公开(公告)号：US5413821A

公开(公告)日：1995-05-09

申请号：US273978

申请日：1994-07-12

申请人： Timothy W. Ellis ,  Thomas A. Lograsso ,  Mark A. Eshelman

发明人： Timothy W. Ellis ,  Thomas A. Lograsso ,  Mark A. Eshelman

IPC分类号： C23C4/08 ,  C23C4/10 ,  C23C16/18 ,  C23C16/513 ,  B05D3/06

CPC分类号： C23C16/513 ,  C23C16/18

摘要： A method of applying a Cr-bearing layer to a substrate, comprises introducing an organometallic compound, in vapor or solid powder form entrained in a carrier gas to a plasma of an inductively coupled plasma torch or device to thermally decompose the organometallic compound and contacting the plasma and the substrate to be coated so as to deposit the Cr-bearing layer on the substrate. A metallic Cr, Cr alloy or Cr compound such as chromium oxide, nitride and carbide can be provided on the substrate. Typically, the organometallic compound is introduced to an inductively coupled plasma torch that is disposed in ambient air so to thermally decompose the organometallic compound in the plasma. The plasma is directed at the substrate to deposit the Cr-bearing layer or coating on the substrate.

摘要翻译： 将含Cr载体层施加到基底的方法包括将夹带在载气中的蒸气或固体粉末的有机金属化合物引入感应耦合等离子体焰炬或装置的等离子体，以热分解有机金属化合物并使 等离子体和待涂覆的基底，以便将Cr承载层沉积在基底上。 可以在基板上设置金属Cr，Cr合金或Cr化合物，例如氧化铬，氮化物和碳化物。 通常，将有机金属化合物引入到设置在环境空气中的电感耦合等离子体焰炬中，以使等离子体中的有机金属化合物热分解。 等离子体被引导到衬底上以将Cr承载层或涂层沉积在衬底上。

公开(公告)号：US06534877B2

公开(公告)日：2003-03-18

申请号：US10051482

申请日：2002-01-18

申请人： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman

发明人： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman

IPC分类号： H01L2348

CPC分类号： H05K3/282 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/85 ,  H01L2224/0382 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48647 ,  H01L2224/48844 ,  H01L2224/85075 ,  H01L2224/85375 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  Y10S438/976 ,  H01L2224/48 ,  H01L2924/00015

摘要： Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible during ball or wedge wire bonding to obtain metal-to-metal contact between the bonding surfaces and the wires bonded thereto. Coated semiconductor wafers are also disclosed.

公开(公告)号：US06885104B2

公开(公告)日：2005-04-26

申请号：US10153451

申请日：2002-05-22

申请人： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

发明人： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/28 ,  H01L29/40 ,  H01L21/94 ,  B23K20/12 ,  B23K31/02 ,  B23K1/00

CPC分类号： H05K3/282 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754

摘要： Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.

公开(公告)号：US06413576B1

公开(公告)日：2002-07-02

申请号：US09412542

申请日：1999-10-05

申请人： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

发明人： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

IPC分类号： B05D512

CPC分类号： H05K3/282 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754

摘要： Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces. Coated electronic packages including semiconductor wafers are also disclosed.

摘要翻译： 用于保护铜电路的未绝缘部分的表面的方法免受不利于将表面连接到另一金属表面的环境污染物，所述方法包括用具有适于焊接的厚度的陶瓷材料层涂覆表面的步骤 没有助熔剂，并且当表面被接合以获得表面之间的金属对金属接触时，它是足够脆的。 还公开了包括半导体晶片的涂覆电子封装。

公开(公告)号：US07199475B2

公开(公告)日：2007-04-03

申请号：US11084985

申请日：2005-03-21

申请人： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

发明人： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman ,  Christian Rheault

IPC分类号： H01L23/52

CPC分类号： H05K3/282 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754

摘要： Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.

摘要翻译： 具有非绝缘部分的铜电路的电子封装件被涂覆层保护，其涂层厚度适于焊接而不进行焊接，并且当与另一金属表面接合以在表面之间获得金属对金属接触时足够脆弱。

公开(公告)号：US06352743B1

公开(公告)日：2002-03-05

申请号：US09330906

申请日：1999-06-11

申请人： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman

发明人： Timothy W. Ellis ,  Nikhil Murdeshwar ,  Mark A. Eshelman

IPC分类号： B05D512

CPC分类号： H05K3/282 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/85 ,  H01L2224/0382 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48647 ,  H01L2224/48844 ,  H01L2224/85075 ,  H01L2224/85375 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  Y10S438/976 ,  H01L2224/48 ,  H01L2924/00015

摘要： Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible during ball or wedge wire bonding to obtain metal-to-metal contact between the bonding surfaces and the wires bonded thereto. Coated semiconductor wafers are also disclosed.

摘要翻译： 通过涂覆具有适合焊接的厚度的陶瓷材料的层而不会熔化并且在球中足够脆弱的陶瓷材料层，从而防止大气污染物或从铜半导体接合焊盘的接合表面除去大气污染物的方法 或楔形线接合，以在接合表面和与其接合的线之间获得金属对金属的接触。 还公开了涂覆的半导体晶片。

公开(公告)号：US06724784B2

公开(公告)日：2004-04-20

申请号：US10123671

申请日：2002-04-15

申请人： Ling Cheng ,  Kaushal Verma ,  Mark Meyers ,  Mark A. Eshelman ,  Richard B. Bylsma

发明人： Ling Cheng ,  Kaushal Verma ,  Mark Meyers ,  Mark A. Eshelman ,  Richard B. Bylsma

IPC分类号： H01S3098

CPC分类号： G02B6/4246 ,  G02B6/29358 ,  G02B6/29395 ,  G02B6/4201 ,  G02B6/4208 ,  G02B6/4215 ,  G02B6/4272 ,  H01S5/02248 ,  H01S5/0687

摘要： The present invention provides an optical filter module. In one embodiment, the wavelength locker module includes an optical interferometer or filter, such as an etalon. In addition, the wavelength locker module also includes an electrically nonconductive material having a high thermal conductivity substantially surrounding the etalon.

摘要翻译： 本发明提供了一种滤光器模块。 在一个实施例中，波长锁定器模块包括诸如标准具的光学干涉仪或滤波器。 此外，波长锁定器模块还包括具有基本上围绕标准具的高热导率的非导电材料。