公开(公告)号：US20090322845A1

公开(公告)日：2009-12-31

申请号：US12145677

申请日：2008-06-25

申请人： Timothy D. Stowe ,  Chu-heng Liu ,  Jeng Ping Lu ,  Eugene Chow ,  Gregory B. Anderson ,  Armin Volkel ,  Eric Peeters

发明人： Timothy D. Stowe ,  Chu-heng Liu ,  Jeng Ping Lu ,  Eugene Chow ,  Gregory B. Anderson ,  Armin Volkel ,  Eric Peeters

IPC分类号： B41J2/41

CPC分类号： B41J2/41 ,  G03G15/32

摘要： An addressable imaging belt for use in printing applications having embedded anisotropically conductive addressable islands configured for electric contact on a first side of the belt by a write head consisting of an array of compliant cantilevered fingers with contact pads/points to which a voltage can be applied. The conductive addressable islands electrically isolated from one another and extending substantially through the thickness of the belt in order to allow charge to flow through the belt towards a second side of the belt, in order to form a latent electrostatic image on the second side and develop this latent image by attracting colorized toner or other electrically charged particles to the second side.

摘要翻译： 一种用于印刷应用的可寻址成像带，其具有嵌入的各向异性导电可寻址岛，其配置用于通过由柔性悬臂指状物阵列组成的写头组成，用于在带的第一侧上进行电接触，所述写头具有可被施加电压的接触焊盘/点 。 导电寻址岛彼此电隔离并且基本上延伸穿过带的厚度，以便允许电荷通过带流向带的第二侧，以在第二面上形成静电潜像并显影 该潜像通过将着色调色剂或其它带电粒子吸引到第二侧。

公开(公告)号：US07995081B2

公开(公告)日：2011-08-09

申请号：US12145677

申请日：2008-06-25

申请人： Timothy D. Stowe ,  Chu-heng Liu ,  Jeng Ping Lu ,  Eugene Chow ,  Gregory B. Anderson ,  Armin Völkel ,  Eric Peeters

发明人： Timothy D. Stowe ,  Chu-heng Liu ,  Jeng Ping Lu ,  Eugene Chow ,  Gregory B. Anderson ,  Armin Völkel ,  Eric Peeters

IPC分类号： B41J2/41

CPC分类号： B41J2/41 ,  G03G15/32

摘要： An addressable imaging belt for use in printing applications having embedded anisotropically conductive addressable islands configured for electric contact on a first side of the belt by a write head consisting of an array of compliant cantilevered fingers with contact pads/points to which a voltage can be applied. The conductive addressable islands electrically isolated from one another and extending substantially through the thickness of the belt in order to allow charge to flow through the belt towards a second side of the belt, in order to form a latent electrostatic image on the second side and develop this latent image by attracting colorized toner or other electrically charged particles to the second side.

摘要翻译： 一种用于印刷应用的可寻址成像带，其具有嵌入的各向异性导电可寻址岛，其配置用于通过由柔性悬臂指状物阵列组成的写头组成，用于在带的第一侧上进行电接触，所述写头具有可被施加电压的接触焊盘/点 。 导电寻址岛彼此电隔离并且基本上延伸穿过带的厚度，以便允许电荷通过带流向带的第二侧，以在第二面上形成静电潜像并显影 该潜像通过将着色调色剂或其它带电粒子吸引到第二侧。

公开(公告)号：US20080089705A1

公开(公告)日：2008-04-17

申请号：US11959030

申请日：2007-12-18

申请人： Jeng Ping Lu ,  Eugene Chow

发明人： Jeng Ping Lu ,  Eugene Chow

IPC分类号： H05K3/32 ,  G03G15/00

CPC分类号： H01L25/50 ,  H01L21/67271 ,  H01L21/67282 ,  H01L21/67294 ,  H01L24/95 ,  H01L2224/95085 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53004 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53278 ,  H01L2924/00

摘要： Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a sorting unit so that they have defined positions and orientations. The sorting unit has the capability of electrostatically and magnetically manipulating the micro-objects based on their select charge encoding. The sorted micro-objects are provided to an image transfer unit. The image transfer unit is adapted to receive the sorted micro-objects, maintain them in their sorted order and orientation, and deliver them to a substrate. Maintaining the sorted order as the micro-objects are delivered to the substrate may be accomplished through the use of an electrostatic image, as is done in xerography. The substrate with the micro-objects is further processed to interconnect the micro-objects—through electrical wiring, for example—to form the final micro-assembly.

