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232 条记录 (耗时 0.036 秒)

    Directly connected heat exchanger tube section and coolant-cooled structure
    3.
    发明授权
    Directly connected heat exchanger tube section and coolant-cooled structure 有权
    直接连接热交换器管段和冷却剂冷却结构

    公开(公告)号：US08687364B2

    公开(公告)日：2014-04-01

    申请号：US13283933

    申请日：2011-10-28

    申请人： Timothy J. Chainer ,  Patrick A. Coico ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

    发明人： Timothy J. Chainer ,  Patrick A. Coico ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Roger R. Schmidt ,  Mark E. Steinke

    IPC分类号： H05K7/20

    CPC分类号： B23P15/26 ,  H05K7/20781 ,  H05K7/20827 ,  Y10T29/4935 ,  Y10T29/49826

    摘要： A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

    摘要翻译： 提供了一种用于电子机架的冷却装置，其包括空气 - 液体热交换器，一个或多个冷却剂冷却结构和管。 与电子机架相关联并设置成冷却通过齿条的空气的热交换器包括多个不同的冷却剂承载管部分，每个管部分具有冷却剂入口和冷却剂出口，其中一个耦合 与冷却剂回路流体连通以便于冷却剂流过管段。 冷却剂冷却结构与机架的电子部件热接触，并且有助于将热量从部件传递到冷却剂。 该管连接流体连通一个冷却剂冷却结构和一个管部分的冷却剂入口或出口中的另一个，并且促使冷却剂直接在热交换器的冷却剂承载管部分和冷却剂冷却结构之间流动。

    Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)
    7.
    发明授权
    Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) 有权
    将电子卡耦合到冷却剂冷却结构的热转印结构

    公开(公告)号：US08913384B2

    公开(公告)日：2014-12-16

    申请号：US13527947

    申请日：2012-06-20

    申请人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

    发明人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

    IPC分类号： H05K7/20 ,  H05K13/00

    CPC分类号： H05K7/20745 ,  H05K7/2079 ,  H05K13/00

    摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.

    摘要翻译： 提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。 冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面 卡到散热器的第一表面，使电子卡在电子系统的插座内对接。 在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。

    Cooling unit for container-type data center
    8.
    发明授权
    Cooling unit for container-type data center 有权
    集装箱式数据中心冷却装置

    公开(公告)号：US09179574B2

    公开(公告)日：2015-11-03

    申请号：US13114203

    申请日：2011-05-24

    申请人： Brian A. Canney ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Roger R. Schmidt

    发明人： Brian A. Canney ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Roger R. Schmidt

    IPC分类号： H05K7/14 ,  H05K7/20 ,  F25B25/00 ,  F25D11/00 ,  F25D17/02

    CPC分类号： H05K7/1497 ,  F25B25/005 ,  F25B2700/2106 ,  F25B2700/21173 ,  F25D11/003 ,  F25D17/02 ,  H05K7/2079 ,  Y10T29/49359

    摘要： A cooling unit and cooling method are provided for a container-type data center. The cooling unit includes a heat rejection unit, for rejecting heat from coolant passing through a coolant loop to air passing across the heat rejection unit, and a refrigeration unit controllable to selectively provide auxiliary cooling to at least a portion of the coolant passing through the coolant loop. The heat rejection unit includes a heat exchange assembly, having a first heat exchanger and a second heat exchanger, and one or more air-moving devices providing airflow across the first and second heat exchangers. The first heat exchanger couples in fluid communication with the coolant loop, and the second heat exchanger is coupled in fluid communication with a refrigeration loop of the refrigeration unit for rejecting heat from refrigerant passing through the refrigeration loop to the airflow passing across the second heat exchanger.

    摘要翻译： 为集装箱式数据中心提供冷却装置和冷却方法。 冷却单元包括排热单元，用于将来自通过冷却剂回路的冷却剂的热量排除通过散热单元的空气;以及制冷单元，其可控制以选择性地向通过冷却剂的冷却剂的至少一部分提供辅助冷却 循环。 散热单元包括具有第一热交换器和第二热交换器的热交换组件，以及提供横跨第一和第二热交换器的气流的一个或多个气动装置。 所述第一热交换器与所述冷却剂回路流体连通，并且所述第二热交换器与所述制冷单元的制冷回路流体连通地联接，用于将通过所述制冷回路的制冷剂的热量排出到穿过所述第二热交换器的气流 。

    Apparatus and method for facilitating cooling of an electronics system
    9.
    发明授权
    Apparatus and method for facilitating cooling of an electronics system 有权
    用于促进电子系统的冷却的装置和方法

    公开(公告)号：US07660109B2

    公开(公告)日：2010-02-09

    申请号：US11957619

    申请日：2007-12-17

    申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Jason A. Matteson ,  Roger R. Schmidt ,  Mark E. Steinke

    发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Jason A. Matteson ,  Roger R. Schmidt ,  Mark E. Steinke

    IPC分类号： H05K7/20 ,  F25D23/12

    CPC分类号： H05K7/20754 ,  F25D17/06 ,  F25D2317/0655 ,  F25D2317/0661 ,  Y10T29/49826

    摘要： Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.

    摘要翻译： 提供了用于促进采用蒸气压缩热交换系统的电子系统以及前后盖的空气冷却的装置和方法。 热交换系统的蒸发器壳体安装到电子系统的系统壳体，并且至少部分地延伸到系统壳体的空气入口侧和出口侧之间。 蒸发器壳体包括空气入口和出口以及蒸发器。 前盖与空气入口侧或空气出口开口相邻地安装在系统或蒸发器壳体上，后盖与空气出口侧或进气口相邻地安装在系统或蒸发器壳体上。 系统壳体，后盖，蒸发器壳体和前盖一起限定通过系统壳体和蒸发器壳体的闭环气流路径，其中蒸气压缩热交换系统冷却空气循环通过。

    Liquid coolant conduit secured in an unused socket for memory module cooling
    10.
    发明授权
    Liquid coolant conduit secured in an unused socket for memory module cooling 有权
    液体冷却剂导管固定在未使用的插座中，用于内存模块冷却

    公开(公告)号：US08385069B2

    公开(公告)日：2013-02-26

    申请号：US12785779

    申请日：2010-05-24

    申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  Mark E. Steinke ,  Aparna Vallury

    发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Howard V. Mahaney, Jr. ,  Mark E. Steinke ,  Aparna Vallury

    IPC分类号： H05K7/20

    CPC分类号： G06F1/20 ,  G06F2200/201

    摘要： An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.

    摘要翻译： 用于冷却安装在计算机系统中的存储器模块的装置包括液体冷却剂导管，该液体冷却剂导管连接到导管支撑结构，导管支撑结构具有选择性地固定在计算机系统的第一预配置存储器模块插槽内的形状因子，以便定位液体冷却剂导管 在第一个插槽之上。 热管提供液体导管与散热器组件之间的直接热接触，与存储器模块的表面直接热接触。 该装置可以包括用于类似地冷却第二存储器模块的第二热管和第二散热器组件。 在替代配置中，设备可以冷却导管的相对侧上的存储器模块或存储器模块，这些存储器模块都在导管的同一侧。