公开(公告)号：US08815019B2

公开(公告)日：2014-08-26

申请号：US12993401

申请日：2010-02-12

申请人： Tomohiro Uno ,  Shinichi Terashima ,  Takashi Yamada ,  Ryo Oishi ,  Daizo Oda

发明人： Tomohiro Uno ,  Shinichi Terashima ,  Takashi Yamada ,  Ryo Oishi ,  Daizo Oda

IPC分类号： B23K35/34

CPC分类号： C22C5/02 ,  B32B15/018 ,  C22C5/04 ,  C22C5/06 ,  C22C9/00 ,  C22C21/02 ,  C22C21/12 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48011 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85186 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/3025 ,  Y10T428/12222 ,  H01L2924/01001 ,  H01L2924/00014 ,  H01L2924/20754 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/01202 ,  H01L2924/01007 ,  H01L2924/01205 ,  H01L2224/45639 ,  H01L2224/45669 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45671 ,  H01L2224/45666 ,  H01L2924/20656 ,  H01L2924/20652 ,  H01L2924/20645 ,  H01L2924/20654 ,  H01L2924/20655 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2224/48824 ,  H01L2924/013 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/00013 ,  H01L2924/01049 ,  H01L2924/01006

摘要： It is an object of the present invention to provide a multilayer wire which can accomplish both ball bonding property and wire workability simultaneously, and which enhances a loop stability, a pull strength, and a wedge bonding property. A semiconductor bonding wire comprises a core member mainly composed of equal to or greater than one kind of following elements: Cu, Au, and Ag, and an outer layer formed on the core member and mainly composed of Pd. A total hydrogen concentration contained in a whole wire is within a range from 0.0001 to 0.008 mass %.

摘要翻译： 本发明的目的是提供一种能够同时实现滚珠接合性能和线加工性的多层线材，并且提高了环路稳定性，拉伸强度和楔形粘合性能。 半导体接合线包括主要由等于或大于一种以下元素构成的芯部件：Cu，Au和Ag，以及形成在芯部件上并主要由Pd构成的外层。 总线中含有的总氢浓度在0.0001〜0.008质量％的范围内。

公开(公告)号：US20110120594A1

公开(公告)日：2011-05-26

申请号：US12993401

申请日：2010-02-12

申请人： Tomohiro Uno ,  Shinichi Terashima ,  Takashi Yamada ,  Ryo Oishi ,  Daizo Oda

发明人： Tomohiro Uno ,  Shinichi Terashima ,  Takashi Yamada ,  Ryo Oishi ,  Daizo Oda

IPC分类号： B23K35/12 ,  B23K35/24

CPC分类号： C22C5/02 ,  B32B15/018 ,  C22C5/04 ,  C22C5/06 ,  C22C9/00 ,  C22C21/02 ,  C22C21/12 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48011 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85186 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/3025 ,  Y10T428/12222 ,  H01L2924/01001 ,  H01L2924/00014 ,  H01L2924/20754 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/01202 ,  H01L2924/01007 ,  H01L2924/01205 ,  H01L2224/45639 ,  H01L2224/45669 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45671 ,  H01L2224/45666 ,  H01L2924/20656 ,  H01L2924/20652 ,  H01L2924/20645 ,  H01L2924/20654 ,  H01L2924/20655 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2224/48824 ,  H01L2924/013 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/00013 ,  H01L2924/01049 ,  H01L2924/01006

摘要： It is an object of the present invention to provide a multilayer wire which can accomplish both ball bonding property and wire workability simultaneously, and which enhances a loop stability, a pull strength, and a wedge bonding property. A semiconductor bonding wire comprises a core member mainly composed of equal to or greater than one kind of following elements: Cu, Au, and Ag, and an outer layer formed on the core member and mainly composed of Pd. A total hydrogen concentration contained in a whole wire is within a range from 0.0001 to 0.008 mass %.