摘要翻译： 公开了静电印刷微组装系统和方法。 系统和方法涉及操纵电荷编码的微物体。 电荷编码识别每个微物体并指定其排列方向。 微物体在分类单元中排序，使得它们具有定义的位置和取向。 分选单元具有基于其选择电荷编码的静电和磁性操纵微物体的能力。 分类的微物体被提供给图像传送单元。 图像传送单元适于接收分类的微物体，将它们保持在排列顺序和方位，并将其传送到基底。 将排序的顺序作为微物体传送到基底可以通过使用静电图像来实现，如在静电复印中所做的那样。 具有微物体的衬底被进一步处理以使例如微通孔电线互连，以形成最终的微组件。

公开(公告)号：US20110185925A1

公开(公告)日：2011-08-04

申请号：US12697109

申请日：2010-01-29

申请人： Eugene Chow ,  Jeng Ping Lu

发明人： Eugene Chow ,  Jeng Ping Lu

IPC分类号： B41M1/10

CPC分类号： B41M1/10

摘要： A printing sub-system including same including a pixilated photoconductive member (such as a photobelt) is disclosed. Electrically isolated cells hold surface application material above the photoconductor. The surface application material is first charged. Charge on the surface application material in an individual cell may then be discharged by exposure of a region of the photoconductor proximate that cell to light from an optical addressing system. The surface application material is brought into proximity of an image receiving member such as paper, which is either charged or proximate a charge source. Charged surface application material in a cell may then be electrostatically transferred from the cell onto the image receiving member, while discharged surface application material remains in the cell. The subsystem may form a part of a complete printing system using many existing components. Among other advantages, viscous liquid surface application material may thereby be printed.

摘要翻译： 公开了包括像素化感光体（例如光带）的包括其的印刷子系统。 电隔离的电池在光电导体上方保持表面应用材料。 首先对表面施用材料进行充电。 然后可以通过将靠近该单元的光电导体的区域暴露于来自光寻址系统的光来对单个单元中的表面施加材料上的电荷进行放电。 表面施加材料被带入诸如纸的图像接收构件，其被充电或靠近电荷源。 然后可以将电池中的充电表面施用材料静电从细胞转移到图像接收部件上，同时放电的表面施用材料保留在电池中。 子系统可以使用许多现有组件形成完整打印系统的一部分。 除了其它优点之外，可以印刷粘性液体表面施加材料。

公开(公告)号：US20060009051A1

公开(公告)日：2006-01-12

申请号：US11226186

申请日：2005-09-13

申请人： Koenraad Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

发明人： Koenraad Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

IPC分类号： H01R12/00

CPC分类号： H01R12/78 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/044 ,  H05K2201/09845

摘要： A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

公开(公告)号：US20050136703A1

公开(公告)日：2005-06-23

申请号：US10742501

申请日：2003-12-19

申请人： Koenraad Van Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

发明人： Koenraad Van Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

IPC分类号： H05K1/14 ,  H01B11/00 ,  H01R12/00 ,  H01R12/04 ,  H05K3/32 ,  H05K3/36

CPC分类号： H01R12/78 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/044 ,  H05K2201/09845

摘要： A data transmission interconnect assembly (e.g., a router) capable of transmission speeds in excess of 40 Gbps in which a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring contact structures are formed on the cables, or on a contact structure pressed against the cables, to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press a contact structure, having micro spring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

公开(公告)号：US20070158816A1

公开(公告)日：2007-07-12

申请号：US11331656

申请日：2006-01-12

申请人： Eugene Chow ,  Christopher Chua ,  Eric Peeters

发明人： Eugene Chow ,  Christopher Chua ,  Eric Peeters

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/11 ,  G01R1/06727 ,  G01R1/06761 ,  G01R3/00 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/742 ,  H01L24/81 ,  H01L2221/68368 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01082 ,  H01L2924/14

摘要： A contact spring applicator is provided which includes an applicator substrate, a removable encapsulating layer and a plurality of contact springs embedded in the removable encapsulating layer. The contact springs are positioned such that a bond pad on each contact spring is adjacent to an upper surface of the removable encapsulating layer. The contact spring applicator may also include an applicator substrate, a release layer, a plurality of unreleased contact springs on the release layer and a bond pad at an anchor end of each contact spring. The contact spring applicators apply contact springs to an integrated circuit chip, die or package or to a probe card by aligning the bond pads with bond pad landings on the receiving device. The bond pads are adhered to the bond pad landings. The encapsulating or release layer is then removed to separate the contact springs from the contact spring applicator substrate.

