公开(公告)号：US20180233384A1

公开(公告)日：2018-08-16

申请号：US15895106

申请日：2018-02-13

Applicant: Tokyo Electron Limited

Inventor： Takashi Nagai ,  Hideaki Sato ,  Junichi Kitano ,  Kenji Goto

IPC: H01L21/67

CPC classification number: H01L21/67086 ,  H01L21/31111 ,  H01L21/67017 ,  H01L21/67034 ,  H01L21/67057 ,  H01L21/67173 ,  H01L21/67207 ,  H01L21/67248 ,  H01L21/67253

Abstract: A substrate liquid processing apparatus includes a processing tub 34 which is configured to store therein a processing liquid and in which a processing of a substrate is performed by immersing the substrate in the stored processing liquid; a circulation line 50 connected to the processing tub; a pump 51 provided at the circulation line and configured to generate a flow of the processing liquid flowing out from the processing tub and returning back to the processing tub after passing through the circulation line; and a heater 52 provided at the circulation line and configured to heat the processing liquid. At least two temperature sensors 81 to 83 are provided at different positions within a circulation system including the processing tub and the circulation line. Controllers 90 and 100 control a heat generation amount of the heater based on detection temperatures of the at least two temperature sensors.

公开(公告)号：US10026629B2

公开(公告)日：2018-07-17

申请号：US14880462

申请日：2015-10-12

Applicant: Tokyo Electron Limited

Inventor： Mitsunori Nakamori ,  Junichi Kitano ,  Teruomi Minami

IPC: H01L21/02 ,  H01L21/67 ,  B08B3/08

Abstract: Disclosed is a substrate liquid processing apparatus. The apparatus includes: a pure water supply unit (a rinse liquid supply unit) configured to supply pure water to a substrate; and a drying liquid supply unit configured to supply a drying liquid having a higher volatility than the pure water to the substrate. The substrate liquid processing apparatus is used to supply the drying liquid having the higher volatility, of which a part contains a silicon-based organic compound, to the substrate, from the drying liquid supply unit.

公开(公告)号：US11410861B2

公开(公告)日：2022-08-09

申请号：US15895106

申请日：2018-02-13

Applicant: Tokyo Electron Limited

Inventor： Takashi Nagai ,  Hideaki Sato ,  Junichi Kitano ,  Kenji Goto

IPC: H01L21/67 ,  H01L21/311

Abstract: A substrate liquid processing apparatus includes a processing tub 34 which is configured to store therein a processing liquid and in which a processing of a substrate is performed by immersing the substrate in the stored processing liquid; a circulation line 50 connected to the processing tub; a pump 51 provided at the circulation line and configured to generate a flow of the processing liquid flowing out from the processing tub and returning back to the processing tub after passing through the circulation line; and a heater 52 provided at the circulation line and configured to heat the processing liquid. At least two temperature sensors 81 to 83 are provided at different positions within a circulation system including the processing tub and the circulation line. Controllers 90 and 100 control a heat generation amount of the heater based on detection temperatures of the at least two temperature sensors.

公开(公告)号：US20160111303A1

公开(公告)日：2016-04-21

申请号：US14880462

申请日：2015-10-12

Applicant: Tokyo Electron Limited

Inventor： Mitsunori Nakamori ,  Junichi Kitano ,  Teruomi Minami

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/08

CPC classification number: H01L21/67051 ,  B08B3/08 ,  H01L21/02057 ,  H01L21/67028

Abstract: Disclosed is a substrate liquid processing apparatus. The apparatus includes: a pure water supply unit (a rinse liquid supply unit) configured to supply pure water to a substrate; and a drying liquid supply unit configured to supply a drying liquid having a higher volatility than the pure water to the substrate. The substrate liquid processing apparatus is used to supply the drying liquid having the higher volatility, of which a part contains a silicon-based organic compound, to the substrate, from the drying liquid supply unit.

Abstract translation: 公开了一种基板液体处理装置。 该装置包括：净水供给单元（冲洗液供给单元），其构造成向基板供给纯水; 以及干燥液供给单元，其构造成向所述基板供给比所述纯水高的挥发性的干燥液。 基板液体处理装置用于从干燥液体供应单元向基板供应具有较高挥发性的干燥液体，其中部分含有硅基有机化合物。

公开(公告)号：US11430675B2

公开(公告)日：2022-08-30

申请号：US16438580

申请日：2019-06-12

Applicant: Tokyo Electron Limited

Inventor： Hideaki Sato ,  Junichi Kitano ,  Kouzou Kanagawa

IPC: H01L21/67

Abstract: A substrate processing apparatus includes a processing tank, a reservoir, a remover, a mixer, and a return path. Etching is performed on a substrate in the processing tank by immersing the substrate in a processing liquid containing a chemical liquid and silicon. The reservoir recovers and stores the processing liquid discharged from the processing tank. The remover recovers a portion of the processing liquid discharged from the processing tank, and removes silicon from the recovered processing liquid. The mixer mixes the processing liquid stored in the reservoir with the processing liquid from which silicon has been removed by the remover. The processing liquid mixed by the mixer is returned to the processing tank through a return path.

公开(公告)号：US20190385869A1

公开(公告)日：2019-12-19

申请号：US16438580

申请日：2019-06-12

Applicant: Tokyo Electron Limited

Inventor： Hideaki Sato ,  Junichi Kitano ,  Kouzou Kanagawa

IPC: H01L21/67

Abstract: A substrate processing apparatus includes a processing tank, a reservoir, a remover, a mixer, and a return path. Etching is performed on a substrate in the processing tank by immersing the substrate in a processing liquid containing a chemical liquid and silicon. The reservoir recovers and stores the processing liquid discharged from the processing tank. The remover recovers a portion of the processing liquid discharged from the processing tank, and removes silicon from the recovered processing liquid. The mixer mixes the processing liquid stored in the reservoir with the processing liquid from which silicon has been removed by the remover. The processing liquid mixed by the mixer is returned to the processing tank through a return path.