摘要翻译： 本发明的目的是提供一种能够同时实现滚珠接合性能和线加工性的多层线材，并且提高了环路稳定性，拉伸强度和楔形粘合性能。 半导体接合线包括主要由等于或大于一种以下元素构成的芯部件：Cu，Au和Ag，以及形成在芯部件上并主要由Pd构成的外层。 总线中含有的总氢浓度在0.0001〜0.008质量％的范围内。

公开(公告)号：US06241942B1

公开(公告)日：2001-06-05

申请号：US09050078

申请日：1998-03-30

申请人： Toshikazu Murata ,  Hiroji Noguchi ,  Sadao Kishida ,  Toshihiko Taguchi ,  Shozo Asano ,  Ryo Oishi ,  Takashi Hori

发明人： Toshikazu Murata ,  Hiroji Noguchi ,  Sadao Kishida ,  Toshihiko Taguchi ,  Shozo Asano ,  Ryo Oishi ,  Takashi Hori

IPC分类号： C22C1302

CPC分类号： B23K35/262

摘要： A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu; optionally at least one of from 0.2 to 6 wt % of Bi, from 0.5 to 3 wt % of In, and from 0.001 to 1 wt % of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt % of Zn; from 10 to 30 wt % of Bi; from 0.05 to 2 wt % of Ag; optionally from 0.001 to 1 wt % of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.

摘要翻译： 具有相对低的熔融温度并适合用于焊接电子器件的无铅焊料合金基本上由以下组成：7至10重量％的Zn; 0.01〜1重量％的Ni，0.1〜3.5重量％的Ag和0.1〜3重量％的Cu中的至少1种; 可选地，0.2至6重量％的Bi，0.5至3重量％的In和0.001至1重量％的P中的至少一个; 和Sn的平衡。 另一种这样的无铅焊料合金主要由以下组成：2至10重量％的Zn; Bi的10〜30重量％ 0.05〜2重量％的Ag; 任选地0.001至1重量％的P，余量为Sn。 这些焊料合金具有至少5kgf / mm 2的拉伸强度和至少10％的伸长率。

公开(公告)号：USD661262S1

公开(公告)日：2012-06-05

申请号：US29360431

申请日：2010-04-26

申请人： Takayuki Igarashi ,  Ryo Oishi ,  Toshimasa Takao ,  Tetsuya Yagi

设计人： Takayuki Igarashi ,  Ryo Oishi ,  Toshimasa Takao ,  Tetsuya Yagi

CPC分类号： H01L33/56 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：US06488888B2

公开(公告)日：2002-12-03

申请号：US09828164

申请日：2001-04-09

申请人： Toshikazu Murata ,  Hiroji Noguchi ,  Sadao Kishida ,  Toshihiko Taguchi ,  Shozo Asano ,  Ryo Oishi ,  Takashi Hori

发明人： Toshikazu Murata ,  Hiroji Noguchi ,  Sadao Kishida ,  Toshihiko Taguchi ,  Shozo Asano ,  Ryo Oishi ,  Takashi Hori

IPC分类号： C22C1302

CPC分类号： B23K35/262

摘要： A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu; optionally at least one of from 0.2 to 6 wt % of Bi, from 0.5 to 3 wt % of In, and from 0.001 to 1 wt % of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt % of Zn; from 10 to 30 wt % of Bi; from 0.05 to 2 wt % of Ag; optionally from 0.001 to 1 wt % of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.

摘要翻译： 具有相对低的熔融温度并适合用于焊接电子器件的无铅焊料合金基本上由以下组成：7至10重量％的Zn; 0.01〜1重量％的Ni，0.1〜3.5重量％的Ag和0.1〜3重量％的Cu中的至少1种; 可选地，0.2至6重量％的Bi，0.5至3重量％的In和0.001至1重量％的P中的至少一个; 和Sn的平衡。 另一种这样的无铅焊料合金主要由以下组成：2至10重量％的Zn; Bi的10〜30重量％ 0.05〜2重量％的Ag; 任选地0.001至1重量％的P，余量为Sn。 这些焊料合金具有至少5kgf / mm 2的拉伸强度和至少10％的伸长率。