摘要翻译： 提供接触弹簧施加器，其包括施加器基板，可移除的封装层和嵌入在可移除封装层中的多个接触弹簧。 接触弹簧被定位成使得每个接触弹簧上的接合焊盘与可移除的封装层的上表面相邻。 接触弹簧施加器还可以包括施加器基板，释放层，释放层上的多个未释放的接触弹簧和每个接触弹簧的锚固端处的接合垫。 接触弹簧施加器通过将接合垫与接收装置上的接合垫平台对准，将接触弹簧施加到集成电路芯片，管芯或封装或探针卡。 接合焊盘粘附到接合焊盘平台上。 然后去除包封或释放层以将接触弹簧与接触弹簧施加器基板分离。

公开(公告)号：US20110167526A1

公开(公告)日：2011-07-07

申请号：US13045042

申请日：2011-03-10

申请人： Eugene Chow ,  Pengfei Qi

发明人： Eugene Chow ,  Pengfei Qi

IPC分类号： G01Q70/08 ,  B82Y30/00

CPC分类号： B81C1/0015 ,  B81B2203/019 ,  B81B2207/07 ,  B82Y10/00

摘要： A stress-engineered microspring is formed generally in the plane of a substrate. A nanowire (or equivalently, a nanotube) is formed at the tip thereof, also in the plane of the substrate. Once formed, the length of the nanowire may be defined, for example photolithographically. A sacrificial layer underlying the microspring may then be removed, allowing the engineered stresses in the microspring to cause the structure to bend out of plane, elevating the nanowire off the substrate and out of plane. Use of the nanowire as a contact is thereby provided. The nanowire may be clamped at the tip of the microspring for added robustness. The nanowire may be coated during the formation process to provide additional functionality of the final device.

摘要翻译： 应力工程微球通常在基底的平面上形成。 纳米线（或等效地，纳米管）也在其顶端形成在基板的平面中。 一旦形成，可以例如光刻地限定纳米线的长度。 然后可以去除位于微弹簧下面的牺牲层，允许微弹簧中的工程应力使结构弯曲出平面，从而使纳米线离开基底并离开平面。 由此提供了使用纳米线作为接触。 可以将纳米线夹在微弹簧的末端以增加坚固性。 在形成过程中可以涂覆纳米线以提供最终装置的附加功能。

公开(公告)号：US20070125486A1

公开(公告)日：2007-06-07

申请号：US11292474

申请日：2005-12-02

申请人： Thomas Hantschel ,  Eugene Chow

发明人： Thomas Hantschel ,  Eugene Chow

IPC分类号： B32B37/00

CPC分类号： B81B3/001 ,  B81B2207/07 ,  B81C1/00666 ,  B81C1/00952 ,  G01R1/06722 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H05K3/4092

摘要： A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited, either as a single layer or as a composite of multiple sub layers, to have a tailored stress differential along its cross-section. A lower microspring may be made to push up against an upper microspring to provide increased contact force, or push down against a substrate to ensure release during manufacture. The microsprings may be provided with similar stress differentials or opposite stress differentials to obtain desired microspring profiles and functionality. Microsprings may also be physically connected at their distal ends for increased contact force. The microsprings may be formed of electrically conductive material or coated with electrically conductive material for probe card and similar applications.

摘要翻译： 提供多个垂直间隔开的微弹簧以增加微弹簧接触力，接触面积，接触可靠性和接触屈服。 微珠材料作为单层或作为多个子层的复合材料沉积，沿其横截面具有定制的应力差。 可以制备较低的微弹簧以向上推动上部微型弹性体以提供增加的接触力，或者向下推动抵靠基底以确保制造过程中的释放。 可以提供类似的应力差异或相反的应力差异以获得所需的微弹体轮廓和功能性。 微弹簧也可以在其远端物理连接以增加接触力。 微弹簧可以由导电材料形成或涂覆有用于探针卡和类似应用的导电材料。

公开(公告)号：US20070069751A1

公开(公告)日：2007-03-29

申请号：US11549066

申请日：2006-10-12

申请人： Thomas Hantschel ,  Eugene Chow

发明人： Thomas Hantschel ,  Eugene Chow

IPC分类号： G01R31/02

CPC分类号： H01G5/18 ,  G01R1/06738

摘要： A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.

摘要翻译： 弯曲弹簧结构包括平行于基板表面延伸的基部部分，弯曲的远离基板表面的弯曲悬臂部分，以及从基部沿着悬臂部分下方的基板表面延伸的细长部分。 弹簧结构包括由图案化和释放的自弯曲材料膜（例如，应力工程金属，双晶型/双金属）形成的弹簧指状物。 然后将包覆层电镀和/或无电镀在弹簧手指上用于强度。 细长部分由与包覆层同时沉积的电镀材料形成。 为了促进细长部分的形成，在弹簧指状物下方设置有胶结层以促进电镀，或者基板表面被预处理以便于化学镀。