extend performance to higher speeds. These features may include compensation for tie bars that are used to hold conductive members in place for molding a housing around the conductive members. Removal of the tie bars during manufacture of the connector may leave artifacts in the conductive members and/or housing, which may degrade electrical performance. However, that degradation may be avoided by features that compensate for the artifacts. The conductive members, for example, may include regions, adjacent tie bar locations, that compensate for portions of the tie bar that are not fully removed.
摘要翻译： 一个专为高速信号设计的电连接器。 连接器包括一个或多个特征，当单独使用或组合使用时，将性能扩展到更高的速度。 这些特征可以包括对用于将导电构件保持在适当位置以用于模制围绕导电构件的壳体的拉杆的补偿。 在制造连接器期间去除连接杆可能会在导电构件和/或壳体中留下瑕疵，这可能降低电气性能。 然而，可以通过补偿伪影的特征来避免该退化。 例如，导电构件可以包括补偿未完全移除的连杆的部分的相邻连接杆位置的区域。
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公开(公告)号：US20120214344A1
公开(公告)日：2012-08-23
申请号：US13354783
申请日：2012-01-20
IPC分类号： H01R13/648 , H01R24/00
CPC分类号： H01R13/04 , H01R13/6461 , H01R13/6473 , H01R13/6587
摘要： A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the first and second sets of conductors and the blades are jogged in both an x- and y-coordinate to reduce crosstalk and improve electrical performance.
摘要翻译： 宽侧耦合连接器组件具有两组导体，每个独立的平面。 通过提供相同的路径长度，差分对的导体之间不存在偏斜，并且那些导体的阻抗相同。 导体组是通过将第一组导体嵌入绝缘壳体而形成的，绝缘壳体具有带通道的顶表面。 第二组导体放置在通道内，使得两组导体之间不会形成气隙。 第二绝缘壳体填充在第二组导体上并进入通道以形成完整的晶片。 第一组和第二组导体和叶片的端部在x和y坐标上均匀点动以减少串扰并提高电气性能。
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9.发明申请MIDPLANE ESPECIALLY APPLICABLE TO AN ORTHOGONAL ARCHITECTURE ELECTRONIC SYSTEM 有权MIDPLANE特别适用于正交建筑电子系统公开(公告)号：US20110076860A1
公开(公告)日：2011-03-31
申请号：US12789621
申请日：2010-05-28
CPC分类号： H05K7/1445 , H01R13/514 , H01R13/6587 , H01R13/6591 , H05K1/0231 , H05K1/0237 , H05K1/116 , H05K1/14 , H05K3/429 , H05K2201/044 , H05K2201/09236 , H05K2201/09718 , H05K2201/10189 , H05K2203/1572
摘要： A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.
摘要翻译： 中平面具有连接第一差分连接器的接触端的第一侧和与第二差分连接器的接触端连接的第一侧相对的第二侧。 中平面包括从第一侧延伸到第二侧的多个通孔，其中通孔在第一侧上提供第一信号发射，而第二信号在第二侧上发射。 第一信号发射被设置成多行，每行具有沿着第一线的第一信号发射，并且第一信号沿着基本上平行于第一线的第二线发射。 第二信号发射被提供在多列中，每列具有沿着第三线的第二信号发射，而第二信号沿着基本上平行于第三线的第四线发射。
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公开(公告)号：US20140273627A1
公开(公告)日：2014-09-18
申请号：US14209079
申请日：2014-03-13
IPC分类号： H01R13/502 , H01R13/658
CPC分类号： H01R13/658 , H01R12/724 , H01R13/514 , H01R13/6476 , H01R43/16 , H01R43/24
摘要： An improved electrical connector is provided by compensating for skew in signal conductors of a differential pair while ensuring a uniform impedance along the differential pair. Skew is equalized by regions of lower dielectric constant preferentially positioned adjacent the longer conductor of each pair. Impedance along the length of the signal conductor is equalized by a compensation portion in the first conductor that offsets for a change in impedance associated with the change in dielectric constant adjacent the longer conductor. The compensation portion may be a widening in the first conductive element relative to a nominal width of the conductive element. The skew compensation portion may be along a longer edge of the longer conductor and the impedance compensation portion may be along the shorter edge of the longer conductor.
摘要翻译： 通过补偿差分对的信号导体中的偏斜而提供改进的电连接器，同时确保沿着差分对的均匀阻抗。 偏移量通过优先位于每对较长导体附近的较低介电常数的区域来均衡。 沿着信号导体的长度的阻抗由第一导体中的补偿部分相等，抵消与较长导体相邻的介电常数变化相关的阻抗变化。 补偿部分可以相对于导电元件的标称宽度在第一导电元件中变宽。 偏斜补偿部分可以沿着较长导体的较长边缘，并且阻抗补偿部分可以沿着较长导体的较短边缘。